「linear absorption coefficient」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

To provide a polyesterimide having a high glass transition temperature, low linear thermal expansion (coefficient), low water absorption coefficient, low hygroscopic expansion coefficient, high modulus of elasticity and sufficient toughness in combination and to provide a method for producing the polyesterimide.例文帳に追加

高いガラス転移温度、低い線熱膨張（係数）、低い吸水率、低い吸湿膨張率、高い弾性率及び十分な靭性を併せ持つポリエステルイミドおよびその製造方法を提供する。 - 特許庁

To provide a polyimide film having high Young's modulus, high elongation, a low water-absorption ratio, a high glass transition temperature and a controlled coefficient of linear expansion.例文帳に追加

高ヤング率、高伸度、低吸水率、高ガラス転移温度および制御された線膨張率を有するポリイミドフィルムを提供する。 - 特許庁

To provide an excellent polyimide film having high modulus of elasticity, high storage elastic modulus, high extensibility, low coefficient of linear expansion comparable to that of a copper foil, and low coefficient of expansion on absorption of moisture.例文帳に追加

高弾性、高貯蔵弾性率、高伸び率、銅箔と同等の低線膨張係数、低吸湿膨張係数とを兼ね備える優れたポリイミドフィルムを得ることを目的とする。 - 特許庁

This polyimide film is such that its peel strength, Young's modulus, coefficient of linear expansion, water absorption and glass transition temperature are controlled within specific ranges, respectively.例文帳に追加

このポリイミドフィルムは剥離強度、ヤング率、線膨張係数、吸水率およびガラス転移温度が特定の範囲に制御されたものである。 - 特許庁

To provide a laminate suitable for printed wiring substrate, and excellent in low water absorption properties, soldering heat resistance after moisture absorption, soldering heat resistance, electric characteristics, coefficient of linear expansion, property of having no air bubble, peeling strength to copper foil, and presentable appearance.例文帳に追加

プリント配線基板に好適であり、低吸水、吸湿後はんだ耐熱、はんだ耐熱、電気特性、線膨張係数、気泡レス、銅箔とのピール強度、外観に優れた、積層体を提供することである。 - 特許庁

To provide an insulating film which has a low dielectric constant, a low linear thermal expansion coefficient, a high glass transition temperature, a low water absorption coefficient, and sufficient mechanical toughness, and is used for various electronic devices.例文帳に追加

低誘電率、低線熱膨張係数、高ガラス転移温度、低吸水率で、かつ充分な機械的な強靭さを有し、更には優れた製膜加工性を備える、各種電子デバイスにおける絶縁膜を作製する。 - 特許庁

To provide an electrostatic chuck using the material having a small coefficient of linear thermal expansion and capable of increasing a smoothness degree of an absorption surface, and to provide its manufacturing method.例文帳に追加

線熱膨張率が小さく、しかも吸着面の平滑度を高くすることができる材料を用いた静電チャックおよびその製造方法を提供する。 - 特許庁

A mode in which a refractive index (n) of the second linear absorption band at the two-photon absorption excitation wavelength is 1.65 or more and its extinction coefficient (k) is 0.05 or less, a mode in which the two-photon absorption material has a chemical structural part comprising conjugated bonds mutually linked in a circle, and so on are preferable.例文帳に追加

該二光子吸収励起波長における第二の線形吸収帯の屈折率（ｎ）が１．６５以上であり、かつ衰消係数（ｋ）が０．０５以下である態様、共役結合が環状に連結した化学構造部位を有する態様、などが好ましい。 - 特許庁

To provide a polyesterimide having a high glass transition temperature, a low coefficient of linear thermal expansion, low water absorption, a high elastic modulus, satisfactory toughness and adhesion, and to provide its manufacturing method.例文帳に追加

高いガラス転移温度、低い線熱膨張（係数）、低い吸水率、高い弾性率、十分な靭性、十分な密着性を併せ持つポリエステルイミドおよびその製造方法を提供する。 - 特許庁

A rear side reflection polarizing layer 34 having a reflection type polarizing plate 32 with a linear expansion coefficient higher than that of the absorption type polarizing plate 20, 31 bonded is formed on the rear side of either one of the absorption type polarizing plates 20, 31.例文帳に追加

さらに、いずれかの吸収型偏光板２０、３１の裏面側には、当該吸収型偏光板２０、３１よりも線膨張係数の高い反射型偏光板３２を接着してなる裏面側反射偏光層３４が形成してある。 - 特許庁

To provide a polyimide having a high glass transition temperature, a low linear thermal expansion coefficient near to that of copper, a low moisture absorption expansion coefficient, and both satisfactory adhesion to a metal, particularly copper and satisfactory toughness, a precursor of the polyimide, and a process for producing a polyimide.例文帳に追加

高ガラス転移温度、銅に近い低線熱膨張係数、低吸湿膨張率、金属、特に銅との十分な接着性及び十分な靭性を併せ持つポリイミド、ポリイミド前駆体及びポリイミドの製造方法を提供する。 - 特許庁

A front side reflection polarizing layer 33 has a reflection type polarizing plate 30 with a linear expansion coefficient higher than that of the absorption type polarizing plates 20, 31 bonded, and is formed on the front side of either one of the absorption type polarizing plates 20, 31.例文帳に追加

そして、いずれかの吸収型偏光板２０、３１の表面側には、当該吸収型偏光板２０、３１よりも線膨張係数の高い反射型偏光板３０を接着してなる表面側反射偏光層３３が形成してある。 - 特許庁

