surface thinningとは 意味・読み方・使い方

The storage recession 23 is integrally formed using a degree of freedom in formation by thinning the front surface material.例文帳に追加

収納凹部２３は表面材の薄肉化による成形の自由度を利用して一体成形されている。 - 特許庁

The first opening 31A between two openings 31, 31 is opened at the crossed ridge portion of the second relief surface 12A of the tip end relief surface 12 and the second thinning surface 23 in a thinning portion 20.例文帳に追加

二つの開口部３１，３１のうちの第一の開口部３１Ａを、先端逃げ面１２の第二逃げ面１２Ａとシンニング部２０における第二シンニング面２３との交差稜線部に開口させる。 - 特許庁

To provide a surface material for integrally foaming with the surface showing little limitation to a choice of the material of the surface by enabling thinning.例文帳に追加

本発明は、薄型化を可能にして、表皮の材質選択の制限が少ない表皮一体発泡用表皮材を提供する。 - 特許庁

To provide a wall surface structure capable of having the excellence in strength, insulating and sound insulation effect, being manufactured by combining a wall surface member processing the minor diameter tree such as timber from thinning, etc. and accelerating the use of the timber from thinning.例文帳に追加

強度、断熱性、遮音性に優れた壁面構成物を、間伐材等の小径木を加工した壁面部材の組み合わせにより製作し、間伐材の利用の促進を図ることを課題とする。 - 特許庁

Thereafter, the minimum inter-data distance of a data group after the thinning out processing of the arrangement condition of the data remaining after the thinning out processing or the like is calculated as an evaluation index (step S4), the thinning out processing is continued or the thinning out processing is discontinued on the basis of the evaluation index, and the curved surface model is generated by using the processed data.例文帳に追加

その後、間引き処理後に残ったデータの配置具合の間引き処理後のデータ群の最小データ間距離等を評価指標として算出し（ステップＳ４）、この評価指標に基づき、間引き処理を継続するか、間引き処理を打ち切り、処理済みのデータを使用して曲面モデルの生成をする。 - 特許庁

To aim at attaining uniform luminance of a light emitting surface of a lamp of which the front cover is structured as an inclined surface and at thinning of the lamp.例文帳に追加

前面カバーが傾斜面として構成された灯具の発光面の均一な明るさと薄型化を図る。 - 特許庁

The bridge portions d5-d7 and the internal terminals h1-h6 are laid on a planar circuit mounting surface parallel with a circuit mounting surface a5 thus thinning the power module.例文帳に追加

架橋部ｄ５〜ｄ７及び内部端子部ｈ１〜ｈ６は回路搭載面ａ５に平行な板状で回路搭載面に敷くよう配置し薄型化した。 - 特許庁

The bridge portions d5-d7 and the internal terminal portions h1-h6 are arranged to be laid on a planer circuit mounting surface parallel with a circuit mounting surface a5 thus thinning the power module.例文帳に追加

架橋部ｄ５〜ｄ７及び内部端子部ｈ１〜ｈ６は回路搭載面ａ５に平行な板状で回路搭載面に敷くよう配置し薄型化した。 - 特許庁