plated contactとは 意味・読み方・使い方

This manufacturing method includes: bringing the plated steel sheet into contact with an acidic solution containing Zr ions; holding the plated steel sheet for 1-90 seconds after the contact treatment; and then washing the plated steel sheet with water and drying the plated steel sheet to form an oxide layer having an average thickness of 10 nm or more on the surface of the plated steel sheet.例文帳に追加

めっき鋼板を、Ｚｒイオンを含有する酸性溶液に接触させ、接触処理終了後1〜90秒間保持した後、水洗及び乾燥を行うことによりめっき鋼板表面に平均厚さ10nm以上の酸化物層を形成する。 - 特許庁

This manufacturing method includes: bringing the plated steel sheet into contact with an acidic solution containing Ti ions; holding the plated steel sheet for 1-90 seconds after the contact treatment; and then washing the plated steel sheet with water and drying the plated steel sheet to form an oxide layer having an average thickness of 10 nm or more on the surface of the plated steel sheet.例文帳に追加

めっき鋼板を、Ｔｉイオンを含有する酸性溶液に接触させ、接触処理終了後1〜90秒間保持した後、水洗及び乾燥を行うことによりめっき鋼板表面に平均厚さ10nm以上の酸化物層を形成する。 - 特許庁

This is provided with a nickel plated layer 27 or a copper plated layer installed at least on the contact part 26 of a terminal 12 installed at the connector 1, and a tin plated layer installed on this nickel plated layer 27 or the copper plated layer.例文帳に追加

本発明は、コネクタ１に設けられたターミナル１２の少なくとも接触部２６上に設けられたニッケルメッキ層２７又は銅メッキ層と、このニッケルメッキ層２７又は銅メッキ層上に設けられた錫メッキ層とを備えている。 - 特許庁

This manufacturing method includes: bringing the galvanized plated steel sheet into contact with an acidic solution containing Al ions; holding the plated steel sheet for 1-90 seconds after the contact treatment; and then washing the galvanized plated steel sheet with water and drying the plated steel sheet to form an oxide layer having an average thickness of 10 nm or more on the surface of the plated steel sheet.例文帳に追加

亜鉛系めっき鋼板を、Ａｌイオンを含有する酸性溶液に接触させ、接触処理終了後1〜90秒間保持した後、水洗及び乾燥を行うことにより前記めっき鋼板表面に平均厚さ10nm以上の酸化物層を形成する。 - 特許庁

At this time, the upper face of the substrate contact body 60 may be brought into contact with the face to be plated of the substrate W.例文帳に追加

その際基板接触体６０の上面に基板Ｗの被めっき面を接触させてもよい。 - 特許庁

Between the Ni plated layer 6 and the Au plated layer 7, a first intermediate plated layer 8 having a less noble metal than Au with respect to reference electrode potential is formed in contact with the Au plated layer, and a second intermediate plated layer 9 having a more noble metal than the metal in the first intermediate plated layer with respect to the reference electrode potential is formed in contact with the first intermediate plated layer 8.例文帳に追加

Ｎｉめっき層６とＡｕめっき層７の間に、Ａｕに対して標準電極電位が卑な金属を有する第一中間めっき層８がＡｕめっき層に接して、第一中間めっき層８の金属に対して標準電極電位が貴な金属を有する第二中間めっき層９が第一中間めっき層８に接してそれぞれ形成されている。 - 特許庁

The surface of a sliding part 5a of a movable contact side is amorphous Ni-P-plated or Ni-B-plated, and its surface is further amorphous Pd-P-plated.例文帳に追加

また可動接点側の摺動部５ａの表面に非晶質Ｎｉ−ＰメッキまたはＮｉ−Ｂメッキを施し、さらにその表面に非晶質Ｐｄ−Ｐメッキを施す。 - 特許庁

The Ni-P plated layer 14 between a contact place A and a contact place B functions as a resistor.例文帳に追加

接触箇所Ａと接触箇所Ｂとの間のＮｉ−Ｐめっき層１４が，抵抗体として作用する。 - 特許庁