「なんたいどうぶつもん」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

樹脂と、昆虫網動物防除剤と、を含有してなる昆虫網動物防除部材１０と、銅成分を含有する軟体動物門腹足網動物防除部材２０を備え、昆虫網動物防除部材１０に軟体動物門腹足網動物防除部材２０を配設してなる害虫防除部材１である。例文帳に追加

Provided is the insect pest control member 1 which comprises an Insecta animal control member 10 comprising a resin and an Insecta animal control agent, and a member 20 used for controlling animals in Mollusca, Gastropoda and containing a copper ingredient, wherein the member 20 used for controlling the animals in the Mollusca, Gastropoda is disposed in the Insecta animal control member 10. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、難燃性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing a semiconductor which shows excellent fire retarding property without a halogen-based fire retarding agent and an antimony compound. - 特許庁

ハロゲン化合物やアンチモン化合物、リン系化合物などの難燃剤を使用しなくとも、その硬化物において難燃性を付与し、且つ優れた流動性・耐熱性を有するエポキシ樹脂組成物および半導体装置を提供すること。例文帳に追加

To provide an epoxy resin composition the cured product of which has flame retardancy without use of a flame retardant such as a halogen compound, an antimony compound, and a phosphorus compound, and which has excellent flowability and heat resistance, and to provide a semiconductor device. - 特許庁

ハロゲン化合物やアンチモン化合物などの難燃剤を使用することなく、その硬化物において難燃性を示す半導体封止用エポキシ樹脂組成物を提供する。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing giving a cured material having flame-retardancy, without using a flame-retardant such as a halogen compound and an antimony compound. - 特許庁

本発明はハロゲン化合物やアンチモン化合物などの難燃剤を使用することなく、その硬化物において難燃性を示す半導体封止用エポキシ樹脂組成物を提供することを目的とする。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing, giving a cured product having flame retardancy without using a flame-retardant such as a halogen compound and an antimony compound. - 特許庁

ハロゲン系、三酸化アンチモン等の難燃剤を含まない難燃性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing not containing a flame retardant such as a halogen flame retardant or antimony trioxide and excellent in flame retardance. - 特許庁

臭素系難燃剤やアンチモン化合物を含有しない、成形性、信頼性、難燃性に優れた半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing which does not contain bromine-based flame retardants nor antimony compounds and is excellent in moldability, reliability and flame retardancy and to provide a semiconductor device using it. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、成形性、速硬化性、流動性及び難燃性、高温保管特性、耐湿信頼性及び耐半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition which is useful for sealing semiconductors and has excellent moldability, fast curability, flowability, flame retardancy, high temperature storage characteristics, moisture resistance reliability and solder crack resistance. - 特許庁

臭素系難燃剤、アンチモン化合物の含有量が極微量であるか、あるいは全く含有しない、成形性、信頼性、難燃性に優れた半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing a semiconductor containing a trace amount of a bromine-based flame retardant, an antimony compound or none of them, which is excellent in moldability, reliability, and flame resistance; and a semiconductor device using the same. - 特許庁

ハロゲン系難燃剤、りん系難燃剤、及びアンチモン化合物を使用することなく、優れた難燃性を有する難燃性エポキシ樹脂組成物、およびそれを用いた成形性、難燃性、半田耐熱性に優れた半導体封止材料、更には信頼性に優れた半導体装置を提供する。例文帳に追加

To provide a flame-retardant epoxy resin composition having excellent flame retardance without using any halogen flame retardant, phosphorus flame retardant, nor any antimony compound, to provide a semiconductor-sealing material having excellent moldability, flame retardance, and resistance to soldering heat by using the composition, and to provide a semiconductor device excellent in reliability. - 特許庁

ハロゲン系難燃剤やアンチモン系難燃剤を使用することなしに、難燃性が優れると共に耐湿信頼性に優れた半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置を提供する。例文帳に追加

To obtain an epoxy resin composition for semiconductor sealing, having excellent flame retardance and reliability of moisture resistance without using a halogen-based flame retardant or an antimony-based flame retardant and to provide a resin-sealed semiconductor device. - 特許庁

本発明は、速効性を有し、駆除対象である腹足類に属する軟体動物による汚染を実質的に完全に防ぎ、しかも臭い、着色、植物に対する薬害等の問題もない、腹足類に属する軟体動物用駆除剤を提供することを目的とする。例文帳に追加

To obtain an expellant for a mollusc belonging to gastropoda, having an immediate effect, substantially completely preventing contamination by mollusc belonging to gastropoda, having no problems of smell, discoloration, phytotoxicity to plants, etc. - 特許庁

ハロゲン含有難燃剤及びアンチモン化合物等の難燃剤を含まず、成形性、難燃性、高温保管特性及び耐湿信頼性に優れた特性を有する半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide a semiconductor-sealing epoxy resin composition free from a halogen-containing flame retardant and an antimony compound, and excellent in characteristics such as molding properties, flame-retardancy, storage properties at a high temperature and reliability for moisture resistance. - 特許庁

