rough polishingとは 意味・読み方・使い方

Rough polishing is performed by high-speed reciprocating motion, and finish polishing is performed by low-pressure reciprocating motion.例文帳に追加

高速で往復動させることにより粗研磨を行い、低圧往復動で仕上げ研磨を行うようにしている。 - 特許庁

To provide a rough sorting machine for beans having two functions such as sorting and surface polishing.例文帳に追加

選別と表面研磨の２つの機能を備えた豆類粗選機にする。 - 特許庁

To provide a polishing method for a ferrule and a polishing device capable of performing the removal of adhesive and rough polishing of an end face together, using a polishing member efficiently, and polishing the end face in a short time.例文帳に追加

接着剤除去と粗端面研磨を一括して行い、研磨部材を効率的に使用し、かつ短時間で端面研磨が可能なフェルールの研磨方法および研磨装置を提供する。 - 特許庁

Both of rough polishing and finish polishing can be simultaneously performed by using the same polishing module and this polishing sheet 20 to shorten the time required for a polishing process and to use fewer consumables.例文帳に追加

この研磨シート２０によれば、同一の研磨モジュールでラフ研磨及び仕上げ研磨を一度に行うことができ、研磨工程の所要時間の短縮、及び、消耗品の削減が期待できる。 - 特許庁

In the rough polishing, the polishing is stopped at the stopper film 7 on the magnetic pole part 10 and performed accurately down to the thickness of the magnetic pole part 10.例文帳に追加

粗研摩は、磁極部１０上面のストッパ膜７により停止し、正確に磁極部１０の厚さに研摩される。 - 特許庁

Improvement of the polishing precision and prevention of the two-facedness are performed by arranging two kinds of polishing plates for rough polishing and precise polishing polishing speed of which is made different from each other by differring rotating speed on the polishing device and sequentially moving the single polishing head on these polishing plates.例文帳に追加

研磨装置に対して、回転速度の異ならせることにより研磨速度を異ならせた粗研磨用および精密研磨用の２種の研磨プレートを配置することとし、さらに単一の研磨ヘッドを順次これら研磨プレート上を移動させることにより研磨精度の向上と二面化の防止を達成する。 - 特許庁

In both the processes of the double-surface rough-polishing and the single-surface finish polishing, the wafer is placed and restrained on the lower surface plate 1, and the first upper surface plate for double-surface rough-polishing 12 and the second upper surface plate 13 for the single-surface finish polishing are exchanged for the wafer.例文帳に追加

両面粗研磨と片面仕上げ研磨との両工程において下定盤１上にウェハが載置保持されたままであり、このウェハに対し、両面粗研磨用の第一の上定盤１２と、片面仕上げ研磨用の第二の上定盤１３とが交換される。 - 特許庁

To attain low equipment cost, short manufacturing time, and labor saving by performing smooth polishing in two stages of double-surface rough- polishing and single-surface finish polishing with a relatively simple device.例文帳に追加

両面粗研磨及び片面仕上げ研磨の二段階の研磨を比較的簡単な装置でスムーズに行い、設備費抑制、製造時間短縮、省力化等を図る。 - 特許庁