「硫黄田」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

半導体装置は、下地導体層と鉛フリー半田層との間に、実質的に硫黄を含まない接合層７が設けられ、かつ接合層と鉛フリー半田層との間に、これらの元素を含む合金層９ａが形成された接合構造を有する。例文帳に追加

A semiconductor device has joint structures in which a joint layer 7 provided between an underlying conductive layer and a lead-free solder layer and substantially not containing sulfur and, and an alloy layer 9a provided between the joint layer and the lead-free solder layer containing elements of these layers are formed. - 特許庁

半導体装置は、下地導体層と鉛フリー半田層との間に、実質的に硫黄を含まない接合層が設けられ、かつ前記接合層と前記鉛フリー半田層との間に、これらの元素を含む合金層が形成された接合構造を有する。例文帳に追加

In the semiconductor device, between a ground conductor layer and a lead free solder layer, a bonding layer which does not contain sulfur substantially is prepared, and between the bonding layer and the lead free solder layer, the bonding structure forming an alloy layer with these elements is prepared. - 特許庁

この後に島津久光進発に先立って上京した西郷・村田・森山新蔵は諸藩の情勢を探っていたが、真木和泉・有馬新七らの京都挙兵（寺田屋騒動）を煽動したと久光から疑われ、呼び戻されて西郷は徳之島（再命で沖永良部島へ変更）へ、村田は喜界島（薩摩硫黄島（鬼界ヶ島）ではない）へ遠島された。例文帳に追加

After this, Saigo, Murata, and Shinzo MORIYAMA went to Kyoto to investigate the situation in each domain before the troops led by Hisamitsu SHIMAZU departed, which made Hisamitsu suspect that their actions had instigated Izumi MAKI and Shinshichi ARIMA to raise an army in Kyoto (Teradaya-sodo [oppression of Sonjo group]); after being called back from Kyoto, Saigo was sent into exile to Tokuno-shima Island (and changed to Oki-no-erabujima Island by the second order) and Murata to Kikai-jima Island (not Satuma-iojima Island [Kikai-ga-shima Island]).  - Wikipedia日英京都関連文書対訳コーパス

ノンハロゲンかつノンアンチモンであり、充填剤の割合が高い場合でもリードフレームとの熱膨張係数の差が小さく、高温時における弾性率低減効果による耐半田リフロー性に優れ、かつ、耐熱衝撃性に優れ、銅腐食の可能性となる硫黄を含まない封止用エポキシ樹脂組成物及び、これにより封止した素子を備えてなる電子部品装置を提供する。例文帳に追加

To provide an epoxy resin composition for sealing containing no halogen and no antimony, having a thermal expansion coefficient near to that of a lead frame even when a ratio of a filler is high, excellent solder reflow resistance by an elastic modulus reducing effect during high temperature and excellent thermal shock resistance and containing no sulfur having possibility of copper corrosion and to provide an electronic component device provided with an element sealed by the epoxy resin composition. - 特許庁