ACTIVATING COMPOSITION FOR PRETREATMENT OF DISPLACING-PRECIPITATION-TYPE GOLD PLATING例文帳に追加

置換析出型金めっきの前処理用活性化組成物 - 特許庁

COMPOSITION FOR FORMING ELECTROLESS PLATING PATTERN, ELECTROLESS PLATING PATTERN, AND METHOD OF FORMING THE SAME例文帳に追加

無電解めっきパターン形成用組成物、無電解めっきパターン及びその形成方法 - 特許庁

COMPOSITION FOR DISCOLORATION AND CORROSION PREVENTION OF SILVER, SILVER PLATING, SILVER ALLY, OR SILVER ALLOY PLATING例文帳に追加

銀若しくは銀めっき又は銀合金若しくは銀合金めっきの変色・腐食防止用組成物 - 特許庁

To uniformize the thickness and the composition of a plating film by sufficiently stirring a plating solution in a plating tank.例文帳に追加

めっき槽内のめっき液を十分に撹拌することができて、めっき膜の厚さ及び組成を均一にする。 - 特許庁

RADIATION-SENSITIVE RESIN COMPOSITION AND MANUFACTURING METHOD OF PRODUCT FORMED BY PLATING例文帳に追加

感放射線性樹脂組成物およびメッキ造形物の製造方法 - 特許庁

COATING COMPOSITION FOR CHROME PLATING AND ARTICLE HAVING COATED FILM COMPOSED OF THE SAME例文帳に追加

クロムめっき用塗料組成物およびこれからなる塗膜を有する物品 - 特許庁

This plating device is provided with a plating processing part 12 for executing plating onto a semiconductor wafer of a treating object, using the plating liquid, a main component control part 2 for analyzing the plating liquid to regulate a composition of the plating liquid based on a result therein, and a micro component control part 3.例文帳に追加

このめっき装置は、めっき液を用いて処理対象の半導体ウエハにめっきを施すめっき処理部１２と、めっき液を分析してその結果に基づいてめっき液の組成を調整する主成分管理部２および微量成分管理部３とを備えている。 - 特許庁

To provide a palladium plating solution capable of forming a palladium plating film which can further improve solder characteristics of the film in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on the surface of a conductive body made of a metal such as copper.例文帳に追加

銅などの金属から形成された導体表面上に、ニッケルめっき被膜、パラジウムめっき被膜、金めっき被膜という構成を備えた表面処理において、その半田特性を更に向上できるパラジウムめっき被膜が形成可能となるめっき液を提供する。 - 特許庁

To provide a forming apparatus of plating film for constantly and accurately monitoring the composition of a plating liquid by a simple method, and to provide a controlling method of the forming apparatus.例文帳に追加

めっき液の組成を簡単な方法で常時的確に監視できるめっき膜形成装置およびその制御方法を提供する。 - 特許庁

To provide an electroless plating device which is capable of reducing incomplete plating or irregular plating, small in degradation of a plating solution and change in concentration of the composition of the plating solution, capable of keeping the plating temperature at a specified temperature, stable in plating quality, and capable of avoiding the increase in the cost in disposing the solution and the excessive burden on the environment.例文帳に追加

めっき欠け、めっきムラを少なくすることができ、めっき液の劣化、めっき液組成の濃度変化が少なく、めっき温度を所定の一定温度に保持でき、品質の安定しためっきを行なうことができ、且つ廃液に伴うコスト上昇及び環境への過大な負担を回避できる無電解めっき装置を提供する。 - 特許庁

To provide an indium electrolytic plating method in which the improved stability of an electrolytic plating composition and improved surface shape of a deposit are provided.例文帳に追加

向上された電気めっき組成物の安定性および堆積物の形状を提供するインジウム電気めっき方法を提供する。 - 特許庁

A plating coat is formed on the surface of at least one part of the plated body formed from a thermoplastic resin composition to form the plating coating body.例文帳に追加

熱可塑性樹脂組成物で形成された被メッキ体の少なくとも一部の表面に、メッキ被膜を形成し、メッキ被覆体を形成する。 - 特許庁

METHOD OF APPLYING NICKEL PLATING TO ELECTROCONDUCTIVE FILM ON METALLIC OXIDE COMPACTED SINTERED MATTER AND NICKEL PLATING LIQUID COMPOSITION FOR ELECTRICALLY CONDUCTIVE FILM例文帳に追加

金属酸化物粉体成形焼成物上の導電膜にニッケルメッキを施す方法と、導電膜用ニッケルメッキ液組成物 - 特許庁

The plating solution composition is used at pH 5.5 to 8 and at a temperature of 30 to 70°C, and applies electroless copper plating to the substrate to be plated.例文帳に追加

