bottoms outとは 意味・読み方・使い方

As the result, when a vulcanized large tire is taken out, even when diameter expansion of the sector mold and carrying-out of the vulcanized large tire are approximately simultaneously performed, the smoothly curved circular arc parts 78 are brought into contact with channel bottoms of the lug channels and tread faces.例文帳に追加

この結果、加硫済み大型タイヤを取り出す際、セクターモールド43の拡径と加硫済み大型タイヤの搬出とがほぼ同時に行われても、滑らかに湾曲している円弧部78がラグ溝の溝底や踏面に接触することとなる。 - 特許庁

The method for purifying the hydroxyalkyl (meth)acrylate comprises sending a feed solution being the hydroxyalkyl (meth)acrylate containing the high-boiling impurities to a film evaporator, separating the feed solution into a distillate containing mainly the hydroxyalkyl (meth)acrylate and bottoms containing the high-boiling impurities, taking out them from the film evaporator, mixing the bottoms with the feed solution and resending the mixture to the thin evaporator.例文帳に追加

本発明のヒドロキシアルキル（メタ）アクリレートの精製方法では、高沸点不純物を含むヒドロキシアルキル（メタ）アクリレートである供給液を薄膜蒸発器に送り、主にヒドロキシアルキル（メタ）アクリレートを含有する留出液と、高沸点不純物を含有する缶出液とに分離して前記薄膜蒸発器から取出し、前記缶出液を前記供給液に混合して再び薄膜蒸発器に送る。 - 特許庁

In addition, grooves 17 the bottoms of which do not reach the intermediate-layer section 2 are formed above a weight body 19 and the lead-out electrodes 16 by first grinding and cutting for forming chips is performed by second grinding.例文帳に追加

そして、１回目の研削で、重錘体１９と、引き出し電極１６の上方に底が中層部２に達しない溝１７を形成し、２回目の研削で、チップ化のためのカットを行う。 - 特許庁

To obtain a holding substrate which holds minute amounts of samples or chemicals, collects these samples or chemicals on the bottoms of recessed parts and accordingly takes out these samples or chemicals surely and to provide a method for producing the same.例文帳に追加

微量のサンプルや薬品を収容して、しかもこれらサンプルや薬品が凹部の底部に集まり、従って確実にこれらサンプルや薬品を取り出すことができる収容基板とその製造方法を提供すること。 - 特許庁

During conveyance of the perforated vessels 2 with their bottoms partly immersed in the tank 1, the roots, skins, tailings, etc., of bean sprouts in the perforated vessels 2 are washed off by water sprinkled from the shower 5 and run out of the vessels 2.例文帳に追加

多孔質容器２が水槽１内に部分的に浸漬された状態で搬送されている間に、多孔質容器２内のもやしはシャワー５からの噴水によって根、殻、滓などが洗われて多孔質容器２の外へ流出される。 - 特許庁

Ditches 10, into which a peripheral part of the wafer 7 is inserted and pulled out through the importing and exporting port 9, are formed for each struts 3, 4 and 5, and the wafer 7 is supported by the struts 3, 4 and 5 via the bottoms of the ditches 10.例文帳に追加

各支柱３、４、５に、その出入口９を通って出し入れされるウエハ７の周縁部を挿入可能な溝１０が形成され、その溝１０の底部を介してウエハ７は支柱３、４、５により支持される。 - 特許庁

A covered layer 18 is formed, and an etching is carried out by making mask layers 22 as the etching masks, so as to remove the projections of the covered layer 18 at the opening bottoms of the mask layers 22 at a desired thickness.例文帳に追加

被覆層１８を形成して、マスク層２２をエッチングマスクとしてエッチングを行い、マスク層２２の開口底部の被覆層１８の突起部を所望の厚さだけ除去する。 - 特許庁

A second surface 14 of the semiconductor substrate 10, where conducting sections 40 are provided in the recesses 32 with their ends 42 fit into the bottoms of the recesses 32, is scraped for the exposure of at least part of the ends 42 of the conducting sections 40 out of the second surface 14.例文帳に追加

凹部３２に、底部に対応する先端部４２を有するように導電部４０を設ける半導体基板１０の第２の面１４を削って、導電部４０の先端部４２の少なくとも一部を、第２の面１４から露出させる。 - 特許庁