immersion platingとは 意味・読み方・使い方

When immersion of the transparent substrate 1 is performed in a plating bath; plating metal is deposited using a catalyst particle as a nucleus, and a conductive pattern 5 is formed of an electroless plating layer 4.例文帳に追加

透明基材１をめっき浴中に浸漬すると、触媒粒子を核としてめっき金属が析出し、無電解めっき層４よりなる導電性パターン５が形成される。 - 特許庁

Immersion plating processing is carried out using a plating bath containing metal ions which has a less tendency to ionize than the iron-based metal magnetic powder to form a plating electrode layer on a portion of the surface of the molding.例文帳に追加

鉄系金属磁性体粉末よりもイオン化傾向が小さい金属イオンを含むめっき浴を用いて置換めっき処理を行って成形体の表面の一部に第１のめっき電極層を形成する。 - 特許庁

A similar effect can be attained when the substrate is subjected to preliminary plating instead of the immersion of the substrate in the pretreatment solution.例文帳に追加

被メッキ物を前処理液に浸漬しても良いし、前処理液で予備メッキしても同様の効果が得られる。 - 特許庁

When the immersion member 742 is used for a foreign matter removing device (gas lift pump 7) attached to the hot-dip metal plating apparatus, the foreign matter (dross D) hardly attaches or fixes to the immersion member 742 and, therefore, the exchange frequency of the immersion member 742 can be reduced.例文帳に追加

この浸漬部材７４２を溶融金属めっき装置１に付設される異物除去装置（ガスリフトポンプ７）に用いると、浸漬部材７４２に対する異物（ドロスＤ）の付着や固着が起こり難くなるので、浸漬部材７４２の交換頻度を少なくすることができる。 - 特許庁

The electronic component comprises: a conductor body 2 that includes a copper and/or a copper alloy-based material; an immersion gold plated film 3 directly formed on the conductor body 2; and an electroless gold plating film 4 formed on the immersion gold plated film 3.例文帳に追加

銅及び／又は銅合金系素材を含む導体部２と、上記導体部２上に直接形成された置換金めっき皮膜３と、上記置換金めっき皮膜３上に形成された無電解金めっき皮膜４と、を有する電子部品。 - 特許庁

To prevent nonuniform plating from occurring by loading or unloading a workpiece into or to the outside of an immersion tank quickly without allowing the workpiece to rub thereon without changing the carrying attitude of the workpiece in a workpiece carrying device in the immersion tank.例文帳に追加

浸漬槽のワーク搬送装置において、ワークの搬送姿勢を変更することなく、速やかに、かつ、ワークが擦れることなく、ワークを浸漬槽内に搬入し、あるいは浸漬槽外に搬出し、めっきむらの発生を防止できるようにする。 - 特許庁

To provide a plating solution and a plating method of electroless gold plating for plating a conductor pattern to be formed on a conductor pattern made of copper or aluminum formed on a printed circuit board or a wafer, in which a gold film is directly deposited by autocatalytic reduction reaction without performing immersion gold plating treatment on an electroless palladium plating film formed on the conductor pattern.例文帳に追加

プリント基板又はウエハー上に形成された銅又はアルミニウムからなる導体パターン上に形成される導体パターンめっきであって、導体パターン上に形成される無電解パラジウムめっき皮膜上に置換金めっき処理を施さなくても、自己触媒還元反応で直接金皮膜を析出させる無電解金めっきのめっき液及びめっき方法を提供する。 - 特許庁

The method has also a cooling process step of cooling the substrates 1 by applying a cooling liquid to the substrates 1 during the period of at least part of the period when the substrates are moved to a position where the plating cleaning process step is carried out after the plating immersion process step.例文帳に追加

また、メッキ浸漬工程後、メッキ洗浄工程を行う位置まで移動する期間のうち少なくとも一部の期間中に、基板１に冷却液を掛けて、基板１を冷却する冷却工程とを備える。 - 特許庁