流動性、硬化性等の成形性、耐半田クラック性に優れ、臭素化合物、アンチモン化合物を配合しなくても難燃性に優れるため高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing a semiconductor excellent in moldability such as flowability and curability, and soldering crack resistance, and having good high temperature storage characteristics due to excellent flame resistance without formulating a bromide or an antimonide. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、流動性、硬化性等の成形性、難燃性、高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for encapsulating semiconductors which contains no halogen-based flame retardant and no antimony compound and also is excellent in such moldability as flowability and curability and in flame retardancy and high-temperature storage characteristics. - 特許庁

実質的にハロゲン系難燃剤、アンチモン化合物を含まずとも、流動性、硬化性等の成形性、難燃性、高温保管特性、耐半田性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide a semiconductor-sealing epoxy resin composition excellent in flowability, moldability including curability, flame retardancy, high-temperature storage characteristics, and resistance to soldering, while not substantially containing a halogen-based flame retardant, nor an antimony compound. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、流動性、硬化性等の成形性、難燃性、耐半田性、高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing a semiconductor, excellent in moldability such as fluidity and curability, flame retardancy, solder resistance, and characteristics in high-temperature preservation without containing a halogen-based flame retardant and an antimony-based compound. - 特許庁

ハロゲン系難燃剤及びアンチモン化合物を含まず難燃性、流動性や硬化性等の成形性、耐半田性、高温保管特性に優れた特性を有する半導体封止用エポキシ樹脂組成物を提供こと。例文帳に追加

To provide an epoxy resin composition for encapsulating a semiconductor device that does not comprise a halogen flame retardant and an antimony compound, and that has properties excellent in flame retardancy, molding behavior such as flowability and curability, soldering resistance and high-temperature storing characteristics. - 特許庁

有害物質生成の原因となるハロゲン化合物やアンチモン化合物を含有せず、優れた難燃性とともに、高い成形性や耐湿性を示すエポキシ樹脂組成物と、それを用いて封止された半導体装置を提供する。例文帳に追加

To provide an epoxy resin composition which can exhibit excellent flame retardancy in spite of containing no halogen compound or antimony compound causing a harmful substance to form and has high moldability and moisture resistance and to provide a semiconductor device sealed therewith. - 特許庁

臭素系難燃剤やアンチモン化合物を含有しない、成形性、信頼性、難燃性に優れた半導体封止用エポキシ樹脂組成物及びそれを用いて半導体素子を封止してなる樹脂封止型半導体装置を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing semiconductors, containing neither a brominated flame retardant nor an antimony compound and having excellent moldability, reliability and flame retardance, and to provide a resin-sealed semiconductor device by sealing a semiconductor element with the composition. - 特許庁

ハロゲン、アンチモン、リンを含有することなく、難燃性を得ることができる半導体封止用エポキシ樹脂組成物を提供する。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing use having flame retardancy even without containing halogen, antimony or phosphorus. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を使用せずに成形性、及び難燃性、高温保管特性、耐湿信頼性、及び耐半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing semiconductors excellent in moldability, flame retardance, high-temperature storage characteristics, moisture resistant reliability and solder crack resistance without using a halogen-based flame retardant and an antimony compound. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、高温保管特性、耐湿信頼性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing a semiconductor, excellent in moldability, flame retardancy, characteristics in high temperature preservation, and moisture proof reliability without containing a halogen-based flame retardant and an antimony compound. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、耐湿信頼性、耐半田性、難燃性、及び高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing a semiconductor having excellent moldability, reliability of moisture resistance, solder resistance, flame retardance and high-temperature storage characteristics without containing a halogen flame retardant and an antimony compound. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、難燃性、高温保管特性、及び耐湿信頼性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing not containing a halogen-based flame retardant and an antimony compound and excellent in flame retardance, high-temperature storage characteristics and moisture proof reliability. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、高温保管特性、耐湿信頼性、耐半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for semiconductor sealing use free from any halogen-based flame retardant and antimony compound and excellent in moldability, flame redundancy, high-temperature storability, moistureproof reliability and soldering crack resistance. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、難燃性、高温保管特性及び耐湿信頼性に優れた特性を有する半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing use containing neither halogen-based flame retardant nor antimony compound, and excellent in flame retardancy, high-temperature storability and moisture- proofness reliability. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、成形性、及び難燃性、高温保管特性、耐湿信頼性及び耐半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing a semiconductor excellent in moldability, flame retardancy, characteristics in high-temperature preservation, moisture proof reliability and solder crack resistance without containing a halogen-based flame retardant and an antimony compound. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、高温保管特性、耐湿信頼性、及び耐半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing which has excellent moldability, flame resistance, a high-temperature storage characteristic, reliability on moisture resistance and solder crack resistance and contains neither a halogen flame retardant nor an antimony compound. - 特許庁

