「insulating resin」に関連した英語例文の一覧と使い方(10ページ目) - Weblio英語例文検索

Insulating resin is embedded between the circuit conductor units while circuit substrate insulating layers are formed on upper surfaces of the circuit conductor units and the insulating resin.例文帳に追加

回路導体部間に、絶縁性樹脂が埋め込まれていると共に、当該回路導体部及び絶縁性樹脂の上面に、回路基板絶縁層が形成されている。 - 特許庁

A structure 3 in which an insulating layer 2 is formed of an insulating resin 6 is manufactured by integrally laminating at least two or more metallic bodies 1 upon another through the insulating resin 6.例文帳に追加

少なくとも２枚以上の金属体１を絶縁性樹脂６を介して積層一体化することによって、絶縁性樹脂６で絶縁層２が形成された構造体３を作製する。 - 特許庁

FOAMING POLYSTYRENE-BASED COLORED RESIN PARTICLE FOR PRODUCTION OF BUILDING HEAT INSULATING MATERIAL, PRODUCTION METHOD THEREOF, COLORED RESIN PRELIMINARILY FOAMED PARTICLE FOR PRODUCTION OF BUILDING HEAT INSULATING MATERIAL, AND BUILDING HEAT INSULATING MATERIAL例文帳に追加

建築用断熱材製造用発泡性ポリスチレン系着色樹脂粒子とその製造方法、建築用断熱材製造用着色樹脂予備発泡粒子及び建築用断熱材 - 特許庁

The anisotropic conductive adhesive layer 30 contains insulating resin 31 and a plurality of conductive particles 32 dispersed in the insulating resin 31, and at least portions of surfaces of at least some of the conductive particles 32 have insulating property.例文帳に追加

異方性導電接着剤層３０は、絶縁性樹脂３１と、絶縁性樹脂３１中に分散された複数の導電性粒子３２とを含み、導電性粒子３２の少なくとも一部は、表面の少なくとも一部が絶縁性を有する。 - 特許庁

The insulating film is characterized in that it comprises a resin layer which is an organic insulating film obtained by using the varnish for an insulating film, and has a polybenzoxazol resin as a main structure that is prepared through a dehydration-condensation reaction.例文帳に追加

前記絶縁膜用ワニスを用いて得られた有機絶縁膜であって、脱水縮合反応を経て調製された、ポリベンゾオキサゾール樹脂を主構造とする樹脂層からなることを特徴とする絶縁膜。 - 特許庁

The hole is bored in the interlayer insulating film, a film formed of resin substantially having no polar group is formed on the surface of the interlayer insulating film including the hole, and then the resin film is separated from the surface of the insulating film so as to remove deposits from the hole.例文帳に追加

層間絶縁膜に穴部を形成し、穴部を含めて層間絶縁膜表面に、実質的に極性基を有しない樹脂よりなる膜を形成し、ついで樹脂膜を剥離して穴部から付着物を除去する。 - 特許庁

The insulating portion 12 is formed by half cutting a sheath material 6 to leave only the insulating resin layer 9 and the adhesive layer 10 on the inner surface side and cutting off an aluminum foil 8 and an insulating resin layer 7 on the outer surface side.例文帳に追加

絶縁部１２は、外装材６をハーフカットすることにより内面側の絶縁樹脂層９及び粘着層１０のみを残し、アルミ箔８及び外面側の絶縁樹脂層７を切除して形成する。 - 特許庁

To provide a method of manufacturing a wiring board by which Pd, etc., deposited on the exposed portion of a resin-made insulating layer can be removed and, in addition, the adhesive strength between the insulating layer and an upper resin-made insulating layer overlying the layer can be secured.例文帳に追加

樹脂絶縁層の露出部に付着したＰｄ等を除去し、かつ、樹脂絶縁層と上部樹脂絶縁層との密着強度を確保することができる配線基板の製造方法を提供すること。 - 特許庁

Silicone resin is applied so that the resin covers the first insulating layer 8 and extends to the insulating coating 401 of the conductor segments 4, forming a second insulating layer 9.例文帳に追加

また、シリコーン樹脂が第１絶縁層８を覆って導体セグメント４の絶縁被膜４０１に至るように塗布されて第２絶縁層９を形成している。 - 特許庁

This enameled wire 10 has the insulating coating composed of at least two insulating layers around a conductor 11; the outermost insulating layer 14 is formed of a polyamide-imide coating; and a mixed resin insulating layer 13 formed of a mixed resin coating of a polyimide resin and a polyamide-imide resin is formed on the inner layer side of the outermost insulating layer 14.例文帳に追加

