plating conditionとは 意味・読み方・使い方

To more increase the plane uniformity in the film thickness of a plated film by more uniformly controlling the flow of a plating solution in a plating tank, and to securely perform the embedding or the like of the plated film in a shorter time by optimizing the plating speed and/or plating condition.例文帳に追加

めっき槽内のめっき液の流れをより均一に調節して、めっき膜の膜厚の面内均一性をより高め、しかも、めっき速度及び／またはめっき状態を最適化して、めっき膜の埋込み等をより短時間で確実に行うことができるようにする。 - 特許庁

For example, by performing the gold plating under the conditions that gold plating liquid temperature is 60 to 65 degrees and gold plating current density is 0.4 to 0.8 A/dm^2, the formation of the bump having a surface condition free from a level difference is made possible regardless of the level difference in a polyimide film as a substrate.例文帳に追加

例えば金めっき液温度を６０〜６５度、金めっき電流密度を０．４〜０．８Ａ／ｄｍ^２の条件で金めっきを行うことで、バンプ表面状態が下地であるポリイミド膜の段差に関係なく表面段差の無いバンプの形成が可能になる。 - 特許庁

When the surface of metal powder is plated with a metal having high electric conductivity by an electroless plating bath, a method of performing the plating while carrying out stirring under the condition of 1,000 to 10,000 rpm using a foam-less type ultrahigh speed mixer capable of stirring a plating bath at high speed in a laminar flow is adopted.例文帳に追加

金属粉末表面に無電解めっき浴を用いて導電性の高い金属をめっきするにあたり、めっき浴を層流にて高速攪拌できる泡レスタイプ・超高速ミキサーを用い、１，０００〜１０，０００ｒｐｍの条件下で撹拌しながらめっきする方法を採用する。 - 特許庁

To prevent the occurrence of whisker by a simple method capable of easily controlling the formation of a tin plating film formed on an outer lead of a lead frame under a conventional plating condition without deteriorating the productivity.例文帳に追加

リードフレームのアウターリード上に形成したすずメッキ皮膜において、生産性を落とすことなく、また従来のメッキ条件のままで容易に管理することができる簡便な方法でウィスカーの発生を防止する。 - 特許庁

The eutectoid plating with a fluororesin is executed on a sliding surface, and the sliding surface is baked at a temperature higher than the melting point of the fluororesin after the plating, and slowly cooled under a predetermined condition.例文帳に追加

すべり面にフッ素樹脂を用いた共析メッキを施し、メッキ後フッ素樹脂の融点以上に焼成した後、一定の条件下で徐冷する。 - 特許庁

By the configuration, a necessary speed ratio can be previously set according to the kind and the formed shape of the semiconductor device, and thereby the plating method can deposit Cu in the finely formed recess without depending on the condition of the plating bath.例文帳に追加

この構成により、半導体装置の品種・加工形状からあらかじめ必要な速度比を設定することで、メッキ浴の状態に依存せずに、微細加工された凹部内を埋め込むことができる。 - 特許庁

In this way, the plating solution can be retained in a satisfactory condition over a long period without requiring the full initial and the half initial make-up of the electrolytic bath, and a plating film of high quality can continuously be formed.例文帳に追加

これにより，半建浴や全建浴の必要なく長期間にわたってめっき液を良好な状態に維持し，高品質なめっき皮膜を形成し続けることができる。 - 特許庁

A conductive film 12 to be arranged between a re-wiring 9 and a bump electrode is formed by a non-electrolytic plating method in a condition where an Al wiring 2 of a plating power feeding region 52 is not exposed on the external peripheral portion of a semiconductor wafer.例文帳に追加

再配線９とバンプ電極との間に配置される導体膜１２を無電解めっき法によって形成するにあたり、半導体ウエハの外周部のめっき給電領域５２のＡｌ配線２が露出しない状態で行う。 - 特許庁