外反りの英語

ベルトの反りが小さくかつ外側に反らず、しかもベルト両側での反り量の差が小さくなることで、外観が良好で、搬送機能なども良好な半導電性ベルト、及びその製造方法を提供する。例文帳に追加

To provide an electrically semiconductive belt, in which the warpage of the belt is small and is not directed outward, further the difference in warp quantity between both sides of the belt is small, and thereby which has proper appearance and transportation function and to provide its manufacturing method. - 特許庁

反り検知部の変形が視認されることで、被覆している反り被検知体が反ったことが容易に検知され得るラベル及び外装体、並びに該ラベル及び外装体を備える電池パックを提供する。例文帳に追加

To provide a label and an external package capable of easily detecting warping of a coated warp-detected body by visually confirming the deformation of a warp detection section, and a battery pack having the label and the external package. - 特許庁

また、係止部材１０の凸状部を指で押すだけで、反りが反転し凹状に反り、爪１２がハウジング３０の係止部３５から外れて、ＦＰＣ２００をＦＰＣコネクタ１ａから容易に取り外すことができる。例文帳に追加

The warping is reversed into a recessed configuration only by pushing the protruded portion of the locking member 10 with fingers, so that the pawl 12 is disengaged from the locking portion 35 of a housing 30 to allow the FPC to be easily removed out of the FPC connector 1a. - 特許庁

ウェーハ外周部の裏面の反りが低減し、ウェーハ外周部の平坦度も高まる半導体ウェーハの製造方法を提供する。例文帳に追加

To provide a method of manufacturing a semiconductor wafer by which the warping of the rear surface of the outer peripheral section of a semiconductor wafer can be reduced and the flatness of the outer peripheral section of the wafer can be improved. - 特許庁

ウェーハ外周部の反りにより、プラズマエッチング時にその外周部の温度上昇を十分に抑えることができない。例文帳に追加

To solve a problem that the temperature rise at an outer peripheral part of a wafer cannot fully be avoided during plasma-etching because the outer peripheral part of the wafer suffers bowing. - 特許庁

基材に塗布して紫外線硬化した後の塗布層の反りが小さく、密着性が良好な紫外線硬化性組成物を提供する。例文帳に追加

To provide an ultraviolet-curing composition capable of giving such a coated layer that is low in warpage, when the composition is applied to a base material and then cured by the ultraviolet light, and has good adhesion. - 特許庁

光線硬化性樹脂を成形するための樹脂型であって、樹脂型の反りの無い平坦な状態を零とすると、外周の全周にわたる測定点において、同じ方向への反り量を有し、該反り量の平均値が５０〜７００μｍであるように、樹脂型が凹面状に反っていることを特徴とする樹脂型。例文帳に追加

The resin mold for molding the light-curable resin has a warpage in the same direction, and warped to form a concave face having a mean warpage of 50-700 μm at all measuring points on the whole outer circumference, when the flat state of the mold having no warpage is set to zero. - 特許庁

反り対策処理部１４５は，接合部における基板と部品との距離が所定の範囲外である場合に，基板反り解析用モデル記憶部１４２に記憶された解析用モデルに対して，実装基板の反りへの対策処理を実行する。例文帳に追加

When the distance between the substrate and the components at the joint part is out of the predetermined range, a warp countermeasure process unit 145 executes a countermeasure process against a warp of the mounting substrate on the analysis model stored in the substrate-warp analysis model storage unit 142. - 特許庁