To provide a gold plating liquid which does not comprise toxic cyanide or the like having problems in a working environment and waste liquid treatment, has excellent chemical stability, is easily treatable, and can efficiently form a gold plating film of high quality, and to provide a gold plating method using the gold plating liquid.例文帳に追加

作業環境や廃液処理に問題を有する毒性の強いシアン等を含まず、化学的安定性に優れ、容易に取り扱うことができ、良好な膜質の金メッキ膜を効率的に形成することができる金メッキ液と、この金メッキ液を用いる金メッキ方法を提供する。 - 特許庁

The chemical palladium/gold plating film is situated on a solder pad and comprises a palladium plating layer situated on the solder pad and a gold plating layer situated on the palladium plating layer.例文帳に追加

化学パラジウム/金めっき皮膜は半田パッドの上に位置し、かつ、半田パッドの上に位置するパラジウムめっき層と、パラジウムめっき層の上に位置する金めっき層とを含む。 - 特許庁

CHEMICAL PALLADIUM/GOLD PLATING FILM STRUCTURE, METHOD FOR PRODUCTION THEREOF, PALLADIUM/GOLD PLATING FILM PACKAGE STRUCTURE BONDED WITH COPPER WIRE OR PALLADIUM/COPPER WIRE, AND PACKAGING PROCESS THEREOF例文帳に追加

化学パラジウム／金めっき皮膜構造及びその製造方法、銅線またはパラジウム／銅線で接合されたパラジウム／金めっき皮膜パッケージ構造及びそのパッケージプロセス - 特許庁

To provide a chemical palladium/gold plating film structure, a method for the production thereof, a palladium/gold plating film package structure bonded with a copper wire or a palladium/copper wire, and a packaging process thereof.例文帳に追加

本発明は、化学パラジウム/金めっき皮膜構造及びその製造方法、銅線またはパラジウム/銅線で接合されたパラジウム/金めっき皮膜パッケージ構造、及びそのパッケージプロセスを提供する。 - 特許庁

This invention also provides a method for producing the chemical palladium/gold plating film and a packaging process for the package structure.例文帳に追加

本発明は、化学パラジウム/金めっき皮膜の製造方法及びそのパッケージ構造のパッケージプロセスも提供する。 - 特許庁

A nickel metal layer 13, a gold layer 14, and a nano plating film 15 are formed in the copper wiring pattern 12 exposed from the solder resist hole 11a one by one by a chemical plating method.例文帳に追加

はんだレジスト孔１１ａから露出した銅配線パターン１２には化学めっき法で形成されたニッケル金属層１３と金層１４と、ナノめっき膜１５が順次形成される。 - 特許庁

After applying chemical nickel plating to a surface 10 on the rotor side of the caliper 5a made of an aluminum alloy and to a surface 11 on the side opposite to the rotor, nickel-tungsten alloy plating is applied to both side faces 10 and 11 thereof; next, gold plating is applied to only the surface 10 on the rotor side.例文帳に追加

アルミニウム合金製のキャリパ５ａのロータ側の面１０とロータとは反対側の面１１とに化学ニッケルメッキを施した後、これら両側面１０、１１にニッケルタングステン合金メッキを施し、次いで、ロータ側となる面１０のみに、金メッキを施す。 - 特許庁

A hole-making step, a titanium layer-copper layer forming step, a chemical copper plating step, a dry film forming step, a patterning step, a copper circuit forming step, a peeling step, a nickel plating step, a gold plating step and a titanium layer-copper layer removing step are successively performed.例文帳に追加

穿孔ステップと、チタン層・銅層形成ステップと、化学銅メッキステップと、ドライフィルム形成ステップと、パターニングステップと、銅回路形成ステップと、剥離ステップと、ニッケルメッキステップと、金メッキステップと、チタン層・銅層除去ステップと、順次行う。 - 特許庁

To provide a curable composition giving a cured product having excellent printability, thixotropic nature, electrical insulation, PCT (pressure cooker test) resistance, soldering heat-resistance, chemical resistance, electroless gold-plating resistance, etc.例文帳に追加

