「均磨」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

多数の被研磨物を個体差に寄らず均一に研磨できると共に、被研磨物を精密に研磨できるバレル研磨装置を提供することにある。例文帳に追加

To provide a barrel polishing device precisely polishing polishing objects, by uniformly polishing a large number of polishing objects regardless of an individual difference. - 特許庁

研磨面に溝が形成された研磨パッドを用いた場合でも均一にワークの被研磨面が研磨される研磨方法を提供する。例文帳に追加

To provide a polishing method capable of evenly polishing a face to be polished of a work even when using a polishing pad with a groove formed in a polishing face. - 特許庁

被研磨板１の研磨面の周辺領域で小さくなる研磨速度を大きくし、研磨面の研磨速度の面内均一性を向上する。例文帳に追加

To improve uniformity of polishing speed in the surface of a plate 1 to be polished by increasing the polishing speed which decreases in the peripheral region of the surface. - 特許庁

均一性の高い研磨および高速研磨を可能とする研磨装置を提供する。例文帳に追加

To provide a polishing apparatus which can perform a highly uniform polishing operation and a high speed polishing operation. - 特許庁

高い研磨均一度を有するウェーハ研磨装置及びウェーハ研磨方法を提供する。例文帳に追加

To provide a wafer-polishing apparatus having a high degree of uniformity of polishing, and to provide a wafer-polishing method. - 特許庁

優れた研磨レートの面内均一性が得られる研磨装置及び研磨方法を提供する。例文帳に追加

To provide a polishing apparatus and method which can obtain an in-plane uniformity with an excellent polishing rate. - 特許庁

被研磨対象物の被研磨面における研磨中の圧力分布を均一化し、被研磨面全面において均一に研磨可能な研磨装置および研磨方法を提供する。例文帳に追加

To provide a polishing device and a polishing method for making uniform distribution of pressure in the process of polishing on the surface to be polished of an object to be polished so that the whole surface of the surface to be polished can be uniformly polished. - 特許庁

研磨液を被研磨材の被研磨面に供給して研磨材により研磨を行う研磨装置であって、被研磨面の研磨液の分布を均一にする送風手段７（送風口）を設ける。例文帳に追加

In this polishing device to polish by a polishing material by feeding the polishing liquid to the polished surface of the polished material, an air blasting means 7 (a blower tube) to make the distribution of the polishing liquid on the polished surface even, is provided. - 特許庁

被研磨面の研磨痕を抑制し、且つ、被研磨面全体に亘り研磨量を均一化することができる研磨布、並びに、該研磨布を用いたウェーハの片面研磨方法および片面研磨装置の提供。例文帳に追加

To provide an abrasive cloth suppressing a polishing trace on a polished surface and equalizing the amount of polishing over the entire polished surface; and method and device for polishing a single side of a wafer by using the abrasive cloth. - 特許庁

被研磨物と接触させて、被研磨物を研磨する研磨層２１を有し、その研磨層２１は領域ごとに密度が異なる研磨パッド１を用いることによって、被研磨物全面において研磨レートを均一にすることができる。例文帳に追加

It is possible to polish the overall surface of a grinding article uniformly at a polishing rate by using the polishing pad 1 having a polishing layer 21 to polish the polishing article by making it contact with the polishing article and density of which is different in each region. - 特許庁

靴踵の左右の磨り減り具合を均一にする靴例文帳に追加

SHOES FOR UNIFORMING ABRASION OF RIGHT AND LEFT SHOE HEELS - 特許庁

研磨加工時にスラリの分散状態が均一化される。例文帳に追加

The dispersed state of slurry is unified during the polishing. - 特許庁

長尺なワークの研磨を短時間で均一に行なう。例文帳に追加

To polish a long stretching work uniformly in a short time. - 特許庁

パチンコ玉の表面を均等に研磨可能とする。例文帳に追加

To provide an upward feeding type polishing machine capable of uniformly polishing the surfaces of pachinko game balls. - 特許庁

ＣＭＰで発生する、不均一研磨を防止する。例文帳に追加

To prevent the uneven polishing generated in CMP. - 特許庁

研磨パッドの研磨面が平坦でなくても、ドレッサーが研磨パッドの研磨面を均一に押圧できるようにする。例文帳に追加

To uniformly press the polishing surface of a polishing pad by a dresser even when the polishing surface of the polishing pad is not flat. - 特許庁

ウェハを研磨する際に、高研磨速度でウェハ面内での均一性の高い研磨が可能な化学的機械的研磨方法を提供する。例文帳に追加

To provide a chemical mechanical polishing method which can perform polishing with high uniformity in the wafer plan at a high polishing speed when the wafer is polished. - 特許庁