前記めっき液組成物をｐＨ５．５〜８、温度３０〜７０℃で使用し、被めっき基板に無電解銅めっきを施す。 - 特許庁

To variably control a composition and a component ratio of a plating bath newly introduced to a plating tank, during a film formation treatment, in real time.例文帳に追加

成膜処理中にメッキ槽に新規に導入されるメッキ液の組成または成分比をリアルタイムに可変制御できるようにすること。 - 特許庁

POSITIVE-TYPE RADIATION-SENSITIVE RESIN COMPOSITION FOR PRODUCING METAL-PLATING FORMED MATERIAL, TRANSCRIPTION FILM, AND PRODUCTION METHOD OF METAL-PLATING FORMED MATERIAL例文帳に追加

メッキ造形物製造用ポジ型感放射線性樹脂組成物、転写フィルムおよびメッキ造形物の製造方法 - 特許庁

The plating bath does not contain the cyano-compound, is stable and is capable of applying the tin-silver alloy plating over a wide composition ratio without using an outer power source.例文帳に追加

シアン化合物を含有せず、安定であり、外部電源を用いずに、広い組成範囲で錫—銀合金めっきを施すことができる。 - 特許庁

To provide a resin composition for plating, excellent in all of plating adhesion strength, moldability, impact resistance and a low linear expansion coefficient, and a resin-plated product.例文帳に追加

めっき密着強度、成形性、耐衝撃性、低線膨張率のいずれもが優れためっき用樹脂組成物、及び樹脂めっき製品を提供する。 - 特許庁

To stabilize a plating liquid, to suppress variation in the composition of a plating layer, and to easily and securely form an Sn-Ag alloy layer.例文帳に追加

めっき液を安定させ、めっき層の組成のバラツキを抑制し、容易かつ確実にＳｎ−Ａｇ合金層を形成する。 - 特許庁

To provide a method for suppressing the growth of a microorganism in a plating system, which does not exert an effect on a composition of a plating solution and the like without adding any substance, regardless of a component of a solution in a plating tank.例文帳に追加

めっき槽の溶液成分に関わらず、また何ら物質を添加せずめっき液等の組成に影響を与えることなく、めっきシステム内の微生物増殖を抑制する方法を提供すること。 - 特許庁

The plating treatment can be performed with the plating solution in a consistent state by setting the lapse of time after the solution temperature is adjusted to the predetermined value to be within a certain value, and dispersion of the composition of the plating solution and the film thickness can be reduced.例文帳に追加

設定温度に液温が調節されてからの経過時間をある時間内とすることで、メッキ液が安定した状態でメッキ処理を行え、メッキ液の組成、膜厚のバラツキを低減できる。 - 特許庁

To provide a palladium alloy plating solution having high stability and capable of stably forming a plating film of a prescribed alloy composition with the palladium alloy plating solution.例文帳に追加

本発明は、パラジウム合金めっき液に関し、めっき液の安定性が高く、所定の合金組成のめっき膜を安定して形成することが可能なパラジウム合金めっき液を提供することを目的とする。 - 特許庁

COMPOSITION FOR PRETREATMENT OF ELECTROLESS PLATING AND METHOD FOR PRODUCING OPTICAL CIRCUIT BOARD USING THE SAME例文帳に追加

無電解めっき前処理用組成物およびそれを用いた光回路基板の製造方法 - 特許庁

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT AND PRODUCTION OF PLATING RESIST USING THESE例文帳に追加

感光性樹脂組成物、感光性エレメント及びこれらを用いためっきレジストの製造方法 - 特許庁

To provide a photosensitive resin composition capable of forming a cured product layer which hardly contaminates a plating solution and exhibits excellent plating resistance when electroless plating is carried out.例文帳に追加

無電解めっきを行った場合に、めっき液の汚染が少なく、しかも優れた耐めっき性を発揮し得る硬化物層を形成することができる感光性樹脂組成物を提供する。 - 特許庁

A heat-resistance resin composition covering for electroless plating for eliminating the need for the corrosion of one surface or both the surfaces of a polyimide films is formed, electroless copper plating is made by each process of covering activation, catalysis imparting, and catalysis activation, and then copper plating covering is formed to desired thickness through electroless plating.例文帳に追加

ポリイミドフィルムの片面或いは両面腐食工程が不要の耐熱性無電解めっき用樹脂組成物被膜を形成し、被膜活性化、触媒付与、触媒活性化の各工程により無電解銅めっきを行った後、電解めっきにより銅めっき皮膜を所望の厚さに形成する。 - 特許庁

