interface thermal resistanceとは 意味・読み方・使い方

An interface layer which has both functions of an adhesive layer and a high resistance layer (thermal resistance layer) and comprises extremely thin insulator or a semiconductor is inserted between a chalcogenide material layer and an interlayer insulating film, and between the chalcogenide material layer and a plug.例文帳に追加

接着層と高抵抗層（熱抵抗層）の機能を兼ね備えた、極薄の絶縁体または半導体からなる界面層をカルコゲナイド材料層／層間絶縁膜間、及びカルコゲナイド材料層／プラグ間に挿入する。 - 特許庁

A relation between each component of the four-terminal matrix and an area thermal diffusion time shown by a physical value of the constituting single layer material is clarified by using the recurrence formulas, and a thermal diffusion rate and an interface thermal resistance of an unknown single layer material inserted into a multilayered material whose thermophysical property value is already known are calculated simultaneously.例文帳に追加

前述の漸化式を用いて、構成単層材料の物性値によって表した四端子行列の成分と面積熱拡散時間との関係を明らかにし、熱物性値が既知である多層材料中に挟んだ未知の単層材料の熱拡散率および界面熱抵抗を同時に算出する。 - 特許庁

To provide a heat transfer apparatus achieving an interface heat resistance substantially equal to or superior to grease even under high-temperature conditions under which a conventional grease cannot be applied, in the interface between a metal heat tranafer surface and a thermoelectric device, and also producing the effect of preventing the occurrence of breakage due to the influence of thermal stress.例文帳に追加

金属伝熱面と熱電デバイスとの界面において、従来グリスは適用できなかったような高温条件においてもグリスと同程度もしくはそれより優れる界面熱抵抗を実現し、また、熱応力の影響による破損の発生を防ぐ効果も適する熱伝達装置を提供する。 - 特許庁

To provide a highly reliable semiconductor circuit board having a thick copper pattern layer and exhibiting excellent heat cycle resistance in which thermal stress due to difference of the coefficient of thermal expansion between a copper pattern and an insulating substrate is suppressed, stripping of the bonding interface between the copper pattern and the insulating substrate or cracking of the insulating substrate is retarded.例文帳に追加

銅パターンと絶縁基板の熱膨張係数差による熱応力が小さく、銅パターンと絶縁基板の接合界面の剥離や絶縁基板２の割れが生じ難く、銅パターン層が厚く、耐ヒートサイクル性に優れた高い信頼性を有する半導体回路基板を提供すること。 - 特許庁

To provide a semiconductor device which is improved in resistance to breaking of a wire resulting from peeling caused on an interface between a wiring pattern of a wiring substrate and a sealing pattern due to thermal stress generated in soldering packaging.例文帳に追加

はんだ付け実装での熱ストレスにより、配線基板の配線パターンと封止樹脂との界面で剥離が発生し、ワイヤーが切断することに対する耐性を向上せしめた半導体装置を提供する。 - 特許庁

To provide a circuit wiring board capable of improving a thermal cycling resistance of an interlayer contact interface portion of a conductive via and a conductive layer for wiring in especially a multilayer wiring board, and of obtaining a high connecting reliability.例文帳に追加

特に多層配線基板における導電ビアと配線用導電層との層間接触界面部分の熱サイクル耐性を向上し高い接続信頼性を得ることができる回路配線基板を提供する。 - 特許庁

To provide a circuit wiring board that improves thermal-cycle resistance of a contact interface part between a conductive via and a conductive layer especially in a multilayer wiring board, thus achieving high connection reliability, and also to provide its manufacturing method.例文帳に追加

特に多層配線基板における導電ビアと導電層との接触界面部分の熱サイクル耐性を向上し高い接続信頼性を得ることができる回路配線基板及びその製造方法を提供する。 - 特許庁

The SOFC complex 1 joins the bottom of a columnar SOFC stack 3 and surfaces (joining surfaces) of metallic manifolds 5, 7 with silver solder, therefore has high thermal shock resistance and can form a small joining interface.例文帳に追加

ＳＯＦＣ複合体１は、柱状のＳＯＦＣスタック３の底面と金属マニホールド５、７の表面（接合面）とを、銀ローにより接合しているので、熱衝撃に強く、しかも、その接合界面を小面積で形成できる。 - 特許庁