BONDED PORTIONとは 意味・読み方・使い方

An electrode portion 6 of the electronic component 5 is bonded by solder on the land portion 3.例文帳に追加

電子部品５の電極部６は前記ランド部３上に半田接合されている。 - 特許庁

The layer portion 10S1 and the layer portion 10S2 are bonded such that the second surfaces face with each other.例文帳に追加

階層部分１０Ｓ１と階層部分１０Ｓ２は、第２の面同士が対向するように接合されている。 - 特許庁

Then, the base member and the leather include an adhering portion 7 bonded in the layer shape by an adhesive, a sewing portion 8 formed by being sewn and bonded in the layer shape at outer peripheral portions, and a nonbonding portion 9 in which the base member and the leather are not bonded between the adhering portion 7 and the sewing portion 8.例文帳に追加

そしてベース材と皮革は、接着剤によって層状に接合される接着部位７と、外周部が縫製されて層状に接合される縫製部位８とを有し、かつ接着部位７と縫製部位８の間にベース材と皮革が接合されていない非接合部位９を有している。 - 特許庁

To provide a bonded member of an aluminum alloy, which has solved a color tone difference that occurs between a part corresponding to a portion to which an opposing surface is bonded and the other portion, in a film formed by an anodic oxidation treatment of the bonded member of the aluminum alloy.例文帳に追加

アルミニウム合金接合部材の陽極酸化処理による被膜において、反対面接合部相当部分とそれ以外の部分との間で発生する色調差を解消する。 - 特許庁

The plurality of bump electrodes 12 are bonded, respectively, to the terminals 11 under such a state as the internal resin 13 deforms elastically according to the height of a portion to be bonded and absorbs variations in height of the portion to be bonded.例文帳に追加

複数のバンプ電極１２は、それぞれの接合部の高さに対応してそれぞれの内部樹脂１３が弾性変形することにより、接合部の高さのバラツキを吸収した状態で、それぞれ端子１１に接合している。 - 特許庁

When the pressure bonded portion 34 is caulked to the braided wire 64, the braided wire 64 is firmly held between the pressure bonded portion 34 on the outer periphery side thereof and the receiving portion 52 on the inner periphery side thereof, thereby securing contact pressure between the pressure bonded portion 34 and the braided wire 64.例文帳に追加

圧着部３４を編組線６４にカシメ付けると、編組線６４は、その外周側の圧着部３４と内周側の受け部５２との間で強固に挟み付けられるので、圧着部３４と編組線６４との間の接触圧が確保される。 - 特許庁

The core wire 21 includes a core wire portion 22 and a core wire portion 23 bonded to each other with smaller strength than the other portion of the core wire 21.例文帳に追加

芯線２１は、芯線２１の他の部位よりも小さい強度で互いに接合された芯線部２２および芯線部２３を含む。 - 特許庁

A surface treatment portion 2 and a non-treatment portion 3 are provided in the base film 1, and the dicing frame is bonded to the dicing frame bonding portion 4.例文帳に追加

基材フィルム１において、表面処理部２、非表面処理部３を設け、ダイシングフレーム貼着部４にダイシングフレームを貼着する。 - 特許庁