等厚線図の英語

図１（ａ）に示される破線は、板厚が同じ部位をそれぞれ結んだ等厚線であり、中央部１０ｃから周縁部１０ａに向かって各方向とも、一定の割合で、連続的に板厚が薄くなっている。例文帳に追加

The broken lines shown in Fig. 1 (a) are contour lines connecting the portions equal in thickness respectively, and the thickness is made continuously thinner at a fixed ratio toward the peripheral edge section 10a from the central section 10c in all directions. - 特許庁

ブラケット２，内面に、耐磨耗耐漏電処理を施した全面、又は部分的に厚みの少ない通電回路素子構造体（図７、図８、図１１等）を設置する事により、・配線損傷事故 ・工事省力化 ・少ペース化をはかる。例文帳に追加

A current-carrying circuit element structure with a wholly or partially small thickness, which undergoes abrasion-resistant and electric leakage-resistant treatment, is installed on the inner surface of a bracket 2, so that an accident causing damage to the wiring can be prevented and so that labor for construction work and the space can be saved. - 特許庁

図１に示すように、プリント配線板１を構成し、この配線板に対して厚み方向に均等に積層された３層のガラスエポキシ基材４の間に、それぞれガラスエポキシ基材４よりも線膨張係数の小さい低線膨張係数材層５を配置する。例文帳に追加

A printed wiring board 1 is arranged as shown on Fig. 1, where low thermal expansion coefficient material layers 5 having a coefficient of thermal expansion lower than that of a glass epoxy basic material 4 are sandwiched between three glass epoxy basic materials 4 placed uniformly in the thickness direction of the wiring board. - 特許庁

半導体基板両面において形成される膜厚差を低減させることにより、配線等に加わる機械的ストレスを軽減し、品質の安定化を図る。例文帳に追加

To stabilize the quality of a semiconductor device by reducing the mechanical stress applied to wiring, etc., by reducing the thickness difference between the films formed on both surfaces of a semiconductor substrate. - 特許庁

厚膜化を図ることができ、導電膜とした場合に断線や短絡等の不具合が生じにくい膜パターンの形成方法及び膜パターン形成装置を提供する。例文帳に追加

To provide a film pattern forming method and a film pattern forming apparatus in which a thick film can be formed and a fault such as wire breakage and short circuit does not occur easily when a conductive film is formed. - 特許庁

筒状部材の円筒部肉厚等にかかわらず、またレーザー照射条件の微妙な調整をすることなく、筒状部材の溶接スポットに生じる空孔の生成を防止して品質向上を図ることができる線状部材の溶接方法を提供する。例文帳に追加

To improve quality by preventing formation of a void hole generating in a wedded spot of a cylindrical member irrespective of thickness or others of the cylindrical part of the cylindrical member and without fine adjustment of laser beam emitting condition. - 特許庁

その後、積層方向から見て庇７と重なる位置に設定した分割線Ｄに沿ってへき開を行うことにより、半導体レーザ素子１の両端面１ａ，１ａに至るまで、下地電極層４をほぼ等厚で延在し、半導体レーザ素子１の発光効率の向上が図られる。例文帳に追加

Thereafter, cleavage is performed along a division line D set at a position overlapping the eaves 7 when viewed from the laminating direction so that the underlying electrode layer 4 extends with a substantially equal thickness up to the opposite end faces 1a and 1a of the semiconductor laser element 1 thus enhancing emission efficiency of the semiconductor laser element 1. - 特許庁