To re-memberとは 意味・読み方・使い方

The compressed fluid in an intake channel pushes a member to re-seal the cylinder.例文帳に追加

このことによって、吸気チャネル内の圧縮流体は、部材を押圧してシリンダを再シールする。 - 特許庁

To provide an image forming device that performs transfer and re-charging in an image-forming device regardless of start-up time and converging time when voltage is applied to a transfer member or an re-charging member.例文帳に追加

画像形成装置において、転写部材又は再帯電部材に電圧を印加した際の立ち上げ時間と収束時間にかかわらず転写や再帯電を可能とする。 - 特許庁

To provide a support re-sticking device surely fixing a plate-like member by providing a support interposed between the plate-like member and a supporting means re-stickably to the supporting means.例文帳に追加

板状部材と支持手段との間に介在される支持体を、前記支持手段に貼替可能に設け、確実に板状部材を固定することのできる支持体貼替装置を提供すること。 - 特許庁

The operation form of a movable member notice for operating a movable member is selected by different selection ratios corresponding to the total number of times of the re-variable display to be executed in a re-variable display pattern.例文帳に追加

また、再変動表示パターンで実行される再変動表示の合計回数に応じて、可動部材を動作させる可動部材予告の動作態様を異なる選択割合で選択する。 - 特許庁

To provide a coupler, holding a member to be connected with strong holding force without damaging the member, and facilitating re-assembling.例文帳に追加

被連結部材に傷を付けることなく、強い保持力で保持することができると共に、再組み付けを容易にする。 - 特許庁

The re-sealing operation of the sealing member is ensured by providing the developer replenishment container with a rib adopted to restrict sliding movement of the journal-less gear accompanying the unsealing operation or re-sealing operation of the sealing member.例文帳に追加

封止部材の開封動作や再封動作に伴って軸支レスとされたギアのスライド移動を規制するリブを設け、封止部材の再封を確実に行わせることが可能となった。 - 特許庁

To provide a fixing device of a ditch-cover receiving frame, which enables re-tapping of a screw hole formed in an inner support member from an outer-support-member side.例文帳に追加

内側支持部材に形成された螺子孔のリタップ加工を、外側支持部材側から行い得るようにした溝蓋受枠の固定装置を提供する。 - 特許庁

The re-attaching mechanism re-attaches the holding member by attaching the second holding member 26 to the element forming surface side of the semiconductor wafer under the condition that gaps among the semiconductor element pieces of semiconductor wafer are expanded by extending the first holding member 22 and then peeling the first holding member.例文帳に追加

貼り替え機構は、第１の保持部材２２を伸張して、前記個片化された半導体ウェーハの半導体素子間の隙間を広げた状態で、前記半導体ウェーハの素子形成面側に第２の保持部材２６を貼り付け、前記第１の保持部材を剥離することにより、保持部材を貼り替える。 - 特許庁