「insulating resin」に関連した英語例文の一覧と使い方(9ページ目) - Weblio英語例文検索

The socket body 5 and the anisotropic conductive resin layer 7 are insulated with an insulating resin film 6.例文帳に追加

ソケットボデイー５と異方導電性樹脂層７は絶縁樹脂膜６で絶縁化される。 - 特許庁

Moreover, as a material of the insulating resin film 4, a thermosetting epoxy resin, for example, is used.例文帳に追加

また、絶縁樹脂膜４の材料としては、例えば熱硬化性エポキシ樹脂を用いる。 - 特許庁

A conductor reinforcing layer is formed between the sealing resin and the insulating resin layer.例文帳に追加

また、封止樹脂と絶縁樹脂層との間に導体補強層が形成される。 - 特許庁

HEAT DISSIPATIVE URETHANE RESIN COMPOSITION, AND ELECTRICAL AND ELECTRONIC COMPONENT HAVING BEEN SUBJECTED TO INSULATING TREATMENT USING THE RESIN COMPOSITION例文帳に追加

熱放散性ウレタン樹脂組成物および該樹脂組成物を用いて絶縁処理した電気電子部品 - 特許庁

The insulating resin shall be a resin having a bending elasticity after hardening of 2.4 GPa or more.例文帳に追加

絶縁樹脂は、硬化後の曲げ弾性率が２．４ＧＰａ以上の樹脂を用いている。 - 特許庁

The laminated board is formed using the metal foil with resin and the insulating film with resin.例文帳に追加

この樹脂付き金属箔、樹脂付き絶縁性フィルムを用いて積層板を成形する。 - 特許庁

METHOD FOR PRODUCING RESIN FOAM, RESIN FOAM, HEAT INSULATING MATERIAL AND CIRCUIT BOARD MATERIAL例文帳に追加

樹脂発泡体の製造方法、樹脂発泡体、断熱材料並びに回路板用材料 - 特許庁

To provide a method for manufacturing an insulating resin with a copper foil of less generation amount of a resin powder.例文帳に追加

樹脂粉末発生量の少ない銅箔付き絶縁樹脂の製造方法を提供する。 - 特許庁

PHENOLIC RESIN FOAM PLATE, METHOD OF MANUFACTURING THE PHENOLIC RESIN FOAM PLATE, COMPOSITE BOARD AND HEAT INSULATING STRUCTURE例文帳に追加

フェノール樹脂発泡板とその製造方法、複合板、及び断熱構造 - 特許庁

The wiring part 51 includes a base resin 52 composed of an electrically insulating resin and the conductive bodies 55a and 55b.例文帳に追加

配線部５１は、電気絶縁性の樹脂からなるベース樹脂５２と、導体５５ａ，５５ｂとを含んでいる。 - 特許庁

The insulating resin layer 6 is composed of a graft resin and is chemically bonded with the core material particle 4.例文帳に追加

絶縁樹脂層６がグラフト樹脂からなり、かつ芯材粒子４と化学結合している。 - 特許庁

The semiconductor chips 12 are sealed with an insulating resin on the support to form a resin sealing part 30.例文帳に追加

半導体チップ１２を支持体上で絶縁樹脂により封止して封止樹脂部３０を形成する。 - 特許庁

The buried resin portion 9 is made of insulating resin having ≥150°C heat distortion temperature.例文帳に追加

埋設樹脂部９は、熱変形温度１５０°Ｃ以上の絶縁樹脂からなる。 - 特許庁

Conductive resin is coated on a surface of an electrical insulating synthetic resin tube, and coating is formed.例文帳に追加

電気絶縁性の合成樹脂チューブの表面に導電性樹脂を被覆して被膜を形成した。 - 特許庁

An insulating resin 6 is casted into the case 1 so as to mold components inside the case by the cast resin 6.例文帳に追加

ケース１内に絶縁樹脂６を注型し、注型樹脂６によりケース内の部品をモールドする。 - 特許庁

Also, at the opening of the case 4, the conductive resin 5 is covered with an insulating resin 6.例文帳に追加

また、ケース４の開口部において、上記導電性樹脂５を絶縁性樹脂６で覆った。 - 特許庁

On the water-repellent layer 20, the coating resin 30 is formed of an insulating resin.例文帳に追加

また、撥水性樹脂層２０上には、絶縁樹脂により外装樹脂３０を形成する。 - 特許庁

An insulating resin layer of the insulation coated conductive particle whose surface is coated with the insulating resin layer comprising an insulating resin having a carboxyl group is surface-treated with a multifunctional aziridine compound.例文帳に追加

