polished offとは 意味・読み方・使い方

After the backside of the wafer 16 is polished, the surface protective tape 14 is peeled off from the wafer 16.例文帳に追加

ウェハ１６の裏面を研磨した後に、表面保護テープ１４をウェハ１６から剥がす。 - 特許庁

Incidentally, there is an expression "seihakudo" (degree of polishing rice), which shows the ratio of polished (scraped off) portion: the higher the value, the more the rice has been polished.発音を聞く 例文帳に追加

ちなみに精白度という呼び方もあるが、こちらは逆で磨いた割合を示すもので、数値が高いほど磨かれていることとなる。 - Wikipedia日英京都関連文書対訳コーパス

Further, a single crystal which is grown in the direction of the <001> axis is cut off perpendicular to the direction of growing of the crystal and the (001) plane of the cut-off crystal is polished, so that the polished single crystal is used as a scintillator plate crystal.例文帳に追加

さらには、単結晶の方位が＜００１＞軸に成長させた単結晶から成長軸に直角に切断、研磨した（００１）面をシンチレータ板結晶とするものである。 - 特許庁

There was this one brown liquid that I thought made my nipples tingle for a second, but I think it was psychosomatic, because I polished off the rest of it and didn't feel shit.例文帳に追加

この茶色の液体で 一瞬乳首が疼いたと思ったけど 気のせいだったようだ - 映画・海外ドラマ英語字幕翻訳辞書

In addition, at least a surface of the substrate 1 on which the interconnection pattern 2 is to be formed is mirror-polished, subsequently the interconnection pattern 2 is formed using the lift-off method on the mirror polished surface.例文帳に追加

また、基板１の、少なくとも配線パターン２を形成すべき面を鏡面研磨した後、該鏡面研磨を施した面に、リフトオフ法により配線パターン２を形成する。 - 特許庁

To provide a polishing apparatus which prevents a substrate as an object to be polished, from coming off, and provides stable polishing.例文帳に追加

研磨対象物である基板が外れてしまうことを防止し、安定した研磨を実現することができるようにする。 - 特許庁

To provide a backup material which does not deteriorate a working environment, is excellent in smoothness, and has appropriate adhesiveness that can fix an object to be polished during polishing and can peel off the object to be polished after polishing.例文帳に追加

作業環境を阻害せずに、平滑性に優れ、研磨の際に研磨対象を固着させ、かつ研磨後に研磨対象を脱離させる適度の粘着性を有するバックアップ材を提供する。 - 特許庁

To provide a semiconductor device manufacturing method including a polishing process of polishing a stepped layer to be polished and a semiconductor wafer polishing device, which are capable of polishing a layer to be polished so as to make it more uniform in thickness without increasing the off-line thickness measurements of the polishing layer in frequency even if the layer to be polished is varied in quality.例文帳に追加

段差を含む被研磨層を研磨する研磨工程を含む半導体装置の製造方法と半導体ウエハの研磨装置において、被研磨膜に膜質のばらつきがあっても、オフラインによる膜厚測定を増やすことなく、より均一な厚さの研磨を行なう。 - 特許庁