THICKNESS OF PROCESSED PLATEとは 意味・読み方・使い方

An aluminum fin 1 processed into the shape of an accordion and a copper plate 2 are solder bonded to each other and copper plating of 1.0-20 μm in thickness or plating containing nickel of 0.5-20 μm in thickness is applied to the solder bonded surface of the aluminum fin 1.例文帳に追加

アコーディオン状に加工されたアルミニウムフィン１と、銅板２とがはんだ接合され、アルミニウムフィン１のはんだ接合する面に、厚さ１．０μｍ〜２０μｍの銅めっき、または、厚さ０．５μｍ〜２０μｍのニッケル含有めっきを施す。 - 特許庁

To provide a method and apparatus for hydroforming capable of reducing plate thickness decrement through tube expansion by a frictional force between a tubular body to be formed and a forming die, when a piece of the tubular body to be formed is processed by the hydroforming method.例文帳に追加

１本の管状被成形体をハイドロフォーミング方法で加工する場合、管状被成形体と成形型との間の摩擦力によって拡管による板厚減少を生じる。 - 特許庁

A metal made closed drum in which a seam of the drum is superimpose-welded, a bottom plate is jointed to one end thereof, the welded part of the seam of a barrel is crash-processed to the thickness within a range of 100-130% against the plate thickness over its whole length, and the barrel and the bottom plate are jointed by electric resistance welding over the whole length.例文帳に追加

胴部の継目が重ね合せ溶接され、その一方の端部に地板が接合され、胴部の継目の溶接部がその全長にわたって、板厚に対して１００〜１３０％の範囲内の厚さに圧潰加工されており、さらに前記胴部と地板が全周にわたって電気抵抗溶接により接合されている金属製クローズドドラム缶。 - 特許庁

To provide a metallic plate material provided with a burring-shape part which obtains sufficient burring-shaped height to a function in a member to be processed, having burring tip shape in parallel with the plate surface and thick thickness and further, possible to tap even in the case of being a thin plate.例文帳に追加

薄板でもタップ加工可能で、バーリング先端形状が板面と平行で、また、肉厚の厚いかつ加工される部材の機能に十分なバーリング形状の高さが得られるバーリング形状部を備えた金属板材を提供することにある。 - 特許庁

The OLPF 1 uses a birefringent plate made of a crystal or the like with a birefringent property and processed to have a prescribed plate thickness and separates an incident ray L1 into a normal ray L2 and an abnormal ray L3.例文帳に追加

ＯＬＰＦ１は、所定の板厚に加工した複屈折性を有する結晶等からなる複屈折板が使用され、入射する光線Ｌ１を常光線Ｌ２と異常光線Ｌ３とに分離させるものである。 - 特許庁

The package base 3 is used in which Au/Ni plated isotropy high-density carbon fibers are processed into a flat plate 3 mm in thickness and a step 8 of 0.1 mm is formed on a part of its surface and the plate is sliced into a 2 mm×4 mm rectangle member with a wire or a slice.例文帳に追加

パッケージ基台３として、Au/Niメッキ処理等方性高密度炭素繊維を厚さ3ｍｍの平板に加工し、表面の一部に0.1ｍｍの段差８が形成され、ワイヤーもしくはスライスで２ｍｍ×４ｍｍ長方形部材にスライスされたものを用いる。 - 特許庁

Polarization treatment (S2) is performed in the specified direction of board thickness based on the external form, after the external form of plate-shaped piezoelectric material is processed (for example, one angle of a rectangle is cut off) into the form without a right and left symmetric axis (S1).例文帳に追加

板状圧電材料の外形を左右対称軸を有しない形状に加工（例えば長方形の１つの角を切り欠く）した後で（Ｓ１），その外形に基づいて所定の板厚方向に分極処理を施す（Ｓ２）。 - 特許庁

A number of hole parts 5 is formed on the surface of a core main body 1 made of synthetic resin, a heating element 11 with an SUS plate with a thickness of around 30 μm processed into a strip state is stuck on the hole parts 5, and synthetic rubber is molded around it.例文帳に追加

合成樹脂製のコア本体１の表面に多数個の穴部５を形成し、この穴部５に厚み３０μｍ程度のＳＵＳ板を条板状に加工した発熱体１１を貼り付け、これらの周囲に合成ゴムをモールドする。 - 特許庁