優れた印刷性や揺変性が得られるだけでなく、電気絶縁性、ＰＣＴ耐性、はんだ耐熱性、耐薬品性、無電解金めっき耐性などの特性に優れた硬化物を与える硬化性組成物を提供すること。 - 特許庁

To provide a photo- and/or heat-curable composition having excellent storage stability and giving an excellent cured film which satisfies such properties as hardness, heat resistance, chemical resistance, electroless gold plating resistance and electric insulation, and a cured product thereof.例文帳に追加

保存安定性に優れ、また硬度、耐熱性、耐薬品性、無電解金めっき耐性、電気絶縁性等の特性を充分に満足する優れた硬化膜が得られる光及び／又は熱硬化性組成物及びその硬化物を提供する。 - 特許庁

To provide a dilute alkali development-type photo-curable thermosetting resin composition which is suitable for use in obtaining a cured coating film which exhibits excellent adhesion with a substrate, chemical resistance, solder heat resistance, PCT resistance, thermal shock resistance, electroless gold plating resistance, electrical insulation properties, etc.例文帳に追加

基板との密着性、耐薬品性、はんだ耐熱性、ＰＣＴ耐性、冷熱衝撃耐性、無電解金めっき耐性、電気絶縁性等に優れる硬化皮膜を得るのに適した希アルカリ現像型の光硬化性熱硬化性樹脂組成物を提供する。 - 特許庁

To provide a photo- and/or heat-curable resin that is excellent in mass productivity and yields an excellent cured film fully satisfying characteristics such as hardness, heat resistance, chemical resistance, whitening resistance, electroless gold plating resistance, and electrical insulation and to provide a composition containing the photo- and/or heat-curable resin and a cured product thereof.例文帳に追加

量産性に優れ、また硬度、耐熱性、耐薬品性、白化耐性、無電解金めっき耐性、電気絶縁性等の特性を充分に満足する優れた硬化皮膜が得られる光及び／又は熱硬化性樹脂、それを含有する組成物及び硬化物を提供する。 - 特許庁

To provide a curable composition excellent in storage stability, formulatable into a one-component type, and giving an excellent cured film which satisfies properties such as electric insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance, resistance to electroless gold plating and moisture absorption resistance.例文帳に追加

保存安定性に優れ、一液型に組成することができると共に、電気絶縁性、ＰＣＴ（プレッシャークッカーテスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性、耐吸湿性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a photo-curable resin composition with which excellent finger touch drying properties, developing properties and through-hole developing properties can be obtained and whose cured substance has better soldering heat resistance, chemical gold-plating resistance and electrical properties than conventional substance.例文帳に追加

優れた指触乾燥性、現像性、及びスルーホール現像性を得ることができるとともに、その硬化物において、従来と同等以上のはんだ耐熱性、耐無電解金めっき性、電気特性を得ることが可能な光硬化性樹脂組成物を提供する。 - 特許庁

To provide a curable composition giving an excellent cured film which satisfies such properties as electric insulation, PCT (pressure cooker test) resistance, adhesion, solder heat resistance, chemical resistance and resistance to electroless gold plating in addition to cracking resistance.例文帳に追加

耐クラック性に加え、電気絶縁性、ＰＣＴ（プレッシャークッカーテスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供すること。 - 特許庁

To provide a curable composition having a good anti-sagging effect after coating, excellent also in suitability of a dry coating film to set to touch, and giving a cured body excellent in properties such as PCT resistance, resistance to the heat of solder, chemical resistance, adhesion, resistance to electroless gold plating and electric insulation.例文帳に追加

塗布後に優れたダレ止め効果が得られるだけでなく、乾燥塗膜の指触乾燥性にも優れ、且つ、ＰＣＴ耐性、はんだ耐熱性、耐薬品性、密着性、無電解金めっき耐性、電気絶縁性などの特性に優れた硬化物を与える硬化性組成物を提供する。 - 特許庁

To provide a curable composition which is superior in storage stability, can be made up in a one-pack type and gives a superior cured film, satisfying such properties as crack resistance, electrical insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance and electroless gold plating resistance.例文帳に追加

