「ねつぼうちょうけいすう」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

外部スリーブは、第一および第二熱膨張係数より小さい第三熱膨張係数を有する。例文帳に追加

The external sleeve has a third coefficient of thermal expansion smaller than the first and second coefficients of thermal expansion. - 特許庁

低熱膨張係数合金製溶接構造物および低熱膨張係数合金用溶接材料例文帳に追加

WELDED STRUCTURE MADE OF LOW THERMAL EXPANSION COEFFICIENT ALLOY, AND WELDING MATERIAL FOR ALLOY - 特許庁

該固定部材は熱膨張係数が上記フレームの熱膨張係数より小さい材料で構成する。例文帳に追加

The fixed member is constituted of material whose thermal expansion coefficient is smaller than that of the frame. - 特許庁

半導体層２０の熱膨張係数は、基板１０の熱膨張係数より大きい。例文帳に追加

The thermal expansion coefficient of the semiconductor layer 20 is higher than that of the substrate 10. - 特許庁

背面パネルの材料は、前面パネルの熱膨張係数とマッチされる熱膨張係数を有する。例文帳に追加

A material of the back panel has a thermal expansion coefficient matching the thermal expansion coefficient of the front panel. - 特許庁

抵抗体１０の合成熱膨張係数は、セラミックス基板の熱膨張係数に近いものになる。例文帳に追加

The composite thermal expansion coefficient of the resistive body 10 is close to the thermal expansion coefficient of the ceramic board. - 特許庁

さらに外筒体１０の熱膨脹係数は内筒体９の熱膨脹係数よりも小である。例文帳に追加

The thermal expansion coefficient of the external cylinder body 10 is smaller than the thermal expansion coefficient of the internal cylinder body 9. - 特許庁

基板１の熱膨張係数が第１のアンダーフィル樹脂４の熱膨張係数よりも大きい。例文帳に追加

The coefficient of thermal expansion of the substrate 1 is higher than that of the first underfill resin 4. - 特許庁

第２の体積熱膨張係数は、第１の体積熱膨張係数よりも高い。例文帳に追加

The second volumetric thermal expansion coefficient is higher than the first volumetric thermal expansion coefficient. - 特許庁

ＦＰＣ１１の熱膨張係数とアクチュエータ部材１の熱膨張係数とは、互いに異なる。例文帳に追加

The coefficient of thermal expansion of the FPC 11 is different from that of the actuator member 1. - 特許庁

応力緩衝層の熱膨張係数は、ヒートシンクの熱膨張係数未満である。例文帳に追加

A thermal expansion coefficient of the stress buffer layer is less than that of the heat sink. - 特許庁

コア２４の熱膨張係数は、本体２２の熱膨張係数とは異なる。例文帳に追加

The coefficient of thermal expansion of the core 24 is different from the coefficient of thermal expansion of the main body 22. - 特許庁

バリア層の熱膨張係数は基板の熱膨張係数の±０．５ｐｐｍ／℃以内とされる。例文帳に追加

The thermal expansion coefficient of the barrier layer is ±0.5 ppm/°C of that of the substrate. - 特許庁

中付形導電層１０の熱膨張係数が基板１２の熱膨張係数に適合している。例文帳に追加

The coefficient of thermal expansion of an internally adhering type conductive layer 10 conforms to the coefficient of thermal expansion of a substrate 12. - 特許庁

ヒートシンク２０は、リッジ部１３の熱膨張係数よりも大きな熱膨張係数を有する。例文帳に追加

The heat sink 20 has a thermal coefficient of expansion that is larger than that of the ridge 13. - 特許庁

熱膨張係数傾斜材料およびその製造方法例文帳に追加

THERMAL EXPANSION COEFFICIENT GRADIENT MATERIAL AND METHOD OF MANUFACTURING THE SAME - 特許庁

ベースの熱膨張、熱収縮の影響を受けることなく、精度の高い線膨張係数を測定することができる線膨張係数測定装置を得る。例文帳に追加

To obtain an accurate apparatus for measuring a coefficient of linear expansion without being affected by the thermal expansion/thermal shrinkage of a base. - 特許庁

ＡｌＮは線膨張係数がＧａＮの線膨張係数に近く、熱伝導率も高い。例文帳に追加

The coefficient of linear expansion of AlN is close to the coefficient of linear expansion of GaN and its thermal conductivity is high. - 特許庁

低い熱膨張係数を持つ、鉄とニッケルの合金例文帳に追加

an alloy of iron and nickel having a low coefficient of thermal expansion  - 日本語WordNet

熱膨張係数の異なる材料間の接合方法例文帳に追加

JOINING METHOD BETWEEN MATERIALS OF DIFFERENT COEFFICIENTS OF THERMAL EXPANSION - 特許庁

低温領域では弾性部材９の熱膨脹係数はシャドウマスク６の熱膨脹係数より大きく、高温領域では弾性部材９の熱膨脹係数はシャドウマスク６の熱膨脹係数より小さい。例文帳に追加