Also disclosed is a method for forming a plating film onto a printed circuit board comprising a process where an electroless nickel plating film is formed on the conductor part of a printed circuit board, thereafter, activation treatment for the nickel plating film is performed using the above activation composition, and subsequently, electroless palladium plating is performed.例文帳に追加

プリント配線板の導体部分に無電解ニッケルめっき皮膜を形成した後、上記活性化組成物を用いてニッケルめっき皮膜の活性化処理を行い、その後、無電解パラジウムめっきを行う工程を含むプリント配線板へのめっき皮膜形成方法。 - 特許庁

To obtain a PC/ABS-type resin composition for plating having improved plating property (adhesion strength, heat cycle property and plating appearance) of PC/ABS, particularly, having excellent plating property to a large-sized molded article or a complicated-shape molded article, and to provide a plated molded article using the same.例文帳に追加

ＰＣ／ＡＢＳのメッキ性（密着強度、ヒートサイクル性、メッキ外観）の改良、特に大型成形品や複雑な形状の成形品に対してもメッキ性の良好なメッキ用ＰＣ／ＡＢＳ系樹脂組成物およびメッキ成形品を提供すること。 - 特許庁

A plating layer is provided to each side of the conductive composition composed of a crystalline polymer matrix and a conductive filler, and then the conductive composition with the plating layers is hot-pressed into the PTC device.例文帳に追加

結晶性ポリマーのマトリックスと導電性フィラーからなる導電性組成物の両面にめっき層を設けた後、熱プレス処理してＰＴＣ素子とする。 - 特許庁

Alternatively, when further performing an electrolytic plating process for forming a conductive metal layer 6 on the surface of the conductive composition layer by electrolytic plating so that the conductor pattern layer includes the conductive composition layer and the conductive metal layer, the electrolytic plating processing is performed after the cutting process.例文帳に追加

或いは更に導電性組成物層の表面に電解めっきで導電性金属層６を形成し導電体パターン層が導電性組成物層と導電性金属層を含む層とする電解めっき工程を行うときは、裁断工程の後に行う。 - 特許庁

The primer composition for electroless plating contains metal colloidal particles, a hardening composition hardenable at a temperature of 120°C or lower and a solvent.例文帳に追加

金属コロイド粒子、１２０℃以下で硬化可能な硬化性組成物及び溶媒を含有する無電解めっき用プライマー組成物。 - 特許庁

To provide a radiation-sensitive resin composition capable of forming a radiation-sensitive resin composition film thicker than plating and having high resolution.例文帳に追加

めっきの高さ以上の感放射線性樹脂組成物塗膜が形成でき、かつ高い解像性を有する感放射線性樹脂組成物を提供すること。 - 特許庁

At the time of electroless plating of copper on a barrier layer 5 formed on the surface of the connection hole 6, a salt of a metal such as gold, nickel, palladium, cobalt and platinum is added as a plating accelerating agent in the quantity of ≤1 mol% to the salt of copper in the electroless plating liquid composition.例文帳に追加

接続孔６の表面に形成されたバリア層５上に銅の無電解めっきを行うに際し、めっき促進剤として金、ニッケル、パラジウム、コバルト及び白金などの金属の塩を、この無電解めっき液組成中の銅の塩に対して１モル％以下の量で添加する。 - 特許庁

To provide a composition for preventing plating deposition capable of preventing any deposition of a plating film on the insulating coating part of a plating tool even when using an etching liquid other than the mixture of chromic acid and sulfuric acid, for example, a permanganate aqueous solution, or even when increasing the amount of catalyst deposition.例文帳に追加

クロム酸—硫酸混液以外のエッチング処理液、例えば、過マンガン酸塩水溶液を用いた場合や、触媒付着量を多くした場合であっても、めっき用治具の絶縁性コーティング部分に対するめっき皮膜の析出を防止することが可能なめっき析出阻害用組成物を提供する。 - 特許庁

To provide a gelatinous plating composition which is used in electroplating and electroless plating for applying a thin coating film of a metal such as copper, nickel or gold or a composite metal of these metals on the surface of a metal or a nonmetal and which has excellent stability, allows a uniform metal coating film to be formed, and is suitable for partial plating.例文帳に追加

金属又は非金属の表面に、銅、ニッケル、金などの金属やこれらの複合金属の薄い被膜を施す電解メッキ、無電解メッキに用いる安定性に優れ、均一な金属被膜を形成できる部分メッキ等に好適なゲル状メッキ組成物を提供する。 - 特許庁

