例文 (19件) |
円板研削盤の部分一致の例文一覧と使い方
該当件数 : 19件
円盤状基板の研削方法、研削装置例文帳に追加
GRINDING METHOD OF DISK-SHAPED SUBSTRATE AND GRINDING DEVICE - 特許庁
薄板円板状ワークの平面研削方法および平面研削盤例文帳に追加
SURFACE GRINDING METHOD AND SURFACE GRINDING MACHINE FOR SHEET DISC-LIKE WORKPIECE - 特許庁
磁気記録媒体用円盤状基板の研削装置、円盤状基板の製造方法および円盤状基板の研削用砥石例文帳に追加
GRINDING MACHINE FOR MAGNETIC RECORDING DISK BASE, MANUFACTURING METHOD OF DISK BASE, AND GRINDING WHEEL FOR THE DISK BASE - 特許庁
円盤状ガラスを固定するワーク台と円盤状ガラスの内外周面を研削する研削工具とを有する情報記録媒体用ガラス基板の製造装置において、研削工具の磨耗量を測定して、その磨耗量の測定値に応じて円盤状ガラスと研削工具との相対位置をフィードバック制御するようにした。例文帳に追加
In the manufacturing apparatus for the glass substrate for an information recording medium including a work stand fixing the disk-shaped glass and a grinding tool grinding the inner and outer circumference faces of the disk-shaped glass, the wear amount of the grinding tool is measured to execute feedback control of a relative position of the disk-shaped glass to the grinding tool corresponding to the measurement value of the wear amount. - 特許庁
中心に取付孔1を有する円盤状の研削砥石2と、この研削砥石の外周外側に設けた輪状の研磨砥石3とからなり、上記研削砥石と研磨砥石との板面を面一にした構成を採用する。例文帳に追加
The grinding and polishing wheel is composed of the disc shaped grinding wheel 2 having a mounting hole 1 at the center, and the ring-shaped polishing wheel 3 which is provided on the outer peripheral outside of the grinding wheel, and employs such a configuration that the plate surfaces of both the grinding wheel and the polishing wheel are made flush with each other. - 特許庁
傷がなく、表面光沢の優れる研削加工基板を与える円盤状ポ−ラスセラミック製チャックの洗浄方法の提供。例文帳に追加
To provide a washing method of a chuck made from disk-like porous ceramics which gives a ground substrate excellent in a surface gloss without flaw. - 特許庁
ディンプル跡がなく、表面光沢の優れる研削加工基板を与える円盤状ポーラスセラミック製チャックの洗浄方法の提供。例文帳に追加
To provide a washing method for a disk-like porous ceramic-made chuck by which a ground substrate having no dimple mark and superior surface gloss is obtained. - 特許庁
両頭研削盤の両主軸装置1,2における砥石11,21間に、ワーク保持装置3により円板状のワークWを保持する。例文帳に追加
A disk-like work W is held by a work holding device 3 between grinding wheels 11 and 21 of double-spindle devices 1 and 2 of a double-end grinding machine. - 特許庁
ブラシによる円盤状基板の外周研磨工程にて、研磨性能を大幅に向上させて研削傷を滑らかにする。例文帳に追加
To improve polishing performance greatly to make a flaw caused by polishing smooth, in an outer periphery grinding process for polishing a disc-like substrate by a brush. - 特許庁
本発明の装置は、略円盤状の回転砥石1の外側周に設けた凹状の研削面1aに板ガラス4の周縁4aを当接させて研削する板ガラス4の研削装置において、回転砥石1が、その内側から外側周の研削面1aに通じる切削液供給用の貫通孔1bを備えている。例文帳に追加
This grinding device for plate glass 4 performs grinding in such a condition that the peripheral edge of the plate glass 4 is abutted to a concave grinding surface 1a provided at the periphery of a rotary whetstone 1 approximately in a disc shape, wherein the rotary whetstone 1 is furnished with a through hole 1b for supplying machining liquid leading from its inside to the grinding surface 1a at the periphery. - 特許庁
従来の円筒研削盤用ワークドライブ装置においては、ワークの把持爪板9は回転駆動装置の回動の初期に、その駆動軸22aに係合している駆動腕12を把持方向に回動させることによって把持がなされ、次いでワークドライブ装置が回動し研削される。例文帳に追加
In the conventional work drive device for a cylindrical grinding machine, a holding pawl plate 9 for a work holds a work by rotating a driving arm 12 engaged with a driving shaft 22a in the holding direction at the initial stage of rotation of the rotary driving device, and subsequently the work drive device is rotated to grind the work. - 特許庁
