foil backとは 意味・読み方・使い方

A transfer foil used for forming the phosphor screen 6a can be a conductive film and a foil having a laminated structure without a metal back.例文帳に追加

尚、該蛍光面６ａの形成に用いる転写箔は、導電性膜及びメタルバックのない積層構造のもので良い。 - 特許庁

Further, almost all the front and back surfaces of the LED substrate 17 are plated with a copper foil.例文帳に追加

更に、前記ＬＥＤ基板１７の表面と裏面の略全面に銅箔を被着する。 - 特許庁

In a coating process, the current collecting foil is heated with a heating back roll 18.例文帳に追加

この塗布工程中、集電箔１４は、加熱バックロール１８によって加熱されている。 - 特許庁

A negative current collector foil 15, the polymer electrolyte layer, and a positive current collector foil 1 are folded back in belt, with no disconnection.例文帳に追加

負極集電体箔１５、ポリマー電解質層及び正極集電体箔１２は帯状に連続した状態で折畳まれる。 - 特許庁

Thereafter, the back of the conductive foil 40 is etched, thereby isolating each conductive pattern 11.例文帳に追加

その後に、導電箔４０の裏面のエッチングを行うことで、各導電パターン１１の分離を行う。 - 特許庁

To transfer even to an inexpensive polyolefin resin with good adhesion, to facilitate the post-treatment of a base material sheet after peeling, to improve the abrasion resistance of a molding, and to prevent the generation of ununiform coating and a back trap during the production of foil, blocking during foil handling, foil expansion and wrinkles during foil-decoration and others.例文帳に追加

安価なポリオレフィン系樹脂でも密着良く転写でき、剥離後の基材シートの後処理も容易で、成形品の耐摩耗性も良く、箔製造時の塗工ムラやバックトラップ、箔取扱時のブロッキング、絵付時の箔の膨れや皺等を起こさない。 - 特許庁

The device includes a semiconductor substrate; a back electrode formed on the non-photosensitive surface side of the semiconductor substrate; and a copper foil overlapped on the back electrode so as to make continuity with the back electrode, so that the copper foil is electrically connected to other solar battery device through leads.例文帳に追加

半導体基板と、前記半導体基板の非受光面側に形成された裏面電極と、前記裏面電極と導通するように該裏面電極に重ねられ、他の太陽電池素子とリードを介して電気的に接続される銅箔と、を備えるものである。 - 特許庁

A front connection part 18 and a back connection part 17 are formed by subjecting a copper foil on the front and back surfaces of a printed wiring substrate 11 to pattern forming.例文帳に追加

表接続部１８および裏接続部１７はプリント配線基板１１の表裏面の銅箔に対してパターン形成を行って形成する。 - 特許庁