削片板の英語

複合プリント基板を複数のプリント基板に分割加工する際に生じる切削片を、効率的に集塵することができるようにする。例文帳に追加

To efficiently collect cutting pieces generated when dividing and processing a composite printed circuit board into a plurality of printed circuit boards. - 特許庁

表面のガラスを削除した台板１に、抑止片３，４もしくは抑止板５を設けたパネル及び額縁。例文帳に追加

The panel and picture frame are provided with retaining pieces 3 and 4 or retaining plates 5 on the baseplate 1, from which surface glass is chipped off. - 特許庁

極く狭い空隙部を有して接合された基板と板状物とで構成された積層体の板状物を研削切断するにあたり、研削切断中に生ずる板状物の破片によって基板が損傷されるのを防止することの出来る、積層体の研削加工方法を提供すること。例文帳に追加

To provide a grinding method for a laminate which can prevent a substrate from being damaged by fragments of a plate-like object occurring at the time of grind-cutting the plate-like object of a laminate which is made by joining the plate-like object to the substrate with an extremely narrow gap part left in-between. - 特許庁

化粧板を製造する際には、（ａ）少なくとも表面が木質材によって形成されている化粧基板１２を準備し、（ｂ）化粧基板１２の表面を面均一に研削し、（ｃ）研削により生じた微小木切片を除去する。例文帳に追加

When the decorative laminate material is manufactured, (a) a decorative base 12 with at least, a surface formed of a wood material, is prepared, (b) the surface of the decorative base 12 is uniformly ground, and (c) microwood chips produced by grinding are removed. - 特許庁

極低炭Ｔｉ添加鋼板を用いた、メッキ表面の模様性欠陥の少ない合金化亜鉛メッキ鋼板の製造方法において、鋳片溶削や鋼板研削による鉄歩留ロスの少ない製造方法を提供する。例文帳に追加

To provide a manufacturing method causing little loss of iron yield due to the scarfing of a slab or the grinding of a steel sheet, in a method for manufacturing the galvannealed steel sheet having few figuratus defects on a plated surface, with the use of a steel sheet containing Ti and extremely low carbon. - 特許庁

金属切削に用いられたステッピング切削法を円形片刃の多数刃取付と高速回転、高速送りでアクリル板等の平滑透明切削作業を行う。例文帳に追加

In a stepping cutting method used for metal cutting, smooth transparent cutting work of the acrylic board or the like is performed by attachment, high-speed rotation, and high-speed feed of many round edges. - 特許庁

小片板状物Ｗ１に、切削ブレードの切り込み方向の位置調整用の第一の切削溝Ｇ１〜Ｇ５と割り出し方向の位置調整用の第二の切削溝Ｇ６とを非平行に形成する。例文帳に追加

First cutting grooves G1 to G5 for adjusting a position in the cut-in direction of the cutting blade, and a second cutting groove G6 for adjusting a position in the indexing direction, are formed in non-parallel on a small plate-like piece W1. - 特許庁

ウエハの少なくとも片面を研削してその研削面に導電層を形成し、研削面と反対側の面に外部端子を設けた構造として、電子部品内蔵基板に適用したとき薄型化を実現できるようにした。例文帳に追加

Reduction in thickness in application into the substrate including built-in electronic component has been realized as a structure that at least single surface of a wafer is ground, a conductive layer is formed on the ground surface, and an external terminal is provided to the surface opposing to the ground surface. - 特許庁