軟化性基板の英語

７０〜１００℃の温度域で軟化する透明な非晶性のポリエステル樹脂からなる基板１の少なくとも片面に、上記温度域では軟化し難い透明な熱可塑性樹脂層２を介して、導電粉末を含んだ透明な制電層３を形成した構成の制電性透明樹脂板Ｐとする。例文帳に追加

The anti-static transparent resin plate P is formed of a transparent anti-static layer 3 containing a conductive powder at least to one side of a substrate 1 comprising a transparent amorphous polyester resin softened in a temperature range of 70 to 100°C through a transparent thermoplastic resin layer 2 to be hardly soften in the above temperature range. - 特許庁

電気絶縁層３と導電層２からなる基板構成単位層１１を複数積層した多層プリント配線基板１において、基板構成単位層１１同士を接着するとともに、加熱により軟化し、かつ、外力により塑性変形する接着層１３を有する。例文帳に追加

A multilayer printed circuit board 1 has substrate formation unit layers 11 laminated in plural numbers that are composed of an electrical insulating layer 3 and a conductive layer 2, wherein the substrate formation unit layers 11 adhere to each other and provide an adhesive layer 13 as well that is softened by heating and undergoes plastic deformation by external force. - 特許庁

異方性導電性接着剤で接合され水平に配置される一対のプリント配線基板の接合部を加熱して異方性導電性接着剤を軟化させる加熱手段と、プリント配線基板間にヘラを挿入させて異方性導電性接着剤を分断するヘラ挿入手段と、を有する。例文帳に追加

The printed wiring board repairing device includes a heating means which heats a joined part of a pair of printed wiring boards which are joined using an anisotropic conductive bond and arranged horizontally to soften an anisotropic conductive bond, and a spatula inserting means for inserting a spatula between the printed wiring boards to segmentalize the anisotropic conductive bond. - 特許庁

基板１００上に導電性パターン１１０を形成する工程と、導電性パターン１１０が形成された基板１００を、基板１００の表面が軟化を生じる温度まで加熱し、上方から押圧部材１２０を導電性パターン１１０に押し付けて、導電性パターン１１０を基板１００の表面に押し込む工程と、を備える。例文帳に追加

The method has a step to form a conductive pattern 110 on a substrate 100, and a step that heats the substrate 100, on which the conductive pattern 110 is formed, up to the temperature softening the top surface of the substrate 100 and then presses a pressing member 120 on the conductive pattern 110 from above to press the conductive pattern 110 into the top surface of the substrate 100. - 特許庁

軟化する温度に加熱した、磁性体材料を含有する硬化性樹脂を矢印４１の方向に、金型４０に充填し、充填した硬化性樹脂を硬化させ、樹脂構造体５をフレキシブル基板４の一面に形成する。例文帳に追加

A magnetic body material containing curable resin which is heated to a softening temperature is charged into the die 40 in an arrow 41 direction and the charged curable resin is set to form the resin structure 5 on one surface of the flexible substrate 4. - 特許庁

加圧機構４２は、感光性樹脂層の溶融温度以下で且つクッション層が軟化する温度条件下で、感光性ウエブ２２とガラス基板２４とを加圧する一方、熱圧着機構４３は、溶融温度条件下で、前記感光性ウエブ２２と前記ガラス基板２４とを熱圧着する。例文帳に追加

The pressing mechanism 42 is constituted so as to press the photosensitive web 22 to the glass substrate 24 under a temperature condition lower than the melting temperature of the photosensitive resin layer and softening a cushioning layer and the hot press bonding mechanism 43 performs the hot press bonding of the photosensitive web 22 and the glass substrate 24 under a melting temperature condition. - 特許庁

しかも、環境上有害な元素を含むことなく、耐水性に優れ、軟化温度が十分に低く、且つ熱膨張係数が基板ガラスに適合するといった優れた特性を有する。例文帳に追加

Then, the lead-free glass composition contains no environmentally harmful element and has excellent characteristics such as excellent water resistance and sufficiently low softening temperature and the thermal expansion coefficient adaptable for the substrate glass. - 特許庁

ガラスの軟化点（500℃）以下の低温プロセスを用いて、poly-Si薄膜などの半導体結晶膜をガラスなどの絶縁性、又は、柔軟性基板上に作製する方法を提供する。例文帳に追加

To provide a method for manufacturing a semiconductor crystal film such as a poly-Si thin film on an insulating or a flexible substrate such as a glass with the use of low temperature process of not more than the softening point (500°C) of a glass. - 特許庁