気体絶縁物の英語

その加工法は、主動加入した気体と陽極と陰極の発生する化学反応が共同で提供する気体絶縁層により、強大な電圧下でトリガする放電作用により、不良導電性工作物に対して速やかな加工を行い、特に精密な加工作業を行えるようにする。例文帳に追加

The discharging method enables to processes rapidly the nonconductive work piece through discharge operations triggered under a strong voltage at gaseous insulating layer which is provided jointly by a mainly activated added gas and a chemical reaction generated between the positive electrode and the negative electrode, particularly to perform precise processing operation. - 特許庁

そして、反応チャンバー内に、自然エッチングが実質的に避けられるように選ばれる、あらかじめ決められた割合で存在する酸素ガスと窒素ガスとからなる混合気体を流入し、有機化合物含有絶縁層１２をプラズマエッチングする。例文帳に追加

Then a mixed gas, which includes an oxygen gas and a nitrogen gas that are selected so as to prevent natural etching substantially and present at a predetermined proportion, flows into a reaction chamber to make plasma etching to the organic compound containing insulating layer 12. - 特許庁

シルメチレン結合を有するケイ素系ポリマーからなる付加硬化型オルガノポリシルメチレンの提供、並びに該付加硬化型オルガノポリシルメチレンを含有して成り、硬化すると、耐熱性、電気絶縁特性、耐水性、成型加工性に優れ、気体透過性の少ない硬化物を与えるオルガノポリシルメチレン組成物及びその硬化物を提供する。例文帳に追加

To provide an addition curable organopolysilmethylene composed of a silicon-based polymer having a silmethylene linkage; to provide an organopolysilmethylene composition that comprises the addition curable organopolysilmethylene and gives a cured material that is excellent in heat resistance, an electrical insulation characteristic, water resistance, and molding workability, and has a low gas transmission when cured; and to provide the cured material. - 特許庁

シルメチレン結合を有するケイ素系ポリマーからなる縮合硬化型オルガノポリシルメチレンの提供、並びに該縮合硬化型オルガノポリシルメチレンを含有して成り、硬化すると、耐熱性、電気絶縁特性、耐水性、成型加工性に優れ、気体透過性の少ないオルガノポリシルメチレン組成物及びその硬化物を提供する。例文帳に追加

To provide a condensation-curing organopolysilmethylene comprising a silicon-based polymer having a silmethylene bond, to provide an organopolysilmethylene composition comprising the condensation-curing organopolysilmethylene, which exhibits, after cured, excellent heat resistance, electric insulating characteristics, water resistance and moldability and little gas permeability, and to provide a cured product thereof. - 特許庁

第一の工程としてオルガノアルコキシシランの加水分解縮合物を含む塗布液を基板上に塗布して塗布基板を得る工程と、第二の工程として前記塗布基板を７００℃以上９００℃以下の温度で水素を含む気体中で加熱して前記塗布膜を焼成して絶縁膜を形成する焼成工程とを順に含む。例文帳に追加

The method for forming the insulating film includes the following processes in sequence: a process for obtaining a coated substrate by applying a coating liquid including a hydrolysis condensate of organoalkoxysilane to a substrate as a first process, and a burning process for burning the coating film by heating the coated substrate in gas including hydrogen at a temperature of 700-900°C inclusive and forming the insulating film as a second process. - 特許庁

銅配線と比誘電率３．０以下の低誘電率絶縁膜を用いた加工線幅０．１８μｍ以下の半導体チップの製造工程において、特に環境気体中の粒子濃度、湿度、有機物濃度、イオン性ガス濃度を少なくとも１つ一定値以下に維持する基板搬送容器の構成を備えた。例文帳に追加

The manufacturing process of a semiconductor chip of 0.18 μm or less of a working line width using the copper wiring and the low dielectric constant insulation film whose dielectric constant is 3.0 or less is provided with the constitution of the substrate carrying container maintaining, particularly, particle concentration in environmental gas, humidity, organic matter concentration and ion gas concentration at least a constant value or less. - 特許庁