in-depth analysisとは 意味・読み方・使い方

If it is No, only the virtual crack depth is changed (S4), and if it is Yes in S7, the virtual crack depth signal used at the time of the calculation of the electromagnetic analysis is made the crack depth to be obtained (S8) and finalized.例文帳に追加

Ｎｏの場合、仮想き裂深さの変更のみを行い（Ｓ４）、Ｓ７においてＹｅｓの場合、き裂深さ仮想信号を電磁気解析で求めた際使用した仮想き裂深さを、求めるき裂深さとし（Ｓ８）終了する。 - 特許庁

In the measuring process, using a glow discharge light emission analysis method, concentration distribution of a component element in the depth direction from the surface of the sample S is measured.例文帳に追加

測定工程では、グロー放電発光分析法を用いて、試料Ｓの表面からの深さ方向における成分元素の濃度分布を測定する。 - 特許庁

In this laminate including at least a pair of mutually contacting layers, a detection peak of 0.01 to 0.7 μm in terms of a full width at a half maximum, with regard to a depth in which an interface region of the mutually contacting layers is recognized when an element quantitative analysis in the depth direction by a glow discharge emission spectroscopic analysis process is performed.例文帳に追加

少なくとも１対の相接する層を有する積層体であって、グロー放電発光分光分析法による深さ方向の元素定量分析において、前記相接する層の界面領域が存在する深さに、半値全幅０．０１〜０．７μｍの検出ピークが認められる積層体。 - 特許庁

Organism information is measured by spectral analysis in a condition that the polarizing plate is set at a polarizing angle capable of obtaining reflected light from suitable depth.例文帳に追加

適切な深度からの反射光を得られる偏光角に偏光板をセットした状態で分光分析して生体情報を測定する。 - 特許庁

The oil well pipe screw joint has a constitution that making a residual stress of the bottom of the screw in the axial direction in the depth between the surface reaches to 40μm minus 400 MPa or smaller as a value of the X-ray stress analysis.例文帳に追加

ネジ底部の軸方向残留応力が表面から４０μｍまでの深さの間、Ｘ線応力解析での値として−４００ＭＰａ以下にする。 - 特許庁

To provide an element analysis method which enables the measurement of a concentration distribution of elements contained in metal samples in the depth direction with a high degree of accuracy by means of a secondary ion mass spectrometry.例文帳に追加

二次イオン質量分析法により金属試料に含まれる元素の深さ方向の濃度分布を高精度に測定可能な元素分析方法を提供する。 - 特許庁

The sample etched to a predetermined depth in the specific regions of the substrate surface is prepared by using this etching device, and the analysis of the etched surface is carried out.例文帳に追加

このエッチング装置を用いて、基板表面の特定領域を所定深さエッチングした試料を作製し、そのエッチング表面の分析を行う。 - 特許庁

To simultaneously, detect an electro-positive element and an electro-negative element with high sensitivity, using a simple constitution, in a the depth-wise element analysis method.例文帳に追加

深さ方向元素分析方法に関し、簡単な構成によりエレクトロポジティブな元素とエレクトロネガティブな元素とを同時に高感度で検出する。 - 特許庁