保存安定性に優れ、一液型に組成可能であり、耐クラック性、電気絶縁性、ＰＣＴ（プレッシャー・クッカー・テスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a curable composition, excellent in storage stability and formulatable into a one-component type and providing an excellent cured film sufficiently satisfying characteristics such as electrical insulating properties, PCT (pressure cooker test) resistance, adhesiveness and heat resistance to soldering, chemical resistance, resistance to electroless gold plating, resistance to hygroscopic property, etc.例文帳に追加

保存安定性に優れ、一液型に組成することができると共に、電気絶縁性、ＰＣＴ（プレッシャークッカーテスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性、耐吸湿性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a photo- and/or thermosetting composition that provides a cured film having excellent developability and sufficient characteristics such as hardness, solder heat resistance, chemical resistance, adhesiveness, PCT (Pessure Cooker Test) durability, electroless gold plating durability, whitening resistance, electric insulating property and flexibility, and to provide a cured product of the composition.例文帳に追加

現像性に優れ、また、硬度、はんだ耐熱性、耐薬品性、密着性、ＰＣＴ耐性、無電解金めっき耐性、白化耐性、電気絶縁性、可撓性等の特性を充分に満足する優れた硬化膜が得られる光及び／又は熱硬化性組成物及びその硬化物を提供する。 - 特許庁

To provide a curable composition which is excellent in shelf stability, can be prepared as a one-part composition and is capable of yielding an excellent cured coating film having fully satisfying characteristics such as crack resistance, electrical insulating properties, PCT (pressure cooker test) resistance, adhesion, solder heat resistance, chemical resistance and electroless gold plating resistance.例文帳に追加

保存安定性に優れ、一液型に組成可能であり、耐クラック性、電気絶縁性、ＰＣＴ（プレッシャー・クッカー・テスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a curable composition excellent in storage stability, capable of being made as a one-part composition, and providing an excellent cured film which satisfies such properties as crack resistance, electric insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance and resistance to electroless gold plating.例文帳に追加

保存安定性に優れ、一液型に組成可能であり、耐クラック性、電気絶縁性、ＰＣＴ（プレッシャー・クッカー・テスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a curable composition which does not gelate, excels in developability, and can form a cured film excellent in properties such as hardness, resistance to the heat of soldering, chemical resistance, adhesion, PCT resistance, resistance to electroless gold plating, whitening resistance, electric insulation and flexibility, and to provide a cured product thereof.例文帳に追加

ゲル化することなく、現像性に優れ、且つ、硬度、はんだ耐熱性、耐薬品性、密着性、ＰＣＴ耐性、無電解金めっき耐性、白化耐性、電気絶縁性、可撓性などの特性に優れる硬化膜を形成できる硬化性組成物及びその硬化物を提供する。 - 特許庁

To provide a curable composition which excels in storage stability, can be constituted as a single-component curable composition, and provides an excellent cured coating film satisfying properties such as electric insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance, resistance to electroless gold plating and moisture-absorption resistance.例文帳に追加

保存安定性に優れ、一液型に組成することができると共に、電気絶縁性、ＰＣＴ（プレッシャークッカーテスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性、耐吸湿性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a photocurable and/or thermosetting composition which is excellent in developability and is capable of yielding superior cured film which fully satisfies chacteristics, such as hardness, soldering heat resistance, chemical resistance, adhesion, PCT resistance, electroless gold plating resistance, whitening resistance, electrical insulating properties, and flexibility, and to provide a product thereof.例文帳に追加

現像性に優れ、また、硬度、はんだ耐熱性、耐薬品性、密着性、PCT耐性、無電解金めっき耐性、白化耐性、電気絶縁性、可撓性等の特性を充分に満足する優れた硬化膜が得られる光及び／又は熱硬化性組成物及びその硬化物を提供する。 - 特許庁

To provide a photo- and/or thermosetting composition that provides an excellent cured film having excellent developability and sufficient characteristics such as hardness, solder heat resistance, chemical resistance, adhesiveness, PCT (Pressure Cooker Test) durability, electroless gold plating durability, whitening resistance, electric insulating property and flexibility, and also to provide a cured product of the composition.例文帳に追加

