chemical processing equipmentとは 意味・読み方・使い方

The substrate processing equipment 1 comprises chemical processing sections CB1 and CB2, and flushing sections WB1 and WB2 arranged in a row.例文帳に追加

基板処理装置１は、薬液処理部ＣＢ１，ＣＢ２と、水洗処理部ＷＢ１，ＷＢ２とを一列に配設する。 - 特許庁

By this configurations, both sides of dry polishing processing and chemical polishing processing with one equipment can be performed by exchanging polishing means for chemical polishing and polishing means for dry type polishing.例文帳に追加

かかる構成により，湿式研磨用の研磨手段と，乾式研磨用の研磨手段とを交換することにより，１つの装置で乾式研磨加工と湿式研磨加工の双方を実行することができる。 - 特許庁

To provide substrate processing equipment in which chemical can be ejected with high accuracy without increasing the burden on an operator.例文帳に追加

オペレータの負担を増大させることなく、薬液を高精度に吐出することができる基板処理装置を提供する。 - 特許庁

The substrate processing equipment is provided with a valve 15 for regulating the open/close state of chemical piping, an encoder 18 and a control section 20.例文帳に追加

基板処理装置に、薬液配管の開閉状態を調整する開閉バルブ１５、エンコーダ１８および制御部２０を設ける。 - 特許庁

The substrate processing equipment is provided with the etching equipment in which a semiconductor substrate is held by a maintenance portion and a semiconductor layer of the substrate is etched with chemical, and a film thickness measuring apparatus for measuring film thickness of the semiconductor layer of the substrate.例文帳に追加

半導体基板が保持部に保持され、化学薬液によってこの半導体基板の半導体層をエッチングするエッチング装置と、この半導体基板の半導体層の膜厚を測定する膜厚測定装置と、を備える。 - 特許庁

The washing solution used in the second or the next washing stage requires chemical treatment, such as ion exchange and is thereafter regenerated and is returned to the photosensitive material processing equipment where the washing solution is recycled to photographic sensitive material processing and/or cleaning of the component members of the photosensitive material processing equipment.例文帳に追加

第２又は次の洗浄段階で使用される洗浄溶液は、イオン交換等の化学処理を必要とし、その後、再生されて感光材処理器に戻され、写真感光材処理及び／又は感光材処理器の構成部材の清掃に再利用される。 - 特許庁

To provide a method and an equipment for processing a substrate which enable to suppress the decline in productivity by shortening the time required for processing with a chemical, and also enable to remove particles efficiently.例文帳に追加

薬液による処理時間を短縮し生産性の低下を抑制しつつパーティクルを効率的に除去することが可能な基板処理方法および基板処理装置を提供する。 - 特許庁

According to Fig. 3-1-8, the number of enterprises belonging to a group in order from greatest to least are manufacture of electrical machinery, equipment and supplies (25,192 enterprises), manufacture of transportation equipment (23,323 enterprises),manufacture of general machinery (21,144 enterprises),manufacture of information and communication electronics equipment (13,026 enterprises)-i.e., a series of processing and assembly industry groups-followed by the manufacture of chemical and allied products group (12,283 enterprises).例文帳に追加

第3-1-8図からグループに属する企業数を見ると、多い順に、電気機械器具製造業（25,192社）、輸送用機械器具製造業（23,323社）、一般機械器具製造業（21,144社）、情報通信機械器具製造業（13,026社）と加工・組立型業種グループが続き、ついで化学工業グループ（12,283社）となっている。 - 経済産業省