被研磨される球体が表面均等に研磨され、高い精度で表面を研磨できるボール研磨装置を可能にすること。例文帳に追加

To provide a ball polishing device capable of polishing a spherical body uniformly on its surface and polishing the surface in high precision. - 特許庁

研磨液を研磨対象物の被研磨面に均一かつ効率的に供給することができる研磨装置を提供する。例文帳に追加

To provide a polishing apparatus which can supply a polishing solution uniformly and sufficiently to a surface to be polished of a polishing object. - 特許庁

研磨対象面を上向き姿勢で研磨加工する研磨装置において、パッドスクレーピングの発生を抑止し研磨レートの不均一性を改善する。例文帳に追加

To improve unevenness of a polishing rate by restraining generation of pad scraping in a polishing device for polishing a polishing target surface at an upward posture. - 特許庁

高い研磨力で、研磨対象物の表面全体を均一に研磨できる研磨装置及び方法を提供することである。例文帳に追加

To provide a polishing device and a polishing method evenly polishing the whole of a surface of an object to be polished with the high polishing force. - 特許庁

被研磨物を研磨パッドに押圧して研磨する際に、メンブレンの膨張を最小限に抑え、研磨の面内均一性を向上させること。例文帳に追加

To suppress expansion of a membrane to the minimum extent and improve uniformity in a plane of polishing when pressing an object to be polished against a polishing pad and polishing it. - 特許庁

被研磨基板に対する研磨の面内均一性を向上させた研磨方法および研磨装置を提供する。例文帳に追加

To provide a polishing method and device of improving polishing in-plane uniformity in relation to a substrate to be polished. - 特許庁

研磨液の使用効率を向上させ、さらに半導体ウエハを均一かつ良好に研磨することができる研磨装置および研磨方法を提供する。例文帳に追加

To provide a poliching device and a method capable of improving the application efficiency of a polishing solution and uniformly and effectively polishing a semiconductor wafer. - 特許庁

被研磨材や保持フィルムの厚みバラツキを吸収して面内均一な研磨を行うことが可能な研磨ヘッド及び研磨装置を提供する。例文帳に追加

To provide a grinding head and a grinding apparatus which can achieve the in-plane uniform grinding by absorbing the dispersion in thickness of a work and a holding film. - 特許庁

研磨速度を増大させて研磨の均一性を向上させる温度制御研磨ヘッドを有する化学機械研磨システムを提供する。例文帳に追加

To provide a chemical-mechanical polishing system with a temperature-controlled polishing head increasing a polishing speed to improve polishing uniformity. - 特許庁

被研磨物を全面に亘って均一に研磨することができると共に、研磨装置を安価に製作することができる研磨装置を提供する。例文帳に追加

To provide a polishing device capable of uniformly polishing a polished article all over its surface and to manufacture at low cost. - 特許庁

研磨速度が高く、且つ面内均一性に優れた被研磨面を与える化学機械研磨用研磨パッドを提供する。例文帳に追加

To provide a polishing pad for chemicomechanical polishing which is high in polishing speed provides a polished surface excellent in surface uniformity. - 特許庁

何れかの被研磨物の研磨部との相対距離にずれがあっても、全ての被研磨物を均等に研磨すること。例文帳に追加

To polish all workpieces evenly even if a relative distance of any workpiece to a polishing part has a deviation. - 特許庁

被研磨面と研磨パッドとの間に研磨スラリーが適切に保持されて、研磨スラリーの余分な消費がなく、被研磨面内での研磨レートを均一にできるＣＭＰ用研磨パッドを提供すること。例文帳に追加

To provide a polishing pad for a CMP in which polishing slurry is held suitably between a surface to be polished and the polishing pad, and which can obtain a polishing rate in the surface to be polished uniformly without the excess consumption of the polishing slurry. - 特許庁

被研磨材の被研磨面内における研磨量の均一化を図ることができる研磨布、この研磨布が取り付けられた研磨装置およびこの研磨装置を利用した半導体装置の製造方法を提供する。例文帳に追加

To provide a polishing cloth unify the polishing quantity within a surface to be polished of a work to be polished, a polishing device mounted with the polishing cloth thereon, and a manufacturing method of a semiconductor device making use of the polishing device. - 特許庁

本発明は、研磨速度が高く、被研磨面の平坦性（被研磨面における研磨量の面内均一性）に優れ、かつ、スクラッチの少ない化学機械研磨パッドおよび該研磨パッドを用いた化学機械研磨方法を提供する。例文帳に追加

To provide a chemical mechanical polishing pad which enables a fast polishing speed and superior flatness (in-surface uniformity in polishing amount of a surface to be polished) of the surface to be polished, and makes less scratches. - 特許庁