導電粒子の表面がカルボキシル基を有する絶縁性樹脂からなる絶縁性樹脂層で被覆されてなる絶縁被覆導電粒子の当該絶縁性樹脂層を、多官能アジリジン化合物で表面処理する。 - 特許庁

A resin insulating layer 25 of the outermost layer which constitutes a multilayer wiring board is constituted with the same resin insulating material as the resin insulating layer of the inner layer as a main body and includes a silica filler 57.例文帳に追加

多層配線基板を構成する最外層の樹脂絶縁層２５は、内層側の樹脂絶縁層と同じ樹脂絶縁材料を主体として構成されるとともにシリカフィラー５７を含んでいる。 - 特許庁

The thermal expansion rate of both the first resin insulating layer 4 and the second resin insulating layer 5 is selected smaller than that of the metal layers 3, each located on both the sides of the first resin insulating layer 4.例文帳に追加

第１樹脂絶縁層４、第２樹脂絶縁層５ともに、その熱膨張率を、第１樹脂絶縁層４の両面に配置されている金属層３より小さくする。 - 特許庁

Additionally, the coefficients of thermal expansion of both the first resin insulating layer 4 and second resin insulating layer 5 are set to be smaller than that of the metal layers 3 disposed on the both sides of the first resin insulating layer 4.例文帳に追加

加えて、第１樹脂絶縁層４、第２樹脂絶縁層５ともに、その熱膨張率を、第１樹脂絶縁層４の両面に配置されている金属層３より小さくする。 - 特許庁

The capacitor 10 is embedded in the resin interlayer insulating layer 81 by covering the capacitor 10 and the resin interlayer insulating layer 81 in the cured state with the upper layer side resin interlayer insulating layer, in the built-in process.例文帳に追加

内蔵工程では、コンデンサ１０上及び硬化状態の樹脂層間絶縁層８１上に上層側の樹脂層間絶縁層を被覆することにより、コンデンサ１０を樹脂層間絶縁層８１内に埋め込む。 - 特許庁

In addition, the space is also filled with the second insulating resin 7 having the thermal conductivity higher than that of the first insulating resin 6 in view of further closing the space in the rear surface side of the substrate 2 from the first insulating resin 6.例文帳に追加

また、第１の絶縁性樹脂６より熱伝導性の高い第２の絶縁性樹脂７が、第１の絶縁性樹脂６からさらに基板２の裏面側の空間を閉塞するように充填されている。 - 特許庁

Even when the insulating resin 12 penetrates between the metallic substrate 16 and the metal drag 20B, the penetrated insulating resin is retained in the cavity 21 whereby the insulating resin 32 is not adhered to the rear surface of the metal substrate 16.例文帳に追加

金属基板１６と下金型２０Ｂの間に絶縁性樹脂１２が侵入した場合でも、侵入した絶縁性樹脂１２は空洞部２１に貯留されるので、金属基板１６の裏面に絶縁性樹脂３２が付着しない。 - 特許庁

To provide a heat insulating material hardly having the tendency to discolor, foam or opacify a resin when compounded with the resin, and having excellent combination of transmittance and heat insulation; and to provide an heat insulating resin composition obtained by compounding the heat insulating material.例文帳に追加

樹脂に配合したとき、樹脂を着色したり、発泡させたり或いは樹脂を不透明化する傾向がなく、透光性と保温性との組み合わせに優れた保温剤及びこれを配合した保温性樹脂組成物を提供する。 - 特許庁

Moreover, second resin insulating layers 5 with a reinforcing textile filled therein circumferentially contact the perimeters of the metal layers 3 on the both sides of the first resin insulating layer 4, has a thickness the same as or greater than those of the metal layers, and is added to the first resin insulating layer 4.例文帳に追加

さらに、第１樹脂絶縁層４には、両面の金属層３端縁全周に接し、厚みが金属層厚みと同等以上である補強繊維充填第２樹脂絶縁層５を付加する。 - 特許庁

To provide a semiconductor module in which bonding strength between a cooling member and an insulating resin layer is high, thermal resistance between the cooling member and the insulating resin layer is low, and an in-plane film thickness distribution of the insulating resin layer is small, and to provide a method for manufacturing the same.例文帳に追加

冷却部材と絶縁樹脂層との接合が強固で、冷却部材と絶縁樹脂層との間の熱抵抗が小さく、絶縁樹脂層の面内の膜厚分布が小さい半導体モジュールおよび製造方法を提供する。 - 特許庁

To provide an insulating resin film and a micro-pattern forming method on the insulating resin film with excellent mass production aptitude and few material constraint, concerning the insulating resin film of a μ scale micro-pattern.例文帳に追加