本発明に係るエナメル線１０は、導体１１の周りに少なくとも２層の絶縁層で構成される絶縁皮膜を有し、かつ、最外絶縁層１４がポリアミドイミド皮膜で構成されるものであり、最外絶縁層１４の内層側に、ポリイミド樹脂とポリアミドイミド樹脂の混合樹脂皮膜で構成される混合樹脂絶縁層１３を設けたものである。 - 特許庁

In a resin-sealed semiconductor device, having a resin-sealed body 1 and a plurality of lead terminals 2-6 led out of the resin-sealed body 1, there are provided an insulating tube 7 mounted to each of the lead terminals 2-6 and insulating adhesive 8 for bonding the resin-sealed body 1 and the insulating tube 7.例文帳に追加

樹脂封止体(1)と、樹脂封止体(1)から導出された複数のリード端子(2〜6)とを備えた樹脂封止型半導体装置に、リード端子(2〜6)の各々に装着された絶縁性チューブ(7)と、樹脂封止体(1)と絶縁性チューブ(7)とを接着する絶縁性接着剤(8)とを設ける。 - 特許庁

This hot/cold water piping 1 has a single circular pipe-shaped resin pipe 2, a circular pipe-shaped heat insulating material 3 in which the resin pipe 2 is inserted, and a sheath pipe (sheath pipe) 4 in which the resin pipe coated with the heat insulating material, obtained by inserting the resin pipe 2 into the heat insulating material 3, is inserted.例文帳に追加

温冷水配管１は、単管の円管状の樹脂管２と、該樹脂管２が内挿された円管状の断熱材３と、該断熱材３に樹脂管２を内挿してなる断熱材被覆樹脂管を内挿したさや管（鞘管）４とを有する。 - 特許庁

When the liquid insulating resin is applied, spaces between the circuits 1 can easily be mode to fill with the insulating resin, and the spaces between the circuits 1 can be easily filled with the insulating resin also by taking advantage of the flow of the resin, when the half-cured layer 3 is molded by thermal compression.例文帳に追加

液状絶縁樹脂を塗工する際に回路１間に絶縁樹脂を容易に充填させることができる共に半硬化状態の絶縁樹脂層３を加熱加圧成形する際の樹脂の流動で回路１間に絶縁樹脂を容易に充填させることができる。 - 特許庁

The resin molded product includes a conductive member 1 and an insulating resin molded part 2 where a part of the conductive member 1 is buried, a concave part 3 is provided in a part where the conductive member 1 is buried in the insulating resin molded part 2, and the insulating resin molded part 2 is also inserted in the concave part 3.例文帳に追加

導電部材１と、この導電部材１の一部を埋設した絶縁樹脂成形部２とを備え、導電部材１の絶縁樹脂成形部２への埋設部分に凹部３を有し、この凹部３内にも絶縁樹脂成形部２が挿入されている。 - 特許庁

EPOXY RESIN COMPOSITION, ITS CURED PRODUCT, RESIN COMPOSITION FOR BUILD-UP FILM-INSULATING LAYER, AND NEW EPOXY RESIN例文帳に追加

エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、及び新規エポキシ樹脂 - 特許庁

EPOXY RESIN COMPOSITION, ITS CURED PRODUCT, RESIN COMPOSITION FOR BUILD-UP FILM INSULATING LAYER AND NOVEL PHENOLIC RESIN例文帳に追加

エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、及び新規フェノール樹脂 - 特許庁

The insulating resin layer 20 is constituted of a resin composition containing benzocyclobutene resin, granular inorganic filler and an ultraviolet absorbing agent.例文帳に追加

絶縁性樹脂層２０は、ベンゾシクロブテン樹脂と、粒子状の無機充填材と、紫外線吸収剤とを含む樹脂組成物により構成される。 - 特許庁

RESIN COMPOSITION CONTAINING POLYLACTIC ACID RESIN, INSULATING MATERIAL, ELECTRIC WIRE/CABLE USING THE RESIN COMPOSITION, AND ELECTRONIC OR ELECTRICAL EQUIPMENT例文帳に追加

ポリ乳酸樹脂を含む樹脂組成物、絶縁材、それを用いた電線／ケーブルならびに電子又は電気機器 - 特許庁

A metal foil with resin and an insulating film with resin are fabricated using the epoxy resin composition.例文帳に追加

