side platingとは 意味・読み方・使い方

The Ni plating layer 53 and the electrolytic Au plating layer 54 are formed on the BGA array side, whereas the electrolytic Ni plating layer 55 and the electrolytic Au plating layer 56 are formed on the C4 side.例文帳に追加

各メッキ層は、ＢＧＡ側が電解Ｎｉメッキ層５３及び電解Ａｕメッキ層５４、Ｃ４側が無電解Ｎｉメッキ層５５及び無電解Ａｕメッキ層５６である。 - 特許庁

To provide a substrate plating apparatus to prevent a plating solution from turning around to the rear side of a substrate.例文帳に追加

基板の裏面へのメッキ液の回り込みを防止する基板メッキ装置を提供する。 - 特許庁

The plating method includes: separating a solution in a cathode side from a solution in an anode side by using a diaphragm; using a plating solution containing a soluble salt of iridium for the cathode side; and plating the surface of a member in the cathode side with the metal.例文帳に追加

陰極側と陽極側の溶液を隔膜で分離し、陰極側に可溶性イリジウム塩を含有するめっき液を用い、陰極側の部材表面をめっきすることを特徴とするめっき方法。 - 特許庁

A copper foil 1 (main conductor layer) has a nickel plating layer 3 on the whole surface of one side and a thicker patterned nickel plating layer 2 on the surface of the opposite side, and has a gild plating layer 4 on a surface of the nickel plating layer 2 and a copper plating layer 5 (base layer conductor layer) on the surface of the nickel plating layer 3.例文帳に追加

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのニッケルめっき２をより厚く施し，ニッケルめっき２の表面上に金めっき４を施し，ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。 - 特許庁

Further, the plating applied to the electrode plate is configured with an Ni-P alloy plating film applied to the substrate side and an Ni-Co alloy plating film layered thereon.例文帳に追加

また、電極板のめっき構成は、基板側からＮｉ−Ｐ合金めっき膜とこれに積層したＮｉ−Ｃｏ合金めっき膜とする。 - 特許庁

The flow is given to the plating solution B in the plating tank 10 by introducing the plating solution B to the plating tank 10 from a reserve tank 20 by a pump 50 and discharging the plating solution B to the upper side of the plating tank 10 from discharge ports 62 of a multi-hole tube 60.例文帳に追加

リザーブ槽２０からポンプ５０によってめっき液Ｂをめっき槽１０へ導入させ、多孔管６０の吐出口６２よりめっき槽１０上方へ吐出させることで、めっき槽１０内のめっき液Ｂに流動が与えられる。 - 特許庁

A copper foil 1 (main conductor layer) has a nickel plating layer 3 on the whole surface of one side and a patterned nickel plating layer 2 on the surface of the opposite side, and has a copper plating layer 5 (base layer conductor layer) on the surface of the nickel plating layer 3.例文帳に追加

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのニッケルめっき２を施し，ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。 - 特許庁

A copper foil 1 (main conductor layer) has a nickel plating layer 3 on the whole surface of one side and a thicker patterned tin plating layer 2 on the surface of the opposite side, and has a copper plating layer 5 (base layer conductor layer) on the surface of the nickel plating layer 3.例文帳に追加

銅箔１（主導体層）の片面全面にニッケルめっき３を施すとともにその反対面にパターン付きのスズめっき２を施し，ニッケルめっき３の表面に銅めっき５（基層導体層）を形成する。 - 特許庁