基磨次の英語

次に、シリコン基板１の上面側を適宜に研磨する。例文帳に追加

The upper face-side of the silicon substrate 1 is appropriately polished. - 特許庁

次に、このＳＯＩ基板を研磨して薄層化する。例文帳に追加

Next, this SOI substrate is polished to thin a layer. - 特許庁

情報記録媒体用ガラス基板は、ガラス素板に１次研磨処理及び２次研磨処理を施すための研磨工程を経て製造される。例文帳に追加

The glass substrate for the information recording medium is manufactured through the polishing step of subjecting a glass base plate to primary polishing and secondary polishing. - 特許庁

次に、第１の研磨工程の後に行う第２の研磨工程では、半導体基板の基板中心部よりも基板縁部の研磨速度を速くする。例文帳に追加

In the second polishing process which is performed after the first polishing process, the polish speed of the substrate edge is made higher than that of the substrate core of the semiconductor substrate. - 特許庁

ガラス基板の切断分離後、切断分離面に研磨液を塗布して切断分離面を研磨し、次にこの研磨液を除去する。例文帳に追加

The method comprises cutting off a glass substrate, polishing the cutoff surface of the glass substrate with a polishing fluid, and subsequently removing the polishing fluid from the surface. - 特許庁

磁性研磨スラリーを用いた局所研磨を基板に施しても、磁性研磨スラリーの残留による凸欠陥や、次工程への磁性研磨スラリーの持込みによる凹欠陥の発生を防止する。例文帳に追加

To prevent a projection defect due to residual magnetic polisher slurry or a recess defect due to magnetic polishing slurry carried in a succeeding step, even when a substrate is subjected to local polishing using magnetic polishing slurry. - 特許庁

次に、研磨パッド１０２の上に研磨液１１０を滴下しながら、研磨定盤１０１と基板保持台１０４を回転させてウエハ１０３を研磨する。例文帳に追加

Next, a polishing liquid 110 is dropped onto the polishing pad 102, and the wafer 103 is polished while the polishing plate 101 and the substrate holding table 104 are being rotated together. - 特許庁