bump aroundとは 意味・読み方・使い方

The ultra-thin sheet has a first hole piercing the bump and a second hole, forming specified space around the comb-toothed electrode.例文帳に追加

極薄シートは、バンプを貫通させる第１の穴と、櫛歯電極の周囲に所定の空間を形成する第２の穴とを有する。 - 特許庁

The semiconductor device 10 further includes a bump underlying metal film 50 formed on and around the opening in the second insulating layer 32.例文帳に追加

半導体装置１０は更に、第２の絶縁層３２の開口及びその周囲上に形成されたバンプ下金属膜５０を有する。 - 特許庁

To prevent a residue of flux from remaining around a side of a bump in a semiconductor chip and a semiconductor device including the same.例文帳に追加

半導体チップ及び該半導体チップを備えた半導体装置において、バンプの側部の周囲に、フラックスの残渣が残留することを防止する。 - 特許庁

A via bump 17 is formed so as to penetrate both the flat board 11 and the frame- like board 12 around the housing recessed part 14.例文帳に追加

また、収容凹部１４を取り囲む周囲部分には、平坦基板１１と枠型基板１２との双方を貫通してビアバンプ１７が形成されている。 - 特許庁

The tip end of a bump 44B is pressurized at a pressing force of 5 g or more per bump by a transfer plate 10 which is provided with a transfer surface 10s having an irregular part 10a which is formed so that its arithmetic average roughness Ra may range between 0.5 or more and around 1.5 (μm).例文帳に追加

算術平均粗さＲａが０．５以上１．５（μｍ）程度の範囲となるように形成される凹凸１０ａを有する転写面１０ｓを備える転写板１０により、バンプ４４Ｂの先端部が、１バンプ当たり５ｇ以上の押圧力で加圧処理されるもの。 - 特許庁

To provide a semiconductor device which eliminates the need for an under-fill resin, improves reliability in packaging by relaxing stress applied to a metal bump, prevents a damage from being caused to a device around the bump during a recycling processing, and can be manufactured at low cost, and to provide a method for manufacturing the device.例文帳に追加

アンダーフィル樹脂を不要としながらも、金属バンプに働く変形応力を緩和して実装信頼性を向上させ、周辺デバイス等に対する再生処理時のダメージを回避し、低コストを実現できる半導体装置及びその製造方法を提供する。 - 特許庁

In this sealing structure of a semiconductor device for high frequencies, the semiconductor device is crimped to a wiring board for fixing while a bump is being held between the semiconductor device and wiring board, a portion around the semiconductor device is sealed by resin, and at the same time clearance where the resin is not filled is formed at a portion where the device that sandwiches the bump and the substrate.例文帳に追加

半導体素子と配線基板の間にバンプを挟んで素子を基板に圧着固定し、該素子の周囲を樹脂で封止してなると共に、該バンプを挟んだ素子と基板の間に樹脂が注入されない隙間を形成してなることを特徴とする。 - 特許庁

While a bump electrode 11 of an IC chip 10 is heated to a temperature near the curable temperature of a conductive adhesive 20, the tip of the bump electrode 11 is buried in the conductive adhesive 20, and the conductive adhesive 20 around the buried electrode 11 is cured or semi-cured, and the bump electrode 11 is pulled out, thus transferring the conductive adhesive 20.例文帳に追加

ＩＣチップ１０のバンプ電極１１を加熱して導電性接着剤２０の硬化可能温度付近の温度とした状態で、バンプ電極１１の先端側を導電性接着剤２０へ埋め込み、埋め込まれたバンプ電極１１の周囲の導電性接着剤２０を硬化もしくは半硬化させた後、バンプ電極１１を引き出すことにより、導電性接着剤２０の転写を行う。 - 特許庁