through conductor methodとは 意味・読み方・使い方

To provide a through wiring board where through wiring which does not have a void causing a defect in a conductor filling a through hole is arranged, and a method of manufacturing the through wiring board that suppresses formation of the void when the through hole or a non-through hole is filled with the conductor.例文帳に追加

貫通孔内に充填された導体に欠陥となるボイドの無い貫通配線が配された貫通配線基板、および貫通孔又は非貫通孔に導体を充填する際のボイドの発生を抑制しうる貫通配線基板の製造方法の提供。 - 特許庁

To provide an electromagnetic filter of a through conductor, and a method of manufacturing the same.例文帳に追加

この発明は、貫通導体の電磁フィルタとそのフィルタを製作する方法とを含んでいる。 - 特許庁

To provide a through-hole conductor forming conductive paste superior in through- hole passing and soldering performance and its manufacturing method as well as a both-side printed wiring board using the through-hole conductor forming conductive paste.例文帳に追加

スルーホール貫通性とはんだ付け性に優れるスルーホール導体形成用導電ペースト及びその製造法並びにスルーホール導体形成用導電ペーストを用いた両面プリント配線板を提供する。 - 特許庁

To provide a wiring board for which a gap between a through-hole and a through conductor can be suppressed, and its manufacturing method.例文帳に追加

貫通孔と貫通導体との間の隙間を抑制することができる配線基板およびその製造方法を提供する。 - 特許庁

To provide a method of manufacturing a ceramic component that can surely form a through hole conductor on a wall surface of a through hole.例文帳に追加

貫通孔の壁面にスルーホール導体を確実に形成することができるセラミック部品の製造方法を提供すること。 - 特許庁

A manufacturing method is carried out through a manner in which a photosensitive conductive paste applied onto a ceramic board 11 is exposed to light, through a photomask and developed for the formation of the lower conductor pattern 1a of a coil conductor pattern 1.例文帳に追加

セラミック基板１１上に付与された感光性導電ペーストをフォトマスクを通して露光及び現像し、コイル導体パターン１の下部導体パターン層１ａを形成する。 - 特許庁

To provide a method of manufacturing a multilayer wiring board in which a through hole having a relatively small diameter can be filled with a conductor, every through hole having a small pitch to adjacent through holes can be filled reliably with a via conductor, and the conductor can be connected reliably with a wiring layer formed on a surface of an insulation layer.例文帳に追加

比較的小径の貫通孔に導体を充填したり、隣接する貫通孔とのピッチが小さな貫通孔ごとにビア導体を確実に充填でき、該導体を絶縁層の表面に形成した配線層と確実に接続できる多層配線基板の製造方法を提供する。 - 特許庁

To provide the manufacturing method of a ceramic wiring board which is easy to mate burning shrinkage behaviors between a green sheet and a through hole conductor and capable of preventing the through hole conductor after baking from sticking out of an insulated board or a crack from occurring on the insulated board around the through hole conductor.例文帳に追加

グリーンシートとスルーホール導体との焼成収縮挙動を合せやすく、焼成後におけるスルーホール導体の絶縁基板からの突出やスルーホール導体の周囲の絶縁基板に発生するクラックを防止できるセラミック配線基板の製造方法を提供する。 - 特許庁