A thermal expansion coefficient of an elastic member 9 is larger than a thermal expansion coefficient of a shadow mask 6 in a low-temperature region but smaller in a high-temperature region. - 特許庁

熱膨張係数が異なる部材の接合方法例文帳に追加

METHOD OF JOINING MEMBERS HAVING DIFFERENT THERMAL EXPANSION COEFFICIENTS - 特許庁

低熱膨張係数Ｆｅ−Ｎｉ合金用溶接材料例文帳に追加

WELDING MATERIAL WITH LOW THERMAL EXPANSION COEFFICIENT FOR Fe-Ni ALLOY - 特許庁

熱膨張係数が異なる部材の接合方法例文帳に追加

METHOD FOR JOINING MEMBER WITH DIFFERENT THERMAL EXPANSION COEFFICIENT - 特許庁

フィラー２１は、負の熱膨張係数を有する。例文帳に追加

The filler 21 has a negative thermal expansion coefficient. - 特許庁

熱膨張係数測定方法とその装置例文帳に追加

THERMAL EXPANSION COEFFICIENT MEASUREMENT METHOD AND APPARATUS FOR SAME - 特許庁

蓋体の熱膨張係数をパッケージ本体の熱膨張係数よりも大きくし、かつ、接合材の熱膨張係数を蓋体の熱膨張係数よりも大きくする。例文帳に追加

The coefficient of thermal expansion of the lid body is made larger than the coefficient of thermal expansion of the package body, and the coefficient of thermal expansion of the bonding material is made larger than the coefficient of thermal expansion of the lid body. - 特許庁

上記フィン（57）の線熱膨張係数と担持層（58）の線熱膨張係数との差を、上記フィン（57）の線熱膨張係数と上記吸着剤の線熱膨張係数との差よりも小さくする。例文帳に追加

This heat exchanger is constituted to make the difference between a linear thermal expansion coefficient of the fin 57 and that of the support layer 58 to be smaller than the difference between the linear thermal expansion coefficient of the fin 57 and that of an adsorbent. - 特許庁

ジョイント部材３の熱膨張係数を、プーリ２の熱膨張係数よりも大きく設定すると共に、外輪１１の熱膨張係数を、プーリ２の熱膨張係数よりも小さく設定する。例文帳に追加

A thermal expansion coefficient of the joint member 3 is set larger than a thermal expansion coefficient of the pulley 2, and a thermal expansion coefficient of the outer ring 11 is set smaller than the thermal expansion coefficient of the pulley 2. - 特許庁

また、本発明に係る電子部品用パッケージは、前記アタッチ部の熱膨張係数は、前記電子部品の熱膨張係数より大きく、前記熱膨張係数調整部材の熱膨張係数は、前記アタッチ部の熱膨張係数より小さいことを特徴とする。例文帳に追加

A thermal expansion coefficient of the attaching portion is higher than a thermal expansion coefficient of the electronic component, and a thermal expansion coefficient of the thermal expansion coefficient regulating member is lower than the thermal expansion coefficient of the attaching portion, in the package for the electronic component. - 特許庁

支持脚１５は、熱膨張した際、線膨張係数の違いからひずみが発生する。例文帳に追加

The support legs 15, at thermal expansion, generates distortion due to differences of linear expansion coefficients. - 特許庁

感温素子２の熱膨張係数をｋ１、電極線２１の熱膨張係数をｋ２、内側保護層５１の熱膨張係数をｋ３、外側保護層５２の熱膨張係数をｋ４としたとき、｜ｋ１−ｋ３｜＜｜ｋ１−ｋ２｜、｜ｋ２−ｋ４｜＜｜ｋ２−ｋ３｜が成り立つ。例文帳に追加

When the thermal expansion coefficients of the thermosensitive element 2, the electrode wires 21, the inside protection layer 51 and the outer protection layer 52 are set k1, k2, k3 and k4 respectively, following expressions: |k1-k3|<|k1-k2| and |k2-k4|<|k2-k3|, are satisfied. - 特許庁

低熱膨張線状体において、低熱膨張特性乃至負の線膨張係数を有する繊維材料１と、この繊維材料１にめっきされ、前記低熱膨張特性を有する繊維材料は大きな線膨張係数で正の線膨張特性を持つ導電性材料５とを具備する。例文帳に追加

The linear body with small thermal expansion comprises a fibrous material 1 having a low thermal expansion coefficient or a negative thermal expansion coefficient, and an electrically conductive material 5 coating the fibrous material 1 and having a positive and high thermal expansion coefficient. - 特許庁