超高速研削砥石の円盤状台板1の材質を改良して、比弾性率(縦弾性係数/密度)を向上させ、超高速回転に耐えて寸法精度を確保し、かつ、当該超高速研削砥石の機械的支持や回転駆動を容易ならしめる。例文帳に追加
To improve specific modulus (modulus of longitudinal elasticity/density) by reforming a material of a disc base plate 1 of the ultra high-speed grinding wheel, to secure dimensional precision by enduring ultra high-speed rotation, and to facilitate mechanical support and rotational driving of the ultra high-speed grinding wheel. - 特許庁
回転軸芯方向の端面に研石面を有する砥石円板20を、回転軸芯方向及び回転軸芯方向と直角な方向に移動可能に備え、内孔40と該内孔40から延びる直線状の溝43を有するワークWの上記溝43を研削する溝研削盤及び溝研削方法である。例文帳に追加
In this groove grinding machine and groove grinding method, a grinding wheel disc 20 having a grinding wheel surface on an end face of a rotary shaft center direction is provided movably in the rotary shaft center direction and a direction perpendicular to the rotary shaft center direction,and a linear groove 43 of a workpiece W having an inner hole 40 and the groove 43 extending from the inner hole 40 is ground. - 特許庁
情報記録媒体用ガラス基板は、中心に円孔を有する円盤状のガラス素板の外周端面及び内周端面を研削して製造される。例文帳に追加
The glass substrate is manufactured by grinding the outer peripheral end face and the inner peripheral end face of a disk shaped glass base plate having a circular hole at its center. - 特許庁
回転円盤13内には、薄板ワーク15の研削平面15bと反対側の平面15cを面接触にて受けるとともに、その平面15cの形状に沿って変形可能な保持部材16を配置する。例文帳に追加
A holding member 16 which can receive the plane 15c of the opposite side to the grinding plane 15b of the thin plate work 15 with a surface contact and is deformable along the shape of the plane 15c is arranged in the rotary disc 13. - 特許庁
切断、研削用の回転円盤砥石の基板スリット構造において、スリット形状の改良により、良好な切粉の排出と冷却水の供給を維持したうえで、首下摩耗を効果的に低減させる。例文帳に追加
To effectively reduce under head wear in addition to maintaining excellent discharge of chips and supply of cooling water by improving slit shape in the base slit structure of a cutting and grinding rotary disc type grinding wheel. - 特許庁
中心孔を有する円盤状のガラス基板の内外周端面に対して少なくとも、研削加工を施す工程と、エッチング加工を施す工程と、ポリッシュ加工を施す工程とを、この順で含む。例文帳に追加
A method for manufacturing a glass substrate for a magnetic recording medium includes at least a step for performing a grinding process, a step for performing an etching process, and a step for performing a polishing process in this order with respect to inner and outer peripheral end surfaces of a disk-like glass substrate having a center hole. - 特許庁
溝研削盤の動力伝達装置において、動力伝達部材として利用するベルトの寿命を延ばすと共に、砥石円板の振動等を防止し、ワークの加工品質の向上を図る。例文帳に追加
To lengthen the service life of belts used as power transmission members in a power transmission device for a groove grinding machine and to improve workpiece machining quality by preventing the vibration or the like of a grinding wheel disk. - 特許庁
ドレッサ付基盤ホルダー機構の円盤状半導体基板ホルダーテーブル4上面の外周縁部に環状堤40を設けた円盤状半導体基板ホルダーテーブル上面に半導体基板3を載置し、回転している前記半導体基板3面に回転しているカップホイール型砥石50を下降させながら切り込み研削をかける。例文帳に追加
A semiconductor substrate 3 is placed on the upper surface of a disc-like semiconductor substrate holder table 4, with an annular bank 40 at its outer circumferential edge in a substrate holder mechanism with dresser, and a turning cup wheel-type grinding stone 50 is lowered to the rotating semiconductor substrate 3 so as to notch and grind it. - 特許庁
例文 (19件) |
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