半田処理装置の英語

柱状電極上に半田バンプが設けられた半導体装置において、柱状電極上のみに半田ボールを付着させて、加熱処理により、柱状電極上に半田バンプを形成する。例文帳に追加

To provide a manufacturing method of a semiconductor device provided with solder bumps each on a pole electrode capable of forming the solder bumps on each of the pole electrodes through heat treatment by adhering each solder pole only on each pole electrode. - 特許庁

半田材検査装置は、試験用半田材を用いて印刷処理を実行したときの印刷処理時間と、上記印刷処理時間における試験用半田材の劣化度データとを対応付けた教師データを予め記憶した記憶部１４と、制御部１３とを備える。例文帳に追加

The device for inspecting solder material is equipped with a storage unit 14 where teacher data that a print processing time required for performing print processing by the use of a testing solder material is correlated with deterioration data on the testing solder material in the print processing time are previously stored, and a control unit 13. - 特許庁

還元性雰囲気を用いたリフロー処理により半田バンプを製造する方法であって、当該リフロー処理において、溶融した半田中のボイドが潰れた反動で小さい球状の半田が外部に飛び散ることを防止し、更に、前記ボイドを内包したまま半田が固化されることを防止する方法及び前記半田バンプを備えた半導体装置の製造方法を提供する。例文帳に追加

To provide a method for manufacturing a solder bump by reflow processing using a reducing atmosphere and for preventing the outward scattering of solder in small spherical shape by reaction of crushed voids in the molten solder in the reflow processing and preventing the solder from being solidified while including the voids, and also to provide a method for manufacturing a semiconductor device with the solder bump. - 特許庁

半導体装置の製造方法は、半導体基板１０の上に設けられた電極の上に、第１の半田層４２を設ける工程と、第１の半田層４２の上に樹脂部４４を設ける工程と、樹脂部４４の上に、第２の半田層４６を設ける工程と、第１の半田層４２および第２の半田層４６を熱処理する工程と、を含む。例文帳に追加

The method of manufacturing the semiconductor device includes the steps of preparing a first solder layer 42 on an electrode prepared on a semiconductor substrate 10, preparing a resin section 44 on the first solder layer 42, preparing a second solder layer 46 on the resin section 44, and performing heat treatment on the first and second solder layers 42 and 46. - 特許庁

吸湿後の半田処理においても硬化物の半導体装置にクラックや基材との剥離が発生しない耐半田性に優れる半導体封止用エポキシ樹脂組成物、及びこれを用いた半導体装置を提供すること。例文帳に追加

To obtain an epoxy resin composition which is used for sealing semiconductors, has excellent solder resistance and does not cause the development of cracks and the peeling of substrates in sealed and cured semiconductor devices, even when treated with solders after the absorption of moisture, and to provide a semiconductor device using the same. - 特許庁

本発明の加熱溶融処理装置は、半田を含む処理対象物１００についてカルボン酸蒸気を含む雰囲気中で加熱溶融処理する加熱溶融処理装置１であって、加熱溶融処理した処理対象物１００を載せて搬送するためのハンド部４を冷却板として兼用する。例文帳に追加

The heating and melting treatment device 1 applies heating and melting treatment to the object 100 to be treated including solder in an atmosphere including carboxylic acid vapor, wherein a hand section 4 for conveying the object 100 to be treated, which has been subjected to the heating and melting treatment, is also used as a cooling plate. - 特許庁

成形後や半田処理後の反りが小さく、エリア実装型半導体装置に適した半導体封止用エポキシ樹脂組成物を提供すること。例文帳に追加

To provide an epoxy resin composition which is used for sealing semiconductors, is hardly bent after molded and after sealed with a solder, and is suitable for area-packing semiconductor devices. - 特許庁

レーザ光による半田付けや、樹脂接合、溶接などの加熱・加工処理をハンディに行うことができるレーザ加熱装置を提供する。例文帳に追加

To provide a laser beam heating device with which a heating/working process such as soldering, resin joining and welding by a laser beam is handily performed. - 特許庁