このエポキシ樹脂組成物を用いて樹脂層を形成して樹脂付き金属箔、樹脂付き絶縁性フィルムを作製する。 - 特許庁

A resin housing 70 is formed by resin molding an insulating resin material and insert molding a stator core 40 and a coil 54.例文帳に追加

樹脂ハウジング７０は、絶縁樹脂材を樹脂モールドし、ステータコア４０およびコイル５４をインサート成形して形成されている。 - 特許庁

The insulating varnish comprises a coating film constituting resin and a thermally-decomposable resin which is decomposed at a temperature lower than the baking temperature of the coating film constituting resin.例文帳に追加

絶縁ワニスは、塗膜構成樹脂と、当該塗膜構成樹脂の焼付温度よりも低い温度で分解する熱分解性樹脂とを含む。 - 特許庁

The insulating sheet 10 includes thermosetting resin, such as, epoxy resin and ceramic fine powder filler of thermal conductivity which is kneaded in the thermosetting resin.例文帳に追加

絶縁シート１０は、エポキシ樹脂などの熱硬化性樹脂と、熱硬化性樹脂に混錬された熱伝導性のセラミックス微粉フィラーとを有する。 - 特許庁

A part in which the roughening degree of the insulating resin layers 2 is too large is made smooth, and a degraded resin component and an unhardened resin are removed.例文帳に追加

絶縁樹脂層の粗面化の程度が大きすぎる部分をなだらかにすると共に、劣化した樹脂成分や未硬化樹脂を除去する。 - 特許庁

Furthermore, insulating resin is applied onto the upside of the first resin layer 4 and then dried out, for the formation of a second resin layer 6.例文帳に追加

更に第一の樹脂層４の上面に絶縁樹脂を塗布した後乾燥硬化させて第二の樹脂層６を形成する。 - 特許庁

It is desirable to use a resin which is not stripped off from the inside wall of the pores due to shrinkage at the curing, e.g. silicone resin as the insulating resin.例文帳に追加

絶縁性樹脂は、硬化時の収縮によって孔の内壁から離脱することのない樹脂、例えばシリコーン樹脂が望ましい。 - 特許庁

This reactor includes the core 3 made of a resin mixture composed of magnetic powder and resin, wherein magnetic material powder is distributed in an insulating resin.例文帳に追加

絶縁性樹脂に磁性体の粉末が分散した磁性粉末混合樹脂からなるコア３を備える。 - 特許庁

The resin filler 92 and the hole filler 69 are made of the same resin material as inter-resin-layer insulating layers 33 to 38.例文帳に追加

樹脂充填材９２及び穴埋め材６９は、樹脂層間絶縁層３３〜３８と同じ樹脂材料にて形成される。 - 特許庁

Substantially, the same insulating resin composite is used for a solder resist layer formation resin and resin filler in a through hole.例文帳に追加

ソルダーレジスト層形成樹脂とスルーホール内樹脂充填材に本質的に同じ絶縁性樹脂組成物を用いる。 - 特許庁

HALOGEN-FREE FLAME RETARDANT INSULATING EPOXY RESIN COMPOSITION AND CIRCUIT BOARD COMPRISING INSULATING LAYER FORMED FROM THE SAME例文帳に追加

ハロゲンフリー難燃性絶縁エポキシ樹脂組成物及びそれから形成した絶縁層を含む回路基板 - 特許庁

INSULATING RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD, INSULATING FILM WITH SUPPORT, MULTILAYER PRINTED WIRING BOARD, AND MANUFACTURING METHOD THEREFOR例文帳に追加

多層プリント配線板用絶縁樹脂組成物、支持体付き絶縁フィルム、多層プリント配線板及びその製造方法 - 特許庁

THERMOSETTING INSULATING RESIN COMPOSITION, AND INSULATING FILM WITH SUPPORT, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED WIRING BOARD USING THE SAME例文帳に追加

熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 - 特許庁

A heat insulating layer 12 is formed by laying a heat insulating material 12a such as a polystyrene resin foaming body on a concrete roof backing 11.例文帳に追加

ポリスチレン樹脂発泡体等の断熱材１２ａが、コンクリート製の屋根下地１１に敷設されて断熱層１２が形成される。 - 特許庁

The semiconductor chip 14 is covered over the side from the rear face with an insulating resin 16 for insulating the semiconductor 14 from the exterior.例文帳に追加

