5端子対接合の英語

半導体素子４の端子５と、基板２の電極３とが対向した状態で、接合部６により接合されて、半導体素子４が基板２に実装される。例文帳に追加

A terminal 5 of a semiconductor element 4 is joined to an electrode 3 of a substrate 2 by a joining part 6 in a state facing to each other, and the semiconductor element 4 is mounted on the substrate 2. - 特許庁

電極表面状態が対外接続にとって不良な電極１Ａ、１Ｂと接合層１０との接着強度を、評価用端子機と接合層１０との接着強度より低く設定する。例文帳に追加

Alternatively, the adhesive strength of the electrodes 1A, 1B, having a faulty electrode surface state for an external connection is set lower than the adhesive strength of the terminal 5 for evaluation to the bonding layer 10. - 特許庁

電極表面状態が対外接続にとって良好な電極１Ａ、１Ｂと接合層１０との接着強度を、評価用端子５と接合層１０との接着強度より高く設定する。例文帳に追加

The adhesive strength of electrodes 1A, 1B, having a satisfactory electrode surface state for an external connection to a bonding layer 10, is set to higher than the adhesive strength of a terminal 5 for evaluation to the bonding layer 10. - 特許庁

エリアアレイ実装部品１を導電接着剤７により回路基板５に接合してなる電子部品の実装構造体において、エリアアレイ実装部品１に形成された第一の端子電極２に対して回路基板５側に形成された第二の端子電極４のサイズを小さくする。例文帳に追加

In the mounting structure for an electronic component composed of the area array mounting component 1 joined to the circuit substrate 5 with a conductive adhesive agent 7, the size of a second terminal electrode 4 formed at the side of the circuit substrate 5 is decreased compared with that of a first terminal electrode 2 formed on the area array mounting component 1. - 特許庁

バスバー５は、接続端子３１と対面する部位５６において、バスバー５の端部を所定の間隔を空けて陥没させた２つの凹部５３同士の間に残された山状残部５４を溶融させて、接続端子３１と接合してある。例文帳に追加

The bus bar 5 has a structure in which in a portion 56 facing the connection terminal 31, a mound-like residual portion 54 remaining between two concave portions 53 formed by recessing the ends of the bus bar 5 with a predetermined gap is molten and bonded to the connection terminal 31. - 特許庁

実施形態によれば、扁平形状をなし、第１の面と反対側の第２の面とが熱融着により接合されたフィルム製外装部材５と、外装部材５内に収納された電極群と、正極端子１１と、負極端子１３とを具備する非水電解質電池が提供される。例文帳に追加

According to one embodiment, a flat nonaqueous electrolyte battery is provided with a film exterior member 5 having a first surface and a second surface opposing to the first surface that are connected by thermal fusion; an electrode group housed in the exterior member 5; a positive electrode terminal 11; and a negative electrode terminal 13. - 特許庁

下地基板５上の作用極２、対極３および参照極４からなる電極から外部端子８への配線を下地基板５の内部で行うことにより、配線の厚みによる接合部分の凹凸を無くす。例文帳に追加

To remove irregularities on a joint part caused by the wiring thickness by performing wiring from an electrode comprising a working electrode 2, a counter electrode 3 and a reference electrode 4 on the base substrate 5 to an external terminal 8 inside the base substrate 5. - 特許庁

電極群４の幅方向一端部で隣接する正電極１同士の対向面間に、該対向面間の間隔を略一定に保ちつつ該正電極１同士を接合する導電性の介在部材７を介在させた状態で、正電極１と正極集電端子５とが接合されている。例文帳に追加

In this case, the positive electrode 1 and the positive collector terminal 5 are connected in a condition where conductive intermediary members 7 which connects the positive electrodes 1 keeping almost constant intervals between opposing surfaces of the positive electrodes 1 abutting at one end of the electrode group 4 in the width direction are placed between the opposing surfaces. - 特許庁