electrodepositとは 意味・読み方・使い方

Subsequently, direct-current electricity is flowed between both these electrodes 2 and 6, so that an ion, which is dissolved in water leaked from the leakage part 4, can be deposited as an electrodeposit into the leakage part 4.例文帳に追加

続いて、これらの両電極２及び６間に直流電流を流して漏水部４から漏れる漏水中に溶存するイオンを電着物として漏水部４に析出させる。 - 特許庁

To facilitate the attachment and detachment of the edge insulating member of an electrode plate used in metal electrorefining to and from the electrode plate, to increase the adhesion to the electrode plate, insulation and strength, to easily release a cathode electrodeposit from the electrode plate and to obtain a quality refined material.例文帳に追加

金属の電解精製工程に用いられる電極板の縁部絶縁部材において、電極板への脱着作業を容易とし、電極板との密着性および絶縁性を高め、かつ強度を向上させる。 - 特許庁

To provide an unleaded cationic electrodepositing paint capable of preventing a defective part from corrosion even in the case of performing the electrodeposit-painting on a subject to be painted having defective parts in some parts of a chemical membrane formed on the surface by a spraying method, etc.例文帳に追加

スプレー方法等によって表面に形成された化成皮膜に一部欠損部分を有している被塗物に電着塗装した場合でも、欠損部分の腐食を防止することができる、無鉛性カチオン電着塗料組成物を提供すること。 - 特許庁

In the surface treatment method for the copper foil, by which a roughened layer composed of copper electrodeposit is formed on the surface of the copper foil 4, a copper plating solution 3 contains polyethylene glycol having molecular weight of 200-500,000.例文帳に追加

銅めっき液３中で銅箔４を陰極としてめっき処理を行うことによって、銅箔４の表面に銅電着物からなる粗化層を形成する銅箔の表面処理方法であって、銅めっき液３は、分子量２００〜５０００００のポリエチレングリコールを含む。 - 特許庁

A method for refining electrophoresis particles is characterized in that only electrodeposited particles are collected after two electrode substrates are dipped in fluid dispersions prepared by dispersing particles having electrophoretic property in a nonpolar solvent and a DC voltage is applied between their electrodes to electrodeposit the particles on one electrode substrate.例文帳に追加

電気泳動性を有する粒子を非極性溶媒に分散させた粒子分散液に２つの電極基板を浸漬し、これら電極間に直流電圧を印加して一方の電極基板に該粒子を電着させた後、電着した粒子のみを回収することを特徴とする電気泳動粒子の精製方法。 - 特許庁

In wirings having a structure that consists of a first layer metal film wiring, a second metal film wiring having a constant side etching portion and an insulating film pattern, a field plating processing is performed to the concave region corresponding to a side etching portion of the second layer metal film wiring and low resistance metal such as Cu and Ag is made to electrodeposit thereon.例文帳に追加

第１層金属膜配線と、一定のサイドエッチング部を有する第２層金属膜配線と、絶縁膜パターンの３層膜から成る構造の配線に於いて、電界メッキ処理により前記第２層金属膜配線のサイドエッチング部に相当する凹形領域に、銅や銀の低抵抗金属を電着させる。 - 特許庁

In this electrodeposition tool composed of a structure in which abrasives adhere on a surface of a tool shaft member and are held and fixed by an electrodeposited metal, electroless plating is applied to exposed faces of the abrasives and the surface of the shaft member integrally after attaching the abrasives to the surface of the shaft member by the electrodeposited metal temporarily to electrodeposit and fix the abrasives on the shaft member through an electroless-plated film.例文帳に追加

工具軸材の表面に砥粒を付着させ、電着金属で保持固定した構造からなる電着工具において、該砥粒を該軸材表面に電着金属で一旦仮付した後、該砥粒の露出面と軸材表面を一体的に無電解メッキし、該無電解メッキ膜を介して該砥粒を該軸材に電着固定してなることを特徴とする。 - 特許庁

The problem is solved by an electrodeposited copper foil manufacturing process including the following stages: a stage for preparaing a copper deposition bath containing water, copper ion, sulfate ion and < about 20 ppm chlorine ion and a stage for applying a current to the bath at about 200 to 3,000 A/ft2 current density to electrodeposit copper from the bath.例文帳に追加

次の工程を包含する電着銅箔の製造方法により上記課題が達成される：水、銅イオンおよび硫酸イオンを含有し、約２０ｐｐｍ未満の塩素イオンを含有する銅析出浴を調製すること；および上記浴に、１平方フィートあたり約２００から３０００アンペアの割合の電流密度で電流を付与して上記浴から銅を電着させること。 - 特許庁