研磨速度、被研磨面のスクラッチおよび被研磨面の面内均一性に優れ、多数の被研磨体を連続研磨する場合でも安定した研磨速度を示す利点を有する化学機械研磨パッドを提供する。例文帳に追加

To provide a chemical mechanical polishing pad excellent in polishing speed, scratches of a surface to be polished, and in-plane uniformity of a surface to be polished, and exhibiting stabilized polishing speed even when continuously polishing a number of bodies to be polished. - 特許庁

被加工物の研磨面への研磨剤の均一で安定した供給を行うことができ、研磨剤の外部への飛散を減少でき、研磨熱量の発生を抑えることができ、被加工物の研磨面を均一且つ平坦に研磨できる研磨方法及び研磨装置を提供する。例文帳に追加

To provide a polishing method and device for uniformly and stably supplying abrasive to the polished surface of a workpiece, reducing the splash of the abrasive to outside, suppressing the occurrence of polishing heat quantity, and uniformly and flatly polishing the polished surface of the workpiece. - 特許庁

被研磨物の研磨に用いられる研磨パッドにおいて、研磨に用いられる研磨スラリー中の砥粒の研磨後の平均粒径を研磨前の平均粒径の１．５倍以下に調整可能で、かつ表面Ｄ硬度が６５度以上であることを特徴とする研磨パッド。例文帳に追加

This polishing pad, which is used to polish an object, is characterized in that the average grain size, after polishing, of the abrasive grains in the abrasive slurry used for the polishing can be adjusted to 1.5 times the average grain size or smaller before polishing and the surface D hardness is 65 degrees or higher. - 特許庁

結果、研磨時のウェーハＷの研磨面内の温度が均一化し、研磨面内の研磨レートが均一となり、ウェーハＷの研磨面の平坦度が高まる。例文帳に追加

Consequently, the temperature becomes uniform in the polishing surface of the wafer W at the time of polishing, the polishing rate is made uniform in the polishing surface and the flatness of the polished surface of the wafer W is enhanced. - 特許庁

研磨時の半導体ウェーハの研磨面内の温度を均一化し、この研磨面内の研磨レートを一定化して、高平坦度ウェーハを得る半導体ウェーハの研磨温度均一化制御方法およびその装置を提供する。例文帳に追加

To provide a method and equipment for controlling the polishing temperature of a semiconductor wafer uniformly in which a high flatness wafer can be obtained by making the temperature uniform in the polishing surface of a semiconductor wafer at the time of polishing and making the polishing rate uniform in the polishing surface. - 特許庁

研磨対象物の被研磨面への薬液の均一な供給と研磨対象物の面内における研磨速度の均一性を両立することができる研磨装置を提供する。例文帳に追加

To provide a polishing device capable of compatibly establishing uniform supply of chemical liquid to a surface to be polished of a polishing object and uniformity of polishing speed within the surface of the polishing object. - 特許庁

被研磨物の後面に加わる圧力をウエハーの全体面にわたって均等に作用させ被研磨物の研磨厚さを均一にする研磨装置及び研磨方法を提供する。例文帳に追加

To provide a polishing device for evenly allowing the pressure applied on the back surface of a polishing article to act over the entire surface of a wafer, thereby making polishing thickness of the polishing article even. - 特許庁

研磨対象物の被研磨面への薬液の均一な供給と研磨対象物の面内における研磨速度の均一性を両立することができる研磨装置を提供する。例文帳に追加

To provide a polishing apparatus for coping with both of the uniform supply of a medicinal solution to a surface to be polished in a target to be polished and uniformity in a polishing speed within the surface of the target to be polished. - 特許庁

小型で簡便でありつつ、均一な研磨を行えるステント研磨装置を提供する。例文帳に追加

To provide a stent polishing device downsized, convenient and capable of uniformly polishing. - 特許庁

パチンコ玉の全周を均一に研磨することができる玉研磨レールを提供する。例文帳に追加

To provide a ball polishing rail which enables polishing of pachinko balls evenly on the overall circumference thereof. - 特許庁

研磨工具の姿勢変化等を防ぎ、均一な圧力分布で高精度な研磨を行なう。例文帳に追加

To perform a high accuracy polishing with a uniform pressure distribution by preventing a polishing tool from an attitude change etc. - 特許庁

被吸着体の均一な研磨を実現することができる研磨用真空チャックを提供する。例文帳に追加

To provide a vacuum chuck for grinding/polishing, realizing uniform polishing of a sucked body. - 特許庁

被吸着体の均一な研磨を実現することができる研削・研磨用真空チャックを提供する。例文帳に追加

To provide a vacuum chuck for grinding/polishing, realizing uniform polishing of a sucked body. - 特許庁