The polarizing plate is obtained by disposing transparent protective films separately on both surfaces of a polarizing film, wherein the difference between a linear expansion coefficient of the polarizing film in a direction perpendicular to an absorption axis thereof and a linear expansion coefficient of the transparent protective film disposed on at least one surface of the polarizing film in a direction perpendicular to an absorption axis of the polarizing plate is ≤1.3×10^-4/°C.例文帳に追加

偏光フィルムの両面に透明保護フィルムが配置されてなる偏光板であって、上記偏光フィルムの吸収軸に直交する方向の線膨張係数と、その偏光フィルムの少なくとも一方の面に配置される上記透明保護フィルムの偏光板の吸収軸に直交する方向の線膨張係数との差が、１.３×１０^-4／℃以下である偏光板が提供される。 - 特許庁

To provide a film comprising an addition polymer of a norbornene compound, having excellent transparency, chemical resistance and optical characteristics, further having the high glass transition temperature, the low water absorption and the low linear thermal expansion coefficient, and dissolvable in a general solvent.例文帳に追加

透明性、耐薬品性、光学特性に優れ、ガラス転移温度が高く、吸水率が低く、線膨張率が低く、一般溶剤に溶解するノルボルネン化合物付加重合体からなるフィルムを提供する。 - 特許庁

To provide a polyesterimide having a high glass transition temperature, low linear thermal expansion (coefficient), extremely low water absorption, high modulus of elasticity, sufficient toughness and sufficient adhesiveness with metallic foil in combination, and to provide a method for producing the polyesterimide.例文帳に追加

高いガラス転移温度、低い線熱膨張（係数）、極めて低い吸水率、高い弾性率、十分な靭性且つ金属箔との十分な密着性を併せ持つポリエステルイミドおよびその製造方法を提供する。 - 特許庁

In the semiconductive polyimide belt consisting of polyimide resin containing carbon black, a coefficient of linear expansion of moisture absorption is ≤30 ppm/%RH and tearing strength is ≥3.5 N/mm.例文帳に追加

カーボンブラックを含有するポリイミド樹脂からなる半導電性ポリイミドベルトにおいて、吸湿線膨張係数が３０ｐｐｍ／％ＲＨ以下であり、かつ引裂強度が３．５Ｎ／ｍｍ以上である半導電性ポリイミドべルト。 - 特許庁

The design of a circular integral shape is established by forming the retainer 4 out of a resin material provided with (a) a linear expansion coefficient of ≤ 2 to bearing steel or (b) a percentage of water absorption of ≤ 0.5%, or both conditions (a), (b).例文帳に追加

（イ）軸受鋼に対する線膨張係数比が２以下もしくは（ロ）吸水率が０．５％以下または（イ）（ロ）両方の条件を具備する樹脂材料で保持器４を形成することにより、円環形状一体形の設計を成立させる。 - 特許庁

To provide a phenolic resin molding material suitable for applications requiring high dimensional accuracy, which has low mold shrinkage, anisotropy, and a linear expansion coefficient and achieves little dimensional change of a molding due to moisture absorption while maintaining strength thereof.例文帳に追加

成形収縮率とその異方性および線膨張係数が小さく、かつ成形品の強度を保持しつつ吸湿による寸法変化を小さくすることができる、高い寸法精度が要求される用途に適したフェノール樹脂成形材料を提供する。 - 特許庁

To provide a cycloolefin addition copolymer excellent in heat resistance, transparency, low water absorption and moldability and capable of forming an optical material having a high linear expansion coefficient (high in temperature response), to provide a process for producing the cycloolefin addition copolymer and to provide a molding material comprising the cycloolefin addition copolymer.例文帳に追加

耐熱性、透明性、低吸水性及び成形性に優れ、かつ線膨張係数の高い（温度応答性の高い）光学材料となりうる環状オレフィン付加共重合体、その製造方法並びにこの環状オレフィン付加共重合体からなる成形用材料を提供する。 - 特許庁

To provide a fiber-reinforced composite material capable of always keeping high transparency, without being affected by a temperature condition, a wavelength, or the like, excellent in heat resistance, optical characteristics, and mechanical characteristics, and having a small linear thermal expansion coefficient and quantity of deformation by moisture absorption.例文帳に追加

温度条件や波長等に影響を受けることなく常に高い透明性が維持され、耐熱性、光学特性および力学特性に優れており、かつ線熱膨張係数および吸湿による変形量が小さな繊維強化複合材料を提供すること。 - 特許庁

To provide a resin sheet which excels in handling properties and flowability on molding and makes a resin layer having a low linear expansion coefficient and a low water absorption, a printed-wiring board using the resin sheet which can form a thin and fine wiring circuit having excellent reliability, and furthermore a semiconductor device using the printed-wiring board having excellent reliability.例文帳に追加

ハンドリング性、および成形時の流動性に優れ、低線熱膨張係で低吸水の樹脂層となる樹脂シート、及び樹脂シートを用いた信頼性に優れる薄型で、微細配線回路形成が可能なプリント配線板、更には前記プリント配線板を用いた信頼性に優れる半導体装置を提供する。 - 特許庁

A defect part 3 which is provided in a linear photonic crystal structure 1 periodically varying in refractive index and different in cycle at one place is arranged shifting from the center part of the photonic crystal to one side and the defect part 3 is constituted of a light absorbing member made of a material which varies in absorption coefficient with external control light 5.例文帳に追加

周期的に屈折率が変わる一次元フォトニック結晶構造１に設ける1 箇所周期の異なる欠陥部３をフォトニック結晶の中心部より一方側にずれて配置するとともに、前記欠陥部３を外部からの制御光５で吸収係数の変わる材質からなる光吸収部材で構成する。 - 特許庁