陽極銅の英語

銅線１２４が直流電流源１２２の陽極１２８と接続される。例文帳に追加

A copper wire 124 is connected to an anode 128 of a DC current source 122. - 特許庁

該複合陽極材料は、該陽極材料粒子１が水酸化ニッケル材料を含み、該導電性材料３がニッケル、銅、黒鉛などからなる。例文帳に追加

Of the composite positive electrode material, the anode material particles 1 contain a nickel hydroxide material, and the conductive material 3 consists of nickel, copper, graphite or the like. - 特許庁

物品に電解処理を施して陽極酸化被膜を形成し、この陽極酸化被膜に銀又は銅を析出させる。例文帳に追加

The surface treatment method comprises forming the anodic oxide film on the article with an electrolysis treatment, and depositing silver or copper in the anodic oxide film. - 特許庁

所定部位に陽極酸化皮膜を備えたアルミニウム合金から成る部品において、上記陽極酸化皮膜に銀及び／又は銅を含有させる。例文帳に追加

In an aluminum alloy-made part provided with an anodic oxide coating at a prescribed part, silver and/or copper is allowed to contain in the anodic oxide coating. - 特許庁

半導体ウエハに電気銅めっきを行うに際し、めっき槽を陰イオン交換膜で陰極室と陽極室に隔離し、陽極として不溶性陽極を使用して電気銅めっきを行うことを特徴とする半導体ウエハの電気銅めっき方法。例文帳に追加

The electrolytic copper plating method for the semiconductor wafer is characterized by dividing a plating tank into a cathode chamber and an anode chamber while separating them with an anion-exchange membrane, and performing electrolytic copper plating by using an insoluble anode as the anode, when electrolytic copper plating the semiconductor wafer. - 特許庁

電解槽を隔膜にて陽極側、陰極側に分け、陽極側には過酸化水素を含む硫酸銅液を供給し、陰極側には過酸化水素を含まない硫酸銅液を供給し電解することで、陽極で過酸化水素の分解、陰極で金属銅の回収を同時に行う。例文帳に追加

This treatment method comprises dividing an electrolytic tank into the anode and cathode sides with a diaphragm, supplying the copper sulfate solution containing hydrogen peroxide to the anode side, supplying the copper sulfate solution containing no hydrogen peroxide to the cathode side, and electrolyzing them, to decompose hydrogen peroxide in the anode and simultaneously collect metallic copper in the cathode. - 特許庁

カソードのメッキ面にパーティクルが付着生成することのない電気メッキ用含燐銅陽極、特に半導体デバイスの銅配線を電気メッキにより形成するための電気メッキ用含燐銅陽極を提供する。例文帳に追加

To provide a phosphorous copper anode for electroplating which does not deposit and form particles on the plating surface of a cathode, more preferably the phosphorous copper anode for electroplating for forming copper wiring of semiconductor devices by electroplating. - 特許庁

陽極及び半導体ウェハの両方が銅電解質を含む溶液内にさらされる。例文帳に追加

Both the anode and the semiconductor wafer are exposed to a solution comprising copper electrolytes. - 特許庁