copper concentrationとは 意味・読み方・使い方

The concentration of Al of the second copper alloy wiring is lower than the concentration of Al of the first copper alloy wiring.例文帳に追加

そして、第二の銅合金配線のＡｌの濃度は、第一の銅合金配線の前記Ａｌの濃度未満である。 - 特許庁

The copper salt preferably has a copper ion concentration of 0.001 to 0.45 mol/liter, and is also preferably selected out of copper pyrophosphate, copper sulfate, copper nitrate, copper formate, copper acetate, and acetylacetone copper.例文帳に追加

前記銅塩の濃度は銅イオン濃度で０．００１モル／リットル以上０．４５モル／リットル以下が好ましく、ピロリン酸銅、硫酸銅、硝酸銅、ギ酸銅、酢酸銅及びアセチルアセトン銅から選ばれる少なくとも１つであることが好ましい。 - 特許庁

In the acidic copper-plating method, plating is performed while directly monitoring the concentration of copper (I) in a plating bath and maintaining the concentration of copper (I) at 50 ppm or less.例文帳に追加

酸性銅めっき方法において、めっき浴中の一価銅濃度を直接的にモニターし、５０ｐｐｍ以下に維持しながらめっきを行う。 - 特許庁

The method of manufacturing copper sulfate includes adding sulfuric acid into a liquid after copper electrolysis by a PC (Permanent Cathode) method which is operated in such that copper sulfate concentration is at most 180 g/L and copper concentration is at most 52 g/L so that sulfuric acid concentration after heating concentration may become 300-350 g/L, and subsequently performing crystallization by three times cooling.例文帳に追加

硫酸銅濃度が180g/L以下、かつ 銅濃度が52g/L以下で操業したPC法による銅電解後液に、加熱濃縮後硫酸濃度が300-350g/Lとなるように硫酸を添加し、続いて、３回冷却による結晶化を行う。 - 特許庁

In a dip soldering process of a printed board having a copper foil and/or a mounting component having copper leads, replenishment solder which does not contain copper or has copper concentration lower than the copper concentration before replenishment is loaded in solder in the tank where solder alloy at least containing copper as requisite component is fused, and the copper concentration is controlled to be lower than a specified concentration.例文帳に追加

銅箔を有するプリント基板、または／および銅リード線を有する実装部品のディップはんだ付け工程において、少なくとも銅を必須成分とするはんだ合金を溶融した槽中はんだに、銅を含まない、または補給前銅濃度よりも低い銅濃度の補給はんだを投入し、銅濃度を一定濃度以下に抑制する。 - 特許庁

METHOD OF CONTROLLING CONCENTRATION OF SURFACE TREATMENT SOLUTION FOR COPPER OR COPPER ALLOY, AND SURFACE ROUGHENING APPARATUS USING THE SAME例文帳に追加

銅または銅合金の表面処理液の濃度管理方法及びこれを用いた粗面化装置 - 特許庁

The concentration of Fe in the molten copper metal containing Fe becomes lowest in an oxygen concentration range of 1,000 to 3,000 wt. ppm.例文帳に追加

Feを含む銅の溶湯中のFe濃度は、酸素濃度1000〜3000重量ppmの範囲で最低となる。 - 特許庁

METHOD, KIT, AND DEVICE FOR DETECTING CONCENTRATION OF COPPER OF SOLDER ALLOY例文帳に追加

半田合金の銅濃度検出方法およびキット並びに装置 - 特許庁