ハロゲン系難燃剤及びアンチモン化合物を含まず、成形性、及び難燃性、高温保管特性、耐湿信頼性及び耐半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供する。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing use containing neither halogen-based flame retardant nor antimony compound, and excellent in moldability, flame retardancy, high-temperature storability, moisture-proofness reliability and soldering crack resistance. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、硬化性、及び難燃性、耐湿信頼性及び耐半田性、高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing semiconductors excellent in curability, flame retardance, reliability of moisture resistance and solder resistance and high-temperature storage characteristics without containing a halogen-based flame retardant and an antimony compound. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず成形性、難燃性、耐半田性、耐湿信頼性、及び高温保管特性に優れた特性を有する半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing not containing a halogen-based flame retardant and an antimony compound and excellent in moldability, flame retardance, resistance to soldering, reliability to moisture resistance and high-temperature storage property. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、成形性、難燃性、高温保管特性、耐湿信頼性及び半田クラック性に半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition which does not contain a halogen-based flame retardant and an antimony compound, has moldability, flame retardancy, high temperature storage characteristics, moisture-resistant reliability and solder crack resistance and is used for sealing semiconductors. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、高温保管特性、耐湿信頼性、耐半田性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor-sealing which does not contain a halogenous flame retardant and an antimony compound and is excellent in moldability, flame retardance, high-temperature storage characteristics, moisture-resistance reliability and soldering resistance. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、成形性、及び難燃性、高温保管特性、耐湿信頼性、及び半田クラック性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing a semiconductor, containing neither a halogenated flame retardant nor an antimony compound, and excellent in moldability, flame retardancy, high-temperature storage characteristics, reliability in moisture resistance, and soldering crack resistance. - 特許庁

臭素系難燃剤、アンチモンを含有しない、成形性、信頼性、並びに難燃性に優れた半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置を提供すること。例文帳に追加

To provide a semiconductor sealing resin composition excellent in moldability, reliability and flame retardance which does not contain a bromine type flame retardant and antimony, and a semiconductor device using the same. - 特許庁

臭素化合物、及びアンチモン化合物を含まず、成形性、耐半田ストレス性、高温保管特性、及び難燃性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for semiconductor sealing which has excellent moldability, soldering stress resistance, high-temperature storing characteristics and flame retardance without containing a bromine compound and an antimony compound. - 特許庁

臭素化合物、アンチモン化合物を含まなくとも難燃性に優れ、かつ高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition which ahs excellent high temperature storage characteristics and excellent flame retardance, even when a bromine compound or an antimony compound is not contained. - 特許庁

ハロゲン系難燃剤及びアンチモン化合物を含まず、流動性、離型性等の成形性、耐半田クラック性に優れた特性を有する半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for sealing semiconductors not containing a halogen type flame retardant and an antimony compound and which is excellent in flow property, moldability such as mold releasability, and resistance to crack when soldering. - 特許庁

環状ホスファゼン化合物の添加量が少なくて済むために無機充填材の添加量も少なく流動性に優れ、更に臭素化合物、アンチモン化合物を使用せずに難燃性を向上させた、優れた耐半田性を有する半導体封止用エポキシ樹脂組成物を得ること。例文帳に追加

To obtain an epoxy resin composition for sealing a semiconductor, little in amount of added inorganic filler and excellent in fluidity because only a little amount of an added cyclic phosphazene compound is needed, and further having improved flame retardancy without using a bromine compound and an antimony compound, and excellent solder resistance. - 特許庁

流動性、硬化性等の成形性、接着性、硬化物の高温時の低応力性、耐半田性に優れ、臭素化合物、アンチモン化合物を配合しなくても難燃性に優れるため高温保管特性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide a semiconductor sealing epoxy resin composition being excellent in moldability such as fluidity and curability, adhesion, giving a cured product excellent in high-temperature low-stress properties and soldering resistance, and being excellent in high-temperature storability owing to its excellent flame retardancy exhibited in spite of the absence of a bromine compound and an antimony compound. - 特許庁

常温保存特性、成形性、難燃性、耐半田性、及び耐湿信頼性に優れ、実質的にハロゲン、アンチモンを含まないため環境に対する安全性の高い半導体封止用エポキシ樹脂組成物、特に挿入実装、表面実装対応の半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for semiconductor sealing use having high normal-temperature preservability, moldability, flame retardancy, soldering resistance and moistureproofness reliability and having high environmental safety because of substantially free from any halogen and antimony, in particular compatible with insert mounting and surface mounting designs. - 特許庁

ハロゲン系難燃剤、及びアンチモン化合物を含まず、成形性、難燃性、及び耐半田性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing semiconductors, which does not contain a halogen-based flame retardant and an antimony compound, has an excellent moldability, flame retardancy and soldering resistance. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、耐半田リフロー信頼性に優れた半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To obtain an epoxy resin composition for semiconductor-sealing free from a halogen-containing flame-retardant and an antimony compound and excellent in molding properties, flame retardancy and solder reflow resistance reliability. - 特許庁

ハロゲン系難燃剤、アンチモン化合物を含まず、成形性、難燃性、高温保管特性及び耐半田クラック性に優れた特性を有する半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition for sealing a semiconductor device, having an excellent moldability, flame retardancy, storage properties at a high temperature and soldering crack resistance without halogen-based flame retardant nor an antimony compound. - 特許庁