第１熱変形部は、第２熱変形部を形成する材質の線膨張係数と異なる線膨張係数を有する材質から形成されている。例文帳に追加

The first thermal deformation part is made of a material, having a coefficient of linear expansion different from that of the second thermal deformation part. - 特許庁

放熱板において、対向する面の熱膨張係数が異なり、さらに、一方の面の熱膨張係数が４〜14×10^-6／Ｋ、他方の面の熱膨張係数が10〜24×10^-6／Ｋである半導体装置用放熱板である。例文帳に追加

In a heatsink for semiconductor devices, the thermal expansion coefficient of the opposed faces are different, and further, the thermal expansion coefficient of one face is 4-14×10^-6/K, and that of another face is 10-24×10^-6/K. - 特許庁

中継基板本体３８の熱膨張係数は５．０ｐｐｍ／℃未満である。例文帳に追加

The thermal expansion coefficient of the intermediate substrate body 38 is less than 5.0 ppm/°C. - 特許庁

８０≦（導電層の線膨張係数／裏打層の線膨張係数）×１００≦１２０８０≦（耐熱性接着シートの線膨張係数／裏打層の線膨張係数）×１００≦１２０、例文帳に追加

The following condition is satisfied: 80≤(linear expansion coefficient of the electroconductive layer/linear expansion coefficient of the backing layer)×100≤120 and 80≤(linear expansion coefficient of the heat-resistant adhesive layer/linear expansion coefficient of the backing layer)×100≤120. - 特許庁

熱膨張係数が異なる材料からなる複数の層１１，１２を有し、該複数の層１１，１２が熱膨張係数の大小が交互となるように設けられた熱膨張体１３を形成し、この熱膨張体１３を加熱する加熱手段を設けた。例文帳に追加

The heat driving type actuator includes a plurality of layers 11, 12 made of materials having different thermal expansion coefficients, a thermal expansion article 13 formed so that the plurality of the layers 11, 12 alternately become large and small in thermal expansion coefficients, and a heating means for heating this thermal expansion article 13. - 特許庁

樹脂成形体の熱膨張係数は、イオン交換膜３の熱膨張係数の１／５０倍〜１倍である。例文帳に追加

The thermal expansion coefficient of the resin molded body is 1/5-1 as much as that of the ion exchange film 3. - 特許庁

台座１０は、熱膨張係数がシリコンの熱膨張係数（２．３３×１０^-6）の±５０％の範囲に入る材料で形成される。例文帳に追加

The seat 10 is formed by a material for which the thermal expansion coefficient is within the range of ±50% of the silicon thermal expansion coefficient (2.33×10-6). - 特許庁

熱膨張係数の大きな絶縁層Ａを熱膨張係数の小さな絶縁層Ｂで挟み込む構造としたため、絶縁層Ａの収縮／膨張を絶縁層Ｂが打ち消すように収縮／膨張し、応力を打ち消す方向で緩和させることにより、熱膨張の影響を軽減できる。例文帳に追加

An insulating layer B contracts and expands so as to cancel a contraction/expansion of an insulating layer A and relax the stress in a direction of negating the stress, and the effect of the heat expansion coefficient can be reduced, because the structure is configured that the insulating layer A having a high heat expansion coefficient is sandwiched between insulating layers B having a low heat expansion coefficient. - 特許庁

軸部材２０の内部には、軸部材２０の線膨張係数と異なる線膨張係数を有する熱膨張調整部材６８，７０が配設され、温度変化時に熱膨張調整部材６８，７０が熱膨張することによって軸受スリーブ２２と軸部材２０との間の間隙長が調整される。例文帳に追加

Thermal expansion adjusting members 68, 70 having the coefficient of linear expansion different from the coefficient of linear expansion of the shaft member 20 are disposed inside the shaft member 20, and the space between the bearing sleeve 22 and the shaft member 20 is adjusted by the thermal expansion of the thermal expansion adjusting members 68, 70 when the temperature changes. - 特許庁

上記無電解ニッケルメッキ層６の熱膨張係数は、銅合金製の本体５の熱膨張係数よりも小さい。例文帳に追加

A coefficient of thermal expansion of the electroless nickel plating layer 6 is smaller than a coefficient of thermal expansion of the body 5 made of copper alloy. - 特許庁

上記ステンレス合金製のシャフト１の熱膨張係数は、スリーブ２の銅合金製本体５の熱膨張係数よりも小さい。例文帳に追加

A coefficient of thermal expansion of the shaft 1 made of stainless alloy is smaller than the coefficient of thermal expansion of the copper alloy made body 5 of the sleeve 2. - 特許庁

ドープトシリコン酸化膜１７０の熱膨張係数は、画素電極９ａを構成するアルミニウム膜の熱膨張係数との差が小さい。例文帳に追加

The doped silicon oxide film 170 has a small difference in coefficient of thermal expansion from an aluminum film constituting the pixel electrode 9a. - 特許庁