interfacial stressとは 意味・読み方・使い方

To provide glued laminated wood wherein no interfacial peeling occurs even when a stress is given to the outside and the inside of the wood and of which the strength can be increased to the utmost.例文帳に追加

木材の外部および内部に応力が加わっても界面剥離が起こらず、その強度が可及的に高められた集成木材を得ること。 - 特許庁

To provide an antireflective coating material for an optical element for preventing interfacial peeling caused by stress which a coating film has, and the optical element.例文帳に追加

塗膜のもつ応力で発生する界面剥離を防止することができる光学素子の反射防止用塗料及び光学素子を提供する。 - 特許庁

To provide a light-transmitting epoxy resin composition which gives a cured item exhibiting high transparency and excellent heat resistance, moisture resistance, and low stress properties under various temperature conditions and which, when used an interfacial adhesive for sealing optical semiconductors, effectively functions under various temperature conditions.例文帳に追加

（Ａ）エポキシ樹脂、（Ｂ）硬化促進剤、（Ｃ）無機質充填剤を必須成分とするエポキシ樹脂組成物において、下記式（１）及び（２）の両方を満たすことを特徴とする光透過性エポキシ樹脂組成物。 - 特許庁

To simply measure a limit temperature which causes the interfacial peeling or the cracking of a ceramic caused by the heat stress originating from a change in temperature in a product using an adhesion structure of a ceramics member and an adhesive material.例文帳に追加

セラミックス部材と接着材の接着構造を用いた製品において、温度変化に由来する熱応力による界面はく離やセラミックス割れが発生する限界温度を、簡便に測定することを目的とする。 - 特許庁

This laminate 1 is obtained by mutually laminating prepregs each prepared by impregnating a reinforcing base 11 of glass fiber with a matrix resin 3, wherein a flexible interfacial layer is formed with a low-modulus resin 2 made of such a material with low elastic modulus as to absorb stress transmission, each between the reinforcing base 11 and the matrix resin 3.例文帳に追加

ガラス繊維からなる補強基材11にマトリクス樹脂3を含浸させたプリプレグを積層した積層体1において、補強基材11とマトリクス樹脂3の間に、応力伝達を吸収できるような弾性率の低い材料から成る低弾性樹脂2で柔軟性界面層を形成する。 - 特許庁

Since the interface between adhesive and polyimide is eliminated in the vicinity of the micro via hole by providing the pad-like conductor layer, interfacial peeling due to thermal stress is prevented and connection reliability of the micro via hole having a low connection strength can be enhanced.例文帳に追加

微小ビアホール近傍で、パッド状の導体層を設置して接着剤とポリイミドの界面をなくすことにより、熱応力による界面剥離を防止でき、接続強度の低い微小ビアホールの接続信頼性を上げることができる。 - 特許庁

To provide a circuit board adapted to decrease interfacial stress generated between different materials that form insulation and wiring layers while securing excellent electrical conductivity to the obviate delamination of the insulation and wiring layers and also the generation of cracks.例文帳に追加

配線基板において、良好な電気伝導性を確保しつつ、絶縁層および配線層の異種材料間の界面応力を低減させ、絶縁層および配線層の剥離やクラックの発生を防止する配線基板を提供することにある。 - 特許庁