共融はんだの英語

銅箔の表面防錆効果を維持することができると共に高融点半田との半田濡れ性はもとより低融点半田（錫−ビスマス半田）との半田濡れ性にも優れる表面処理銅箔を提供することを目的とする。例文帳に追加

To provide a surface-treated copper foil which can maintain the rust preventive effect of a copper foil surface and is excellent in the solder wettability of the copper foil with a low-melting point solder (tin-bismuth solder) as well as a high-melting point solder. - 特許庁

絶縁電線上に、融着層を設けて成る自己融着性絶縁電線において、該融着層は１０５〜１５０℃の温度範囲中に融点がある結晶性共重合ポリアミド樹脂とアルコール可溶性共重合ポリアミド樹脂とをアルコール系有機溶剤を含む混合有機溶剤に溶解してなる融着塗料を塗布焼き付けしてなる自己融着性絶縁電線によって上記課題を解決しうる。例文帳に追加

In the self-bonding insulated wire having a self-bonding layer on an insulated wire, the self-bonding layer is formed by applying and baking a bonding paint prepared by dissolving a crystalline copolymerized polyamide resin having a melting point in the temperature range from 105 to 150°C and an alcohol-soluble copolymerized polyamide resin into a mixture organic solvent containing an alcohol organic solvent. - 特許庁

Sn−1Ag−57Bi共晶の低融点はんだは融点が低いため特に高温での接合部界面の強度、組織の安定性に欠け大気中でのフローでははんだ浴中のドロス量が多い。例文帳に追加

To provide solder which is hardly changed in its structure in spite of long- time use at a high temperature and is capable of assuring joint boundary strength and is hardly oxidizable in spite of long-time use in flow soldering in the atmosphere. - 特許庁

溶融半田の酸化を抑えることができ、酸化かすが溶融半田に混入して循環することを防止でき、又酸化かすを容易に除去できると共に、電子部品のリードの突き出し長さや溶融半田の流速が半田付けに影響を与えることがないようにする。例文帳に追加

To provide a soldering apparatus for a printed board wherein oxidization of the molten solder can be suppressed, oxidized tailings can be prevented from mixing and circulating into the molten solder, oxidized trailings can be removed with ease, and the protrusion length of a lead of electronic parts and a flow speed of the molten solder is prevented from influencing soldering. - 特許庁

Ｓｎ−Ｐｂ共晶はんだの代替Ｐｂフリー低融点ろう材層を具備する電子部品を提供する。例文帳に追加

To provide an electronic component having a Pb-free low melting point brazing metal layer used in place of Sn-Pb eutectic solder. - 特許庁

トナーとして、軟化点或いは融点が５０〜１６０℃と低温で溶融し始めると共に、融点以上で定着温度範囲の温度における粘弾性率が１０〔ｐａ〕以上１０^６〔ｐａ〕以下のものを用いる。例文帳に追加

Such toner is put in use that begins to melt at a low temperature because the softening point or the melting point of the toner is 50 to 160°C, and also, the viscoelastic modulus at a temperature equal to or exceeding the melting point and within the fixation temperature is ≥10 [pa] and ≤10^6 [pa]. - 特許庁

半田切り方法は、パレット装置１と共に基板７を溶融半田８２に浸漬させた後、パレット装置を浸漬位置に残置しつつプリント基板のみを溶融半田の液面から傾斜離脱させる。例文帳に追加

In the solder cutting method, the printed board 7 as well as the pallet device 1 are dipped in molten solder 82 and then while the pallet device is left at a dipping position, only the printed board is tiled and separated from the liquid surface of the molten solder. - 特許庁

溶融ハンダの温度低下や表面酸化を有効に防止すると共に、ノズル治具の清掃効率の向上を図ったハンダ付け装置を提供する。例文帳に追加

To provide a soldering device which effectively prevents a temperature drop and the surface oxidation of molten solder and also improves the cleaning efficiency of a nozzle tool. - 特許庁