μ単位の微細パターンを有する絶縁樹脂フィルムに対して、量産性に優れ、材料の制約が少ない絶縁樹脂フィルム及び絶縁樹脂フィルムの微細パターン形成方法を提供する。 - 特許庁

The wiring substrate 20 has an insulating resin layer 22, a wiring layer 50 provided on the L1 face of the insulating resin layer 22, and a wiring layer 50 provided on the L2 face of the insulating resin layer 22.例文帳に追加

配線基板２０は、絶縁樹脂層２２、絶縁樹脂層２２のＬ１面に設けられた配線層５０、絶縁樹脂層２２のＬ１面に設けられた配線層５０を有する。 - 特許庁

The wiring substrate 20 has an insulating resin layer 22, a wiring layer 50 provided on an L1 face of the insulating resin layer 22, and a wiring layer 60 provided on an L2 face of the insulating resin layer 22.例文帳に追加

配線基板２０は、絶縁樹脂層２２、絶縁樹脂層２２のＬ１面に設けられた配線層５０、絶縁樹脂層２２のＬ２面に設けられた配線層６０を有する。 - 特許庁

In addition, a second insulating resin layer for covering the semiconductor device is formed on the board where the semiconductor device is electrically connected to heat the second insulating resin layer, and at the same time the first insulating resin layer is cured.例文帳に追加

さらに、半導体装置が電気的接続された基板に半導体装置を覆う第２の絶縁樹脂層を形成し、第２の絶縁樹脂層を加熱するとともに第１の絶縁樹脂層を硬化させる。 - 特許庁

Therefore, the roughened layer on the surface of the conductor layer gets into the interlayer resin insulating layer, and an electroplating film follows the interlayer resin insulating layer even if the interlayer resin insulating layer expands or shrinks attendant on surrounding conditions such as heat cycles, moisture absorption or dryness.例文帳に追加

そのため、導体層表面の粗化層が層間樹脂絶縁層に食い込み、ヒートサイクル時や吸湿、乾燥により層間樹脂絶縁層が膨張、収縮しても柔らかい電解めっき膜が追従する。 - 特許庁

In addition, this method also includes an upper resin- made insulating layer forming step of forming a second resin-made insulating layer 9 on the first resin-made insulating layer, and second conductor layer 29 of the cyanogen-treated substrate 41.例文帳に追加

さらに、シアン処理がされた基板４１のうち第１樹脂絶縁層７及び第２導体層２９上に、第２樹脂絶縁層９を形成する上部樹脂絶縁層形成工程を備える。 - 特許庁

The apparatus for inspecting a semiconductor integrated circuit includes an insulating resin supply device and a device for measuring a height of an insulating part 4 which is supplied from the resin supply device and which is made of insulating resin.例文帳に追加

半導体集積回路の検査装置は、絶縁性樹脂供給装置と共に、該絶縁性樹脂供給装置により供給された絶縁性樹脂からなる絶縁部４の高さを測定する高さ測定装置を備えている。 - 特許庁

The viscosity of polymer resin layer is reduced by heating the insulating resin layer 14, the gap 23 is filled with fluidized polymer resin, and the polymer resin is cured, thereby forming the insulating resin layer 14.例文帳に追加

次に、絶縁性樹脂層１４を加熱して高分子樹脂を低粘度化させ、流動化した高分子樹脂で間隙部２３を埋めた後、高分子樹脂を固化させて絶縁性樹脂層１４を形成する。 - 特許庁

EPOXY RESIN COMPOSITION, ITS CURED PRODUCT, RESIN COMPOSITION FOR BUILD-UP FILM INSULATING LAYER, NOVEL PHENOLIC RESIN, AND NOVEL EPOXY RESIN例文帳に追加

エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、新規フェノール樹脂、及び新規エポキシ樹脂 - 特許庁

The laminate is composed of an insulating substrate, the insulating resin layer formed on the insulating substrate and the metal lamellar formed on the insulating resin layer and a metal oxide is provided to the contact interface of the insulating resin layer and the metal lamella and the surface roughness of the contact interface of the insulating resin layer and the metal lamella is below 100 nm.例文帳に追加

絶縁基板と、前記絶縁基板上に形成された絶縁性樹脂層と、前記絶縁性樹脂層上に形成された金属薄膜層とからなる積層体であり、前記絶縁性樹脂層と前記金属薄膜層の接触界面に金属酸化物が存在し、かつ、絶縁性樹脂層と前記金属薄膜層の接触界面の表面粗さが１００ｎｍ未満であることを特徴とする積層体。 - 特許庁

