embeddabilityとは 意味・読み方・使い方

To improve both embeddability and film quality, while maintaining the merit that a substrate temperature is low at forming of a titanium nitride film through CVD(chemical vapor deposition) method, using organic metal raw material gas.例文帳に追加

有機金属原料ガスを用いたＣＶＤ法により窒化チタン膜を成膜するにあたり、基板温度が低いという利点を維持したままで、埋め込み性及び膜質の向上を両立させる。 - 特許庁

To provide a release film having superior flexibility, releasability, heat resistance and contamination resistance, good embeddability especially in printed boards having a precise pattern and superior handling processability in winding and cutting of the sheet.例文帳に追加

柔軟性、離型性、耐熱性、非汚染性に優れ、特に、精密なパターンを有するプリント基板に対する埋込み性が良好で、且つ、シートの巻取りや裁断時の取扱作業性に優れる離型フィルムを提供する。 - 特許庁

To provide a composition for an adhesive sheet which is good in embeddability of circuits without forming air bubbles when laminated on the inner layer circuit surface and capable of forming an adhesive sheet having a low dielectric constant and a low dielectric dissipation factor.例文帳に追加

内層回路表面に積層した際の回路埋め込み性が良好で気泡が形成されることがなく、かつ低誘電率、低誘電正接の接着シートを形成することができる接着シート用組成物を提供する。 - 特許庁

To provide a release film with excellent flexibility, releasability, heat resistance, contamination resistance, in particular, having preferable embeddability into and releasability from a printed board having precise patterns, and with excellent handleability in sheet winding and cutting.例文帳に追加

柔軟性、離型性、耐熱性、非汚染性に優れ、特に、精密なパターンを有するプリント基板に対する埋込み性と離型性を高いレベルで両立でき、かつ、シートの巻取りや裁断時の取扱作業性に優れる離型フィルムを提供する。 - 特許庁

To improve embeddability of an insulating film into a removal region by making proper a removal amount of the region suffering from damage that causes the dielectric constant of the insulating film to be raised, and further improve wiring reliability by reducing the dielectric constant of the insulating film between wirings.例文帳に追加

絶縁膜の誘電率を上昇させるダメージを受けた領域の除去量を適正化することで除去領域への絶縁膜の埋め込み性を改善するとともに配線間の絶縁膜の低誘電率化を図って、配線信頼性の向上を図る。 - 特許庁

To provide an adhesive film for use in semiconductors which is capable of adhering a semiconductor element to such a supporting member of an organic substrate having a substrate level difference as adapted to mount a semiconductor element at low temperatures and without the insufficiency of the embeddability and which is excellent in the reflow resistance, and to provide a manufacturing method of semiconductor devices using this.例文帳に追加

半導体素子と有機基板等の基板段差のある半導体素子搭載用支持部材とを埋め込み性不十分なく低温で接着することができ耐リフロー性の優れた半導体用接着フィルムを用いた半導体装置の製造方法を提供すること。 - 特許庁

To provide a method of forming a through interconnection line in a semiconductor substrate by which a through interconnection line can be so formed as to have a fine embeddability with respect to the inside of a through hole penetrated in a semiconductor substrate and have a good adhesion with an insulation layer formed on the inner surface of the through hole.例文帳に追加

半導体基板に貫設した貫通孔の内側への埋め込み性が良好で且つ貫通孔の内周面に形成された絶縁層との密着性が良好な貫通配線を形成可能な半導体基板への貫通配線の形成方法を提供する。 - 特許庁

To provide a mold release film that exhibits higher embeddability than a conventional PBT type mold release films, while preventing adhesion to the circuit exposure film of a mold release layer and a CL film and adhesion between mold release layers, when the CL film adhered to the circuit exposure film.例文帳に追加

本発明の課題は、回路露出フィルムへのＣＬフィルム接着時において、離型層の回路露出フィルム及びＣＬフィルムへの密着や離型層同士の密着を防ぎつつ、従前のＰＢＴ系離型フィルムよりも良好な埋め込み性を得ることができる離型フィルムを提供することにある。 - 特許庁