現像性に優れ、また、硬度、はんだ耐熱性、耐薬品性、密着性、ＰＣＴ耐性、無電解金めっき耐性、白化耐性、電気絶縁性、可撓性等の特性を充分に満足する優れた硬化膜が得られる光及び／又は熱硬化性組成物及びその硬化物を提供する。 - 特許庁

To provide a curable composition excellent in developability and capable of forming a cured film excellent in characteristics such as hardness, soldering heat resistance, chemical resistance, adhesion, PCT (pressure cooker test) resistance, electroless gold plating resistance, whitening resistance, electric insulation and flexibility.例文帳に追加

現像性に優れ、且つ、硬度、はんだ耐熱性、耐薬品性、密着性、ＰＣＴ（プレッシャー・クッカー・テスト）耐性、無電解金めっき耐性、白化耐性、電気絶縁性、可撓性などの特性に優れる硬化膜を形成できる硬化性組成物を提供する。 - 特許庁

To provide a curable composition which is excellent in storage stability, can be made up in a one-pack type and gives a superior cured film satisfying such properties as cracking resistance, electric insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance and electroless gold plating resistance.例文帳に追加

保存安定性に優れ、一液型に組成可能であり、耐クラック性、電気絶縁性、ＰＣＴ（プレッシャー・クッカー・テスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To provide a curable composition excellent in storage stability, formable into a one-component, and giving an excellent cured film which fully satisfies properties such as cracking resistance, electric insulation, PCT (pressure cooker test) resistance, adhesion, resistance to the heat of soldering, chemical resistance and resistance to electroless gold plating.例文帳に追加

保存安定性に優れ、一液型に組成することができると共に、耐クラック性、電気絶縁性、ＰＣＴ（プレッシャー・クッカー・テスト）耐性、密着性、はんだ耐熱性、耐薬品性、無電解金めっき耐性等の特性を充分に満足する優れた硬化皮膜が得られる硬化性組成物を提供する。 - 特許庁

To obtain a photocurable and/or heat-curable green resist ink composition using a halogen-free coloring pigment that can form a resist film excellent in film properties of chemical resistance, nonelectrolytic gold plating resistance, electrical insulating properties, adhesion, hardness or the like and to diminish problems attending the disposal of a printed wiring board.例文帳に追加

耐薬品性、無電解金めっき耐性、電気絶縁性、密着性、硬度等の皮膜特性に優れたレジスト皮膜を形成できる、ハロゲンフリーの着色顔料を用いた光硬化性及び／又は熱硬化性の緑色レジストインキ組成物を提供し、プリント配線板の廃棄に伴う問題を低減する。 - 特許庁

A second member 2 having a conductive region 24 such as a gold plating layer and an adhesive force reinforcing region 25 is adhered on a first member 1 having at least on the surface an aluminum or a conductive region substantially consisting of a metal such as an aluminum subjected to a chemical conversion.例文帳に追加

少なくとも表面にアルミニウムなどの金属または化成皮膜処理されたアルミニウムなどの実質的に金属で構成された導電領域を有する第一部材１に対して、金メッキ層などの導電領域２４と接着力補強領域２５とを有する第二部材２を導電性接着剤３により接着したもの。 - 特許庁

To provide a photocurable thermosetting resin composition capable of forming a cured film having excellent insulation reliability and chemical resistance and having PCT resistance, HAST resistance and electroless gold plating resistance which are important as a solder resist for a semiconductor package, to provide its dry film and cured product and to provide a printed wiring board in which the cured film such as the solder resist is formed thereby.例文帳に追加

優れた絶縁信頼性、耐薬品性を有し、また半導体パッケージ用ソルダーレジストとして重要なＰＣＴ耐性、ＨＡＳＴ耐性、無電解金めっき耐性を有する硬化皮膜を形成できる光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物、並びにこれらによりソルダーレジスト等の硬化皮膜が形成されてなるプリント配線板を提供する。 - 特許庁