An intermediate layer composed of alloy plating having a composition consisting of 10-50% nickel and the balance tin with inevitable impurities and a surface layer composed of tin or tin-alloy plating are provided to a base material composed of copper or copper alloy.例文帳に追加

銅又は銅合金の母材に対し、ニッケルを１０％〜５０％含有し、残部が錫および不可避不純物からなる合金めっき中間層と、錫又は錫合金めっきの表層とを備えた。 - 特許庁

When the metal layer is provided by electroless metal plating, the resin composition being patterned preferably contains a component adsorbing a catalytic metal for electroless metal plating or a catalytic metal becoming the substrate of electroless meta plating.例文帳に追加

このように無電解金属メッキで金属層を設ける場合は、パターン化される樹脂組成物は、無電解金属メッキのための触媒金属を吸着する成分、又は無電解金属メッキの下地となる触媒金属を含有していることが望ましい。 - 特許庁

To provide a thermosetting resin composition for electroless plating primer capable of inexpensively forming an electroless plating film having excellent adhesion to a base material and also having excellent surface smoothness without using harmful chemicals such as chromic acid and sulfuric acid or the like, and to provide an electroless plating treatment method using the same.例文帳に追加

クロム酸や硫酸などの有害な薬品等を使用することなく、基材との密着性に優れ、かつ表面平滑性に優れる無電解めっき被膜を安価に形成できる無電解めっきプライマー用熱硬化性樹脂組成物及びそれを用いた無電解めっき処理方法を提供すること。 - 特許庁

The gelatinous plating composition contains at least a plating solution, a gelling agent, a hardness adjusting agent, and a plating surface adjusting agent, and is characterized in that the pH is 2.0-7.5, and the gel strength is 100-900 g/cm^2 at a temperature of 20-80°C.例文帳に追加

少なくともメッキ液と、ゲル化剤と、硬さ調整剤と、メッキ表面調整剤とを含有すると共に、ｐＨが２．０〜７．５であり、かつ、温度２０〜８０℃においてゲル強度が１００〜９００ｇ／ｃｍ^２であることを特徴とするゲル状メッキ組成物。 - 特許庁

The Rh-Re alloy plating thin film having the alloy ratio Rh:Re of 1.0:(0.1-1.0) and 0.1-10.0 μ film thickness using a plating bath having a Rh-Re alloy composition prepared by adding Re to a Rh plating bath, is formed.例文帳に追加

Ｒｈめっき浴にＲｅを添加したＲｈ−Ｒｅ合金めっき浴組成とし、当該めっき浴から電解により合金比率Ｒｈ：Ｒｅが１．０：０．１〜１．０、かつ膜厚が０．１〜１０．０ミクロンとなるＲｈ−Ｒｅ合金めっき薄膜を形成する。 - 特許庁

The shields 5 are composed of steel plates with zinc plating, and the rust-proof coating of 1-5 μm composed of the resin composition including polyaniline, dopant and thermosetting resin, is formed on the zinc plating layer.例文帳に追加

このシールド５は亜鉛メッキが施された鋼板からなり、亜鉛メッキ層の上に、ポリアニリンとドーパントと熱硬化性樹脂とを含有する樹脂組成物で構成された厚さ１μｍ以上５μｍ以下の防錆被膜が形成されている。 - 特許庁

To inhibit precipitation during storage and use of an Au-Sn alloy plating solution to retain a constant composition of a plating film and to obtain a wide range of a film thickness.例文帳に追加

Ａｕ−Ｓｎ合金めっき液の保存時、使用時の沈殿を防止し、めっき皮膜の組成を一定に保持すると共に、広範な膜厚に対応可能にする。 - 特許庁

Pseudo whiskers in the tin film are prevented and the appearance of the film can satisfactorily be held by the combination of the control of the film thickness in the plating stage using the first bath and the plating in the second bath different in the composition.例文帳に追加

第１浴を用いたメッキ工程での膜厚制御と、組成の異なる第２浴でのメッキの組み合わせにより、スズ皮膜の疑似ホイスカーを防止し、皮膜外観を良好に保持できる。 - 特許庁

A composition for pretreatment of electroless plating containing palladium acetate and ammonia or an ammonia compound as the main components is used for pretreatment for forming a metal pattern on a layer of polysilane or a substrate by electroless plating.例文帳に追加

酢酸パラジウムとアンモニア又はアンモニア化合物を主成分として含む無電解めっき前処理用組成物を、ポリシランの層または基体へ無電解めっきにより金属パターンを形成する前処理に用いる。 - 特許庁