They are on board.とは 意味・読み方・使い方

It must match the order in which they are selected on the graphics board.例文帳に追加

使用するグラフィックスボード上でクロックが選択される順序に合っていなければならない。 - XFree86

While they are not turned, the board storage case is fixed to the back surface 6a of a game board 6 by a special screw 364 in the state that a lid 34 is put on.例文帳に追加

回動しない間、基盤収納ケースは蓋３４がされた状態で特殊螺子３６４によって、遊技盤６の裏面６ａに固定される。 - 特許庁

While they are still separated from the printed board 100, the main circuit board 1 is placed on the bottom of a box 10.例文帳に追加

プリント基板１００から切り離した状態において、主要回路基板１は、筐体１０内の底部に設置される。 - 特許庁

Abutment parts 4 and 5 on both ends in the circumferential direction of board materials 2 and 3 are constituted without overlapping each other, and the abutment part 4 of the board material 2 on the outermost layer and the abutment part 5 of the board material 3 on its inside are arranged, so that they do not match each other.例文帳に追加

板材２，３における周方向の両端の合わせ部４，５を重合しない状態にし、その最外層の板材２の合わせ部４とその内側の板材３の合わせ部５を相互に一致しないように配置する。 - 特許庁

While exports are recorded on FOB (Free on Board) basis and imports on CIF (Cost, Insurance and Freight) basis in the trade statistics, as for the trade balance in the Balance of Payments Statistics, they both are recorded on FOB basis (insurance and freight are recorded in the service balance).例文帳に追加

貿易統計は、輸出はFOB（Free On Board）建て、輸入はCIF（Cost, Insurance and Freight）建てで計上されるが、国際収支統計の貿易収支は、いずれもFOB 建てで計上されている等の相違がある（保険及び運賃はサービス収支に計上）。 - 経済産業省

The auxiliary solder pads 32 are placed on the diagonal line 35 of the ceramic board 11 on the rear surface 13 of the board, and they are placed at corners 33 of the ceramic board 11 at the same time.例文帳に追加

複数の補助ソルダーパッド３２は、基板裏面１３上においてセラミック基板１１の対角線３５上の位置に配置され、かつセラミック基板１１のコーナー部３３に配置される。 - 特許庁

The solder balls 49 are jointed on a solder ball jointing part 48 located at the back face 13 of the wiring board 10, and connected to a board 61 with an optical waveguide, when they are mounted on the board 61 with an optical waveguide.例文帳に追加

はんだボール４９は、配線基板１０の裏面１３に位置するはんだボール接合部４８上に接合され、光導波路付き基板６１への搭載時に光導波路付き基板６１に接続される。 - 特許庁

The widths of the pads 2a and 2b formed respectively on the upper and lower surfaces of the circuit board 1 are adjusted according to the specific inductive capacity ε_r of the circuit board 1, and they are set to about two to four times the width of a signal line 3 provided on the circuit board 1.例文帳に追加

回路基板１の上面及び下面に設けられたパッド部２ａ及び２ｂの幅を回路基板１の比誘電率ε_rに応じて調整し、回路基板１に設けられた信号線３の幅のおよそ２〜４倍に設定する。 - 特許庁