flush conductorとは 意味・読み方・使い方

The matching of the characteristic impedance at the connection between the line conductor 3 and the through conductor 5 is contrived, and also the unwanted radiation of electromagnetic waves from between the line conductor 3 and the flush grounding conductor 6 can be suppressed.例文帳に追加

線路導体３と貫通導体５との接続部での特性インピーダンスの整合を図るとともに、線路導体３と同一面接地導体６との間からの電磁波の不要輻射を抑制することができる。 - 特許庁

A conductor post 3 for connection of the external connection terminals is formed on a conductor pattern 2 formed on a base member 1, and an insulation resin sheet is laminated on the conductor pattern 2 formed with the conductor post 3 so as to be flush with the end face of the conductor post 3 exposed to the board surface.例文帳に追加

基材１上に形成された導体パターン２上に外部接続端子接続用の導体ポスト３が形成され、該導体ポスト３が形成された導体パターン２上に絶縁樹脂シートが基板表面に露出した前記導体ポスト３の端面と面一になるように積層されている。 - 特許庁

Then, an Au flush plating layer 21 of a film thickness of 0.3 μm or less is deposited to be formed in the surface wiring conductor 2.例文帳に追加

そして、前記表面配線導体２には、膜厚０．３μｍ以下のＡｕフラッシュメッキ層２１が被着形成されている。 - 特許庁

A plating conductor 5 is deposited to embed the inside of an opening 4a in a solder resistant resin layer 4 therewith, and the surface of the plating conductor 5 is polished such that the surface is flush with the surface of the solder resistant resin layer 4, and further a solder bump 6 is joined with the polished plating conductor 5.例文帳に追加

耐半田樹脂層４の開口部４ａ内を埋めるようにしてめっき導体５を被着させるとともに、めっき導体５の表面を耐半田樹脂層４の表面と同一平面をなすように研磨し、その研磨されためっき導体５上に半田バンプ６を接合させた。 - 特許庁

The transfer base 6 is separated from the resin layer 4, while the conductor circuits 5 are left in the resin layer 4 to transfer them to the resin layer 4 in a manner wherein the outer surface of the resin layer 4 is flush with the exposed faces of the conductor circuits 5.例文帳に追加

転写用基材６を樹脂層４から剥離すると共に導体回路５を樹脂層４側に残存させて導体回路５を樹脂層４に転写して樹脂層４の外面と導体回路５の露出面とが面一になるように形成する。 - 特許庁

The transfer base 6 is delaminated from the resin layer 4 while the conductor circuits 5 are left in the resin layer 4 to transfer them to the resin layer 4 in a manner wherein the outer surface of the resin layer 4 is flush with the exposed faces of the conductor circuits 5.例文帳に追加

転写用基材６を樹脂層４から剥離すると共に導体回路５を樹脂層４側に残存させて導体回路５を樹脂層４に転写して樹脂層４の外面と導体回路５の露出面とが面一になるように形成する。 - 特許庁

To provide a wiring board in which the effect of a parasitic capacitance between an electrode pad and a surface conductor can be reduced effectively even when the face conductor is arranged in flush with the electrode pad and thereby impedance matching in the entire signal transmission path can be realized easily.例文帳に追加

電極パッドと同一面に面導体が配置される場合でも、電極パッドと面導体との寄生キャパシタンスの影響を効果的に縮小でき、ひいては信号伝送経路全体のインピーダンス整合を容易に実現できる配線基板を提供する。 - 特許庁