plating currentとは 意味・読み方・使い方

At this time, the plating is performed while a magnetic field is applied into the plating solution in the direction parallel to the direction of the current flowing in the plating solution, by which the dispersion plating film is obtained.例文帳に追加

この際に、めっき液中に流れる電流の向きに平行な方向に磁場を印加しながらめっきを行うことで分散めっき皮膜を得る。 - 特許庁

Plating is conducted by changing the current density at at least two steps in an electrolytic plating step.例文帳に追加

電解めっき工程において、電流密度を少なくとも2段階に変化させてめっきを行う。 - 特許庁

SULFURIC ACID BATH FOR PLATING Sn ON COPPER ALLOY SHEET AT HIGH CURRENT DENSITY, AND METHOD FOR PLATING Sn例文帳に追加

銅合金板への高電流密度Ｓｎめっき用硫酸浴及びＳｎめっき方法 - 特許庁

A change in electrification current for each plating cell is measured by a plating rectifier and from the waveform change of the electrification current, and the position where a plating appearance defect occurs is specified.例文帳に追加

各めっきセル毎の通電電流の変化を、めっき整流器により測定し、該通電電流の波形変化により、めっき外観不良の発生箇所を特定する。 - 特許庁

By applying current to the power supply film 12, electrolytic copper plating is performed, and a Cu plating film 15 is deposited on the plating base film 14.例文帳に追加

ついで、給電膜１２に通電して電解銅メッキを行ない、メッキ下地膜１４の上にＣｕメッキ被膜１５を析出させる。 - 特許庁

The electroplating is performed by repeating an energizing cycle comprising a projection nuclei formation treatment of increasing plating current, a normal plating treatment of holding the increased plating current, and a posttreatment of lowering the held plating current for a plurality of times.例文帳に追加

この電気めっきは、めっき電流を上昇させる突起核の生成処理と、上昇させためっき電流を保持する本めっき処理と、保持しためっき電流を低下させる後処理とを有する通電サイクルを複数回繰り返して行なう。 - 特許庁

The current value to be supplied between the main substrate and a anode is dropped to a weak current or controlled to zero in the current value after the plating layer is formed and before the plating solution is discharged.例文帳に追加

メッキ層を形成後、メッキ液を排液する前に、主基板とアノード間に供給される電流値を微弱電流に落とすかあるいは電流値をゼロに制御する。 - 特許庁

Using a plating device with an anode and a cathode in which current value is adjustable, a plating film is deposited at a low current density in the initial stage, and the current density is stepwise increased to deposit a plating film.例文帳に追加

電流値を可変できるアノードとカソードを有するめっき槽を備えためっき装置を使用して、初期には低い電流密度でめっき皮膜を形成し、段階的に電流密度を高めてめっき皮膜を形成する。 - 特許庁