reliability coefficientとは 意味・読み方・使い方

Reliability T of doze determination is calculated using the threshold a and the weighting coefficient A, and the driver's doze is determined based on the reliability T.例文帳に追加

そして、それらの閾値ａと重み付け係数Ａとを用いて居眠り判定の信頼度Ｔを算出し、その信頼度Ｔに基づいて運転者の居眠りを判定する。 - 特許庁

Furthermore, this difference is multiplied by a reliability coefficient for the main scanning direction and the sub-scanning direction and the compensating amount is determined (#10 to #11).例文帳に追加

さらに，この差に，主走査方向，副走査方向ごとの信頼性係数を掛けて補正量を決定する（＃１０，＃１１）。 - 特許庁

To provide a metallic material for a connector which combines connection reliability with a low friction coefficient and also has satisfactory solder wettability.例文帳に追加

接続信頼性と低摩擦係数を両立し、かつ、はんだ濡れ性が良好なコネクタ用金属材料を提供する。 - 特許庁

To miniaturize an MIM capacitor formed between wiring layers, and at the same time to realize low temperature coefficient and high reliability.例文帳に追加

配線層間に形成されるＭＩＭキャパシタを小型化し、同時に低温度係数と高信頼性を実現すること。 - 特許庁

To further improve the reliability and stability of an estimated value of a road surface friction coefficient in estimating the friction coefficient of a road surface using the estimated value of moment around a predetermined yawing axis of a vehicle.例文帳に追加

車両の所定のヨー軸周りのモーメントの推定値を用いて路面の摩擦係数の推定を行う場合に、路面の摩擦係数の推定値の信頼性や安定性をさらに向上させる。 - 特許庁

To provide a semiconductor device which can improve reliability of packaging though heat stress is applied by approximating a thermal expansion coefficient of the semiconductor device with a thermal expansion coefficient of a mounting board.例文帳に追加

半導体装置の熱膨張係数を実装基板の熱膨張係数に近づけることにより、熱ストレスが加わった際の実装信頼性を向上させることが可能な半導体装置を提供する。 - 特許庁

To provide a negative temperature coefficient thermistor capable of strengthening bonding strength between a negative temperature coefficient thermistor consisting of LaCoO3 based rare earth transition element oxide and an electrode, and enhancing reliability.例文帳に追加

ＬａＣｏＯ_3系希土類遷移元素酸化物からなる負特性サーミスタ素子と電極との密着強度を高め、かつ信頼性を向上させることができる負特性サーミスタを提供する。 - 特許庁

To provide a high reliability adhesive for electronic parts which can suppress void generation and attains a low coefficient of linear expansion after being cured.例文帳に追加

ボイドの発生を低減することができ、硬化後に低線膨張率となる信頼性の高い電子部品用接着剤を提供する。 - 特許庁