半導体チップ１４は、裏面から側面にかけて、半導体チップ１４はその外部から絶縁する絶縁性樹脂１６によって覆われている。 - 特許庁

HEAT BLOCKING AND INSULATING MATERIAL FOR ROOF MADE OF SYNTHETIC RESIN FOAMED MATERIAL AND WORK EXECUTION METHOD OF HEAT BLOCKING AND INSULATING MATERIAL FOR ROOF USING IT例文帳に追加

合成樹脂発泡体製屋根用遮熱・断熱材及びそれを用いた屋根用遮熱・断熱材の施工方法 - 特許庁

Since the container body 1 made of the foamed resin is excellent in heat insulating properties, it can supplement heat insulating effects in which the barrel cover 2 made of the paper board lacks.例文帳に追加

発泡樹脂製の容器本体１は断熱性に優れるため、板紙製の胴部カバー体２に不足している断熱効果を補うことができる。 - 特許庁

POLYIMIDE RESIN COMPOSITION FOR FORMING INSULATING FILM IN SOLAR CELL AND METHOD OF FORMING INSULATING FILM IN SOLAR CELL BY USING THE SAME例文帳に追加

太陽電池内の絶縁膜形成用ポリイミド樹脂組成物及びそれを用いた太陽電池内の絶縁膜形成方法 - 特許庁

In the insulating circuit board 11, explosion preventing means 17 for preventing an explosion caused by the laser welding is provided in the insulating resin substrate 13.例文帳に追加

絶縁回路基板１１は、絶縁樹脂基板１３に、レーザー溶接による爆飛を阻止する爆飛阻止手段１７が設けられている。 - 特許庁

The sealing process is performed by applying the thermosetting resin 3 on the surface of the ceramic insulating layer 1 after heating the ceramic insulating layer.例文帳に追加

この封孔処理方法は、セラミックス絶縁層１を加熱した後、このセラミックス絶縁層１の表面に熱硬化性樹脂３を塗布する。 - 特許庁

EXPANDABLE POLYSTYRENE RESIN PARTICLE FOR HEAT INSULATING MATERIAL TO BE USED UNDER FLOOR OF HOUSE, AND HEAT INSULATING MATERIAL UNDER FLOOR OF HOUSE例文帳に追加

住宅の床下に用いられる断熱材用発泡性ポリスチレン系樹脂粒子及び住宅の床下用断熱材 - 特許庁

EXPANDABLE POLYSTYRENE RESIN PARTICLE FOR HEAT INSULATING MATERIAL USED FOR SUBSTRATE MATERIAL FOR ROOF, AND HEAT INSULATING MATERIAL FOR THE SUBSTRATE MATERIAL FOR ROOF例文帳に追加

屋根用下地材に用いる断熱材用発泡性ポリスチレン系樹脂粒子及び屋根用下地材用断熱材 - 特許庁

INSULATING RESIN COMPOSITION FOR CIRCUIT BOARD, INSULATING SHEET FOR CIRCUIT BOARD, LAMINATED PLATE FOR CIRCUIT BOARD AND METAL-BASED CIRCUIT BOARD例文帳に追加

回路基板用絶縁樹脂組成物、回路基板用絶縁シート、回路基板用積層板及び金属ベース回路基板 - 特許庁

This heat insulating panel is formed by filling heat insulating material 3 formed of foam resin between two sheets of metal plates 1, 2.例文帳に追加

二枚の金属板１、２の間に発泡樹脂からなる断熱材３を充填して形成される断熱パネルに関する。 - 特許庁

The adhesive insulating layer 7 is formed by incorporating inorganic insulating particles 7 and metal or metal coated particles 6 in thermosetting resin.例文帳に追加

接着絶縁粒子７は、無機絶縁粒子７と金属または金属被覆粒子６とが熱硬化性樹脂に含有されて成る。 - 特許庁

An insulating coating layer containing platinum nano colloid and insulating resin is provided on the surface of a holding member 51.例文帳に追加

保持部材５１の表面には、白金ナノコロイドと絶縁性樹脂とを含む絶縁コーティング層を設ける。 - 特許庁

By using the insulating layer consisting of the polyimide-based resin as the insulating layer (30), the element is excellent in weathering ability and reliability.例文帳に追加

素子表面に露出する絶縁層（３０）としてポリイミド系樹脂からなる絶縁層を用いたことで耐候性、信頼性に優れる。 - 特許庁