A prepreg, which is impregnated with an electric insulating resin composition having dielectric characteristics better than those of an electric insulating resin composition comprising a relatively inexpensive epoxy resin or the like to be dried, is molded under heating between a prepreg, which is impregnated with the electric insulating resin composition comprising the relatively inexpensive epoxy resin or the like to be dried, and a metal foil to obtain the metal-clad laminated sheet.例文帳に追加

比較的安価なエポキシ樹脂などの電気絶縁樹脂組成物を含浸乾燥させたプリプレグと、金属箔の間に当該電気絶縁樹脂組成物より誘電特性の良好な電気絶縁樹脂組成物を含浸乾燥させたプリプレグを加熱成形し、金属張積層板とする。 - 特許庁

The composite insulating film includes an insulating film 103 (second insulating film) containing an organic silicon borazine resin on an insulating film 102 (first insulating film) containing a siloxane resin formed on a silicon wafer 100 having a silicon base layer provided with a metal wiring layer 101.例文帳に追加

本発明の複合絶縁被膜は、金属配線層１０１が設けられたシリコン基層を有するシリコンウェハ１００上に形成されたシロキサン樹脂を含む絶縁被膜１０２（第１の絶縁被膜）の上に、有機ケイ素ボラジン系樹脂を含む絶縁被膜１０３（第２の絶縁被膜）が被着されたものである。 - 特許庁

The insulating resin with the copper foil is manufactured through a process such that an insulating resin layer is formed on the single surface of the copper foil to form the insulating resin with the copper foil which is, in turn, cut into a necessary size and at least the cut of the insulating resin with the copper foil is treated with a liquid not dissolving the insulating resin with the copper foil.例文帳に追加

銅箔付き絶縁樹脂の製造方法において，銅箔の片面に絶縁樹脂層を形成し，必要なサイズに切断した後に，少なくとも銅箔付き絶縁樹脂の切断部を，前記銅箔付き絶縁樹脂を溶解しない液体にて処理する工程を経ることを特徴とする銅箔付き絶縁樹脂の製造方法。 - 特許庁

The laminate manufacturing method includes the process (1) of forming the insulating resin layer on the insulating substrate, the process (2) of forming the metal membrane on the insulating resin layer and the process (3) of forming the metal oxide to the interface of the metal membrane and the insulating resin layer.例文帳に追加

及び、絶縁基板上に、絶縁性樹脂層を形成する工程（１）と、前記絶縁性樹脂層の上に金属薄膜を形成する工程（２）と、前記金属薄膜と前記絶縁性樹脂層との界面に金属酸化物を形成する工程（３）とを含む積層体の製造方法。 - 特許庁

To provide an insulating substrate made of an electric insulating material containing a polyphenylene ether resin, and a wiring substrate having superior adhesion strength between a wiring conductor embedded in a surface of the insulating substrate and an insulating resin layer such as a solder resist layer and a build-up resin layer etc.例文帳に追加

ポリフェニレンエーテル樹脂を含有する電気絶縁材料から成る絶縁基板および該絶縁基板の表面に埋入された配線導体とソルダーレジスト層やビルドアップ樹脂層等の絶縁樹脂層との密着強度に優れた配線基板を提供すること。 - 特許庁

An insulating resin 13 is laminated on the inner layer conductor circuit 12 on the upper surface of an inner layer resin 11 and coating resin 14 having water repellency is formed and coated on the insulating resin 13.例文帳に追加

内層樹脂１１上面の内層導体回路１２上に絶縁樹脂１３を積層し、絶縁樹脂１３上に撥水性を有するコーティング樹脂１４を被覆形成する。 - 特許庁

Then, through-holes (15V, 15T) penetrating the coating resin 14 are formed in the insulating resin 13 coated by the coating resin 14 and a plated metal 17 is embedded into the through-holes 15 by providing the insulating resin 13 with catalyst 16.例文帳に追加

そして、コーティング樹脂１４を被覆した絶縁樹脂１３に、コーティング樹脂１４を貫通する貫通孔（１５Ｖ，１５Ｔ）を形成し、絶縁樹脂１３に触媒１６を付与して貫通孔１５内にめっき金属１７を埋め込む。 - 特許庁

The resin film is composed of resin produced by mixing one kind or more of insulating resin, e.g. flexible epoxy resin, polyimide resin, polyamide resin, fluororesin, peak resin, and the like.例文帳に追加

前記樹脂フィルムを、可撓性エポキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、フッ素樹脂、ピーク樹脂等の絶縁樹脂のいずれか一種又は二種以上を混合した樹脂製とした。 - 特許庁