plating-upとは 意味・読み方・使い方

PLATING WORKS FOR MADE-UP ROLL FOR GRAVURE PRINTING AND GRAVURE PRINTING PLATE MAKING WORKS例文帳に追加

グラビア印刷用被製版ロールのメッキ工場及びグラビア製版工場 - 特許庁

To use up a component of an electroless plating bath every time electroless plating is carried out by adding only the required amount of the component at the beginning of electroless plating without replenishing the component.例文帳に追加

めっき浴の成分を補充せずに、めっき開始時に必要な量だけを添加することによって、一度のめっき処理ごとにめっき浴の成分を使い切る、無電解銅めっき浴。 - 特許庁

Bottom-up plating is performed for conducting a part between a plating electrode E and the conduction seed layer 4, and filling the inside of the through-hole 2 with a plating metal 6.例文帳に追加

次に、めっき用電極Ｅと通電用のシード層４との間に通電して貫通孔２内部にめっき金属６を充填するボトムアップめっきを行う。 - 特許庁

The Ni-B electroless plating is implemented by dipping a work in a Ni-B plating bath 4 with the Ni-B electroless plating solution filled therein, and the work is pulled up so as to be transferred to a water-washing bath.例文帳に追加

Ｎｉ−Ｂ無電解メッキ液が入れられたＮｉ−Ｂメッキ槽４に被メッキ物を浸漬してＮｉ−Ｂ無電解メッキを行い、被メッキ物を水洗槽に移すために引き上げる。 - 特許庁

When the CNT is embedded into an electroless Cu plating film, it is expected that the plating film has electromagnetic wave shielding property at frequencies as high as up to 100 kHz to several GHz with about 2 μm thickness of the plating film.例文帳に追加

また、無電解Ｃｕめっき皮膜中にＣＮＴを取り込ませた場合、２μｍ程度のめっき皮膜の厚さで、１００ｋＨｚ〜数ＧＨｚ程度までの高い周波数の電磁波シールド性を有することが期待できる。 - 特許庁

To provide a conveying device for plating, wherein a plating liquid can be drained through a process of pulling up a jig from a plating tank, without installing a cylinder for slanting or a hitting plate at each stopping position.例文帳に追加

各停止位置に傾斜用のシリンダーや当て板を設置する必要がなく、治具のメッキ槽からの引き上げ過程で液切りを行うことができるメッキ用搬送装置を提供する。 - 特許庁

To provide an additive for electrolytic copper plating, which is hardly degraded after an electrolytic bath has been made up, and with which copper can be adequately embedded in a fine groove and hole; an electrolytic copper plating bath using the same; and an electrolytic copper plating method.例文帳に追加

建浴後の劣化が殆どなく、微細な溝や穴に対して銅の埋め込み性の良い電解銅メッキ用添加剤、それを用いた電解銅メッキ浴、及び電解銅メッキ方法の提供。 - 特許庁

The first heating mechanism 50 for heating the plating solution 35 up to the first temperature is attached to at least one out of the supply tank 31 or the plating solution supply pipe 33 of the plating solution supply mechanism 30.例文帳に追加

また、めっき液供給機構３０の供給タンク３１またはめっき液供給管３３の少なくともいずれか一方に、めっき液３５を第１温度に加熱する第1加熱機構５０が取り付けられている。 - 特許庁