continuous polishingとは 意味・読み方・使い方

METHOD FOR MANUFACTURING HTS TAPE, AND CONTINUOUS MACHINE POLISHING SYSTEM例文帳に追加

ＨＴＳテープの製造方法及び連続機械研磨システム - 特許庁

To maintain accuracy in film thickness measurement even in the continuous state of polishing.例文帳に追加

研磨を継続した状態でも膜厚測定精度を維持する。 - 特許庁

AUTOMATIC CONTINUOUS POLISHING APPARATUS FOR BULBOUS VEGETABLE OR FRUIT OR THE LIKE例文帳に追加

球形果菜あるいは果実などの自動連続つや出し研磨装置 - 特許庁

To provide a continuous polishing device capable of preventing clogging of a polishing pad and improving polishing efficiency.例文帳に追加

研磨パッドの目詰まりを防止でき、且つ、研磨能率の向上が図ることが可能な連続研磨装置を提供する。 - 特許庁

To provide a chemical mechanical polishing method for preventing polishing abrasives in polishing slurry from being aggregated even if the slurry is changed to the polishing slurry having a different composition in process of continuous polishing.例文帳に追加

連続的な研磨途中で組成の異なる研磨スラリーに切り替えてもその中の研磨砥粒の凝集を防止することが可能な化学機械研磨方法を提供する。 - 特許庁

The polishing layer has a radius extending from a center of the polishing layer to an outer periphery of the polishing layer, one or more continuous grooves formed on the polishing layer and extending inward from the outer periphery of the polishing layer, and a circumference fraction grooved (CF).例文帳に追加

研磨層は、研磨層の中心から研磨層の外周まで延びる半径と、研磨層に形成され、研磨層の外周から内に延びる一以上の連続した溝と、円周有溝率（ＣＦ）とを含む。 - 特許庁

To provide a polishing pad, keeping a groove from being blocked up with abrasive grain and polishing chips during polishing, and hardly decreasing the polishing speed even in the case of long time continuous use, and a method of manufacturing a semiconductor device using the polishing pad.例文帳に追加

研磨中に砥粒や研磨屑が溝に詰まり難く、長時間連続使用した場合でも研磨速度が低下し難い研磨パッドを提供することを目的とする。 - 特許庁

The polishing medium is constituted by applying the polishing layer 3 including the polishing material and the binder on the support body 2, and a surface of the polishing layer 3 is constituted of a block type pattern by a continuous aggregate of block bodies 31 of longitudinally 50-100 μm and laterally 75-150 μm.例文帳に追加

支持体２上に研磨材と結着剤を含む研磨層３を塗布してなり、研磨層３の表面を、縦５０〜１００μｍ、横７５〜１５０μｍのブロック体31の連続集合体によるブロック状模様で構成している。 - 特許庁