粗田の英語

ピン２へのコイル巻き付けを、根元側３が密に、先端側が粗になるように、ピン１へコイル５を巻き付け、先端粗巻き付け部４側を半田付けする。例文帳に追加

A coil 5 is wound around a pin 1, so that the coil 5 is wound densely on the root side 3 of the pin 1 and roughly on the front end side of the pin 1, and the roughly wound section 4 of the coil 1 on the front end side is soldered. - 特許庁

電極層４の表面平均粗さが小さいため半田層５の濡れ性が向上し、半田層５と半導体装置と間をフラックス無しで強固に接合することができる。例文帳に追加

The wettability of the solder layer 5 is improved since the surface mean roughness of the electrode layer 4 is small, and the solder layer 5 and the semiconductor device can tightly be bonded together without flux. - 特許庁

特に室町時代の高価な「唐物」を尊ぶ風潮に対して、村田珠光はより粗末なありふれた道具を用いる茶の湯を方向付け、武野紹鴎や千利休に代表される堺市の町衆が深化させた。例文帳に追加

Especially during the Muromachi period, contrary to the trend of respecting expensive 'karamono' (things imported from China), Juko MURATA arranged a tea ceremony with coarser and more ordinary tools, at the same time, it became popular among the merchant class of Sakai City which was represented by Shoo TAKENO and SEN no Rikyu.発音を聞く  - Wikipedia日英京都関連文書対訳コーパス

多くは粗暴な悪役で、暗殺事件が序盤でごく短く扱われる場合などは大柄な人相の悪い俳優が演じて、土方と沖田に簡単に成敗されるパターンが多い。例文帳に追加

Most of the time SERIZAWA is portrayed as an ill-mannered villain, and in cases where his assassination occurs at the beginning of the story in a short period of time his role is played by an actor with a large build and a sinister look, and he is easily assassinated by HIJIKATA and OKITA.発音を聞く  - Wikipedia日英京都関連文書対訳コーパス

半田印刷に用いるマスクは、半導体ウエハ１に接する側の主面３２ａの表面粗さを０．３μｍ以下とし、マスク３２のテンションを７００μｍ〜９００μｍとしている。例文帳に追加

The mask 32 used for the solder printing has a surface roughness of 0.3 μm or below for the principal plane 32a on the side in contact with the semiconductor wafer 1, and has a tension of 700 to 900 μm. - 特許庁

半導体装置用リードフレームにおいて、リード３の上面であるワイヤーボンディング部に、ボンディングが可能で樹脂９との密着性を向上させる粗さの表面を持つ粗面めっき層５を形成し、リードの下面である外部接続端子部に、半田の濡れ性が良い平滑な表面を持つ平滑面めっき層６を形成する。例文帳に追加

In the lead frame for a semiconductor device, a rough plated layer 5 having a rough surface where bonding is possible and adhesiveness with the resin 9 is improved is formed at a wire bonding part being the upper surface of the lead 3, and a smooth surface plated layer 6 having a smooth surface where wettability of solder is improved is formed at an external connection terminal part being the lower surface of the lead. - 特許庁

室町幕府滅亡後は、織田信長が大宝寺氏に屋形号を免許するなどしており、天下人の大名優遇策として用いられ、織田信長が鷹を献上してきた返礼として大宝寺義氏に対して屋形号を授けたことが記録されている(義氏は粗暴のため、これを機に悪屋形と呼ばれたという)。例文帳に追加

After the downfall of the Muromachi bakufu, rulers of the whole country used the yakata-go titles for giving preferential treatment to daimyo, as in the case of Nobunaga ODA who authorized the Daihoji clan to hold a title of yakata-go since, as recorded, he had conferred the title on Yoshiuji DAIHOJI in response to his presentation of a falcon to Nobunaga, though Yoshiuji was reportedly so rude that he was called mal-yakata since then.発音を聞く  - Wikipedia日英京都関連文書対訳コーパス

銅メッキされたビアにより表裏導通された回路基板において、ソルダーレジスト８の表面粗化処理、更に半田ボール搭載面の銅露出部のパラジウム除去処理、および表面処理工程が、有機防錆処理、無電解金メッキ、無電解スズメッキ、半田処理からなる半導体パッケージ用基板の製造方法。例文帳に追加

In relation to a circuit board of which the front and back sides are electrically connected through copper-plated vias, in this manufacturing method of a board for a semiconductor package, a surface roughening process of solder resist 8, a palladium removal process of a copper exposure part on a solder ball mounting surface, and a surface treatment process comprises an organic rustproofing process, electroless gold plating, electroless tin plating and a solder process. - 特許庁