後方散乱電子回折の英語

判定工程と解析工程とは、電子後方散乱回折像法を用いて行うことができる。例文帳に追加

The determination process and the analysis process can be performed by using an electronic back scattering diffraction image method. - 特許庁

単結晶試料又は配向性が高い多結晶試料であっても、電子後方散乱回折像のコントラストを改善することができる方法を提供する。例文帳に追加

To provide a method capable of improving a contrast of an electron backscattering diffraction image, even in the case of a monocrystal sample or a polycrystal sample having high orientation. - 特許庁

後方散乱電子線回折パターン法（ＥＢＳＰ法）を用いて、同じ試料座標上で外形形状と結晶方位の位置関係が明確な基準試料を用いて比較測定する事で、被検体の外形形状と結晶方位の位置関係を明確にする。例文帳に追加

A position relation between an external shape and the crystal orientation of a specimen is clarified by comparative measurement using a reference sample having a clear position relation between the external shape and the crystal orientation on the same sample coordinate, by using a back-scattered electron beam diffraction pattern method (EBSP method). - 特許庁

電子線後方散乱回折像やコッセル回折像を用いて結晶方位をマッピングする結晶方位測定方法で測定した正しい結晶方位と誤った結晶方位との間に特定の結晶方位関係をもって生ずる系統的に発生する誤った結晶方位を検知し、誤った結晶方位を修正できる結晶方位測定方法を提供する。例文帳に追加

To provide a crystal orientation measuring method, capable of detecting a wrong crystal orientation generated systematically with a specific crystal orientation relation between a correct crystal orientation and a wrong crystal orientation measured by the crystal orientation measuring method for mapping the crystal orientation, by using an electron beam backward scattering diffraction image or a Kossel diffraction image, and correcting the wrong crystal orientation. - 特許庁

電子ビームＢ２によって測定面Ｓ１を走査し、測定面Ｓ１内の各ピクセルに関して、検出部６による電子線後方散乱回折パターンの検出、及び、データ処理部９によるデータＤ１の解析を行うことにより、測定面Ｓ１に関する結晶方位の二次元分布データＫ１が得られる。例文帳に追加

A measuring surface S1 is scanned by an electron beam B2 and the detection of an electron beam back scattering diffraction pattern by a detection part 6 and the analysis of data D1 by a data processing part 9 are performed in relation to the respective pixels in the measuring surface S1 to obtain the two-dimensional distribution data K1 of a crystal orientation related to the measuring surface S1. - 特許庁

立方晶の金属組織に１５ｎｍ〜１００μｍ間隔で電子線を照射して、後方散乱電子回折像法より測定点毎に結晶方位を決定し、決定した結晶方位分布および隣接する前記測定点間の方位角度差より、格子歪を決定し、前記格子歪に基づいて金属組織上における残留応力分布を求める。例文帳に追加

A metal structure of a cubic crystal is irradiated with electron beams at an interval of 15 nm-100 μm to determine a crystal orientation at every measuring point by a back scattering electron diffraction image method, and lattice strain is determined from the determined crystal orientation distribution and the orientation angle difference between the adjacent measuring points to calculate the residual stress distribution on the metal structure on the basis of the lattice strain. - 特許庁

後方散乱電子線回折（ＥＢＳＤ）法により得られた塑性変形を受けていない多結晶材料の結晶情報を用いて、多結晶材料が巨視的変形を受けた際の微視組織の不均一変形状態を、簡易な方法で迅速且つ確実に予測し、多結晶材料の塑性変形時の機械特性を正確に得る。例文帳に追加

To accurately obtain mechanical characteristics at the time of plastic deformation of a polycrystalline material by rapidly and certainly estimating the non-uniform deformation state of the microscopic texture of the polycrystalline material when the polycrystalline material receives macroscopic deformation by a simple method using the crystal data of the polycrystalline material receiving no plastic deformation obtained by a back scattering electron beam diffraction (EBSD) method. - 特許庁