接合用平線の英語

平角線１よりも低融点のろう材１１を、対導線１の端部２の両接合用側面５，５の間に介設した後、加熱ビーム１２を対導線１０の端面４側から照射する。例文帳に追加

A solder material 11, having a melting point lower than that of the flat type wire 1, is interposed between both side surfaces 5, 5 for bonding of the end portions 2 of the flat-type wires 1, and heating beam 12 is radiated from an end surface 4 side of the paired conductors 10. - 特許庁

引出配線の形成と基板との接合を同時に行い、かつ試料と基板の平行性を保持する引出配線の形成方法及びこの形成方法を適用した走査型プローブ顕微鏡用試料の作成方法を提供する。例文帳に追加

To provide a forming method of an outgoing wiring, which effects the forming of leader wiring and connection to a substrate simultaneously while retaining collimation between a test piece and the substrate, and a manufacturing method of the test piece for scanning-type probe microscope to which this forming method is applied. - 特許庁

半導体チップの電極表面および配線基板に接合された小さなばね定数を有するバンプの接合端面を平坦化および活性化し、高温高圧を負荷する必要のない常温接合技術を用い、バンプを介して半導体チップの電極と配線基板の電極とを電気的接続する。例文帳に追加

An electrode of the semiconductor chip is electrically connected with an electrode of the wiring substrate via the bump by flattening and activating the electrode surface of the semiconductor chip and joining end surface of the bump having a small spring constant joined with the wiring substrate and using the surface active bonding without necessity for loading high temperature and high pressure. - 特許庁

ＬＥＤ用基板(1)は、放熱部(10)の平坦面にＬＥＤ取付孔(14)が穿設された絶縁層(11)が接合され、前記絶縁層(11)上に配線パターンを有する配線部(12)が設けられていることを特徴とする。例文帳に追加

The substrate (1) for LED includes an insulating layer (11), through which an LED mounting hole (14) is made, joined with a flat surface of a heat dissipation part (10), and by a wiring (12) provided on the insulating layer (11) and having a wiring pattern. - 特許庁

Ｗ／Ｂ接合とＦＣ接合のための端子という、仕様の異なる２種類の端子を、一方の面に精度良く狭ピッチで配設し、一面側を平坦状に形成した半導体パッケージ用配線基板と、その製法を提供する。例文帳に追加

To provide a wiring substrate for a semiconductor package in which two types of terminals having different specifications called terminals for W/B bonding and FC bonding are arranged at a narrow pitch with good accuracy on one surface, and in which one surface side is formed flatly, and to provide a method of manufacturing the same. - 特許庁

少なくとも液保持層と液防漏層とを備え、周縁部で各層が接合されたおりもの吸収シートにおいて、その平面形状の内側に、Ｔバック形状の下着装着時に適合できる第２の使用形状の輪郭線に沿う接合ラインを設け、この接合ラインに沿っておりもの吸収シートを切り詰めることを可能とする。例文帳に追加

In the lochia absorption sheet comprises at least a liquid holding layer and a liquid leakage preventive layer in such a manner that the respective layers are connected at peripheral edges, a connecting line is provided along a contour line of a second using shape capable of conforming to the lingerie wearing time of the T-back shape, and the sheet can be cut short along the line. - 特許庁

圧接接合前において、電力用半導体チップ２の電極２Ａは凹凸形状の表面２ＡＳを有している一方、配線３の接続部３Ａは平坦な表面３ＡＳを有している。例文帳に追加

Before pressure welding, the electrode 2A of the power semiconductor chip 2 has a surface 2AS of an uneven shape, whereas a connection part 3A of the wiring 3 has a flat surface 3AS. - 特許庁

絶縁性平板１０、配線導体層１２、及び絶縁性接合材１４を貫通するスルーホール用の穴１６に導電性ペーストを埋め込み、スルーホール部１８を形成し、乾燥する。例文帳に追加

Conductive paste is embedded in holes 16 for through-holes which pass through the insulating plate 10, the conductive wiring layer 12, and the insulating junction material 14 and through-hole parts 